TW366167U - Pin-fin heat sink - Google Patents
Pin-fin heat sinkInfo
- Publication number
- TW366167U TW366167U TW086220296U TW86220296U TW366167U TW 366167 U TW366167 U TW 366167U TW 086220296 U TW086220296 U TW 086220296U TW 86220296 U TW86220296 U TW 86220296U TW 366167 U TW366167 U TW 366167U
- Authority
- TW
- Taiwan
- Prior art keywords
- pin
- heat sink
- fin heat
- fin
- sink
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/085,232 US5299090A (en) | 1993-06-29 | 1993-06-29 | Pin-fin heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
TW366167U true TW366167U (en) | 1999-08-01 |
Family
ID=22190306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086220296U TW366167U (en) | 1993-06-29 | 1994-04-26 | Pin-fin heat sink |
Country Status (7)
Country | Link |
---|---|
US (1) | US5299090A (zh) |
EP (1) | EP0632498B1 (zh) |
JP (1) | JPH07321259A (zh) |
KR (1) | KR950002008A (zh) |
CA (1) | CA2123287C (zh) |
DE (1) | DE69406201T2 (zh) |
TW (1) | TW366167U (zh) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5390734A (en) * | 1993-05-28 | 1995-02-21 | Lytron Incorporated | Heat sink |
US5533257A (en) * | 1994-05-24 | 1996-07-09 | Motorola, Inc. | Method for forming a heat dissipation apparatus |
US5673177A (en) * | 1995-08-01 | 1997-09-30 | International Business Machines Corporation | Heat sink structure with corrugated wound wire heat conductive elements |
US5696405A (en) * | 1995-10-13 | 1997-12-09 | Lucent Technologies Inc. | Microelectronic package with device cooling |
US6409521B1 (en) | 1997-05-06 | 2002-06-25 | Gryphics, Inc. | Multi-mode compliant connector and replaceable chip module utilizing the same |
EP0889524A3 (en) * | 1997-06-30 | 1999-03-03 | Sun Microsystems, Inc. | Scalable and modular heat sink-heat pipe cooling system |
US5860472A (en) * | 1997-09-03 | 1999-01-19 | Batchelder; John Samual | Fluid transmissive apparatus for heat transfer |
US6026895A (en) * | 1998-02-06 | 2000-02-22 | Fujitsu Limited | Flexible foil finned heatsink structure and method of making same |
US6807059B1 (en) * | 1998-12-28 | 2004-10-19 | James L. Dale | Stud welded pin fin heat sink |
US6572396B1 (en) | 1999-02-02 | 2003-06-03 | Gryphics, Inc. | Low or zero insertion force connector for printed circuit boards and electrical devices |
US6830460B1 (en) | 1999-08-02 | 2004-12-14 | Gryphics, Inc. | Controlled compliance fine pitch interconnect |
WO2001009980A2 (en) * | 1999-08-02 | 2001-02-08 | Gryphics, Inc. | Controlled compliance fine pitch interconnect |
US6957963B2 (en) * | 2000-01-20 | 2005-10-25 | Gryphics, Inc. | Compliant interconnect assembly |
US6939143B2 (en) * | 2000-01-20 | 2005-09-06 | Gryphics, Inc. | Flexible compliant interconnect assembly |
CN1305131C (zh) * | 2000-11-20 | 2007-03-14 | 英特尔公司 | 用于高密度封装应用的高性能的散热器结构 |
US6633484B1 (en) * | 2000-11-20 | 2003-10-14 | Intel Corporation | Heat-dissipating devices, systems, and methods with small footprint |
US6671172B2 (en) | 2001-09-10 | 2003-12-30 | Intel Corporation | Electronic assemblies with high capacity curved fin heat sinks |
US6657862B2 (en) | 2001-09-10 | 2003-12-02 | Intel Corporation | Radial folded fin heat sinks and methods of making and using same |
US6695045B2 (en) * | 2002-03-19 | 2004-02-24 | Mitac Technology Corporation | Bladed heat sink |
US6817405B2 (en) * | 2002-06-03 | 2004-11-16 | International Business Machines Corporation | Apparatus having forced fluid cooling and pin-fin heat sink |
US20040150956A1 (en) * | 2003-01-24 | 2004-08-05 | Robert Conte | Pin fin heat sink for power electronic applications |
TW566838U (en) * | 2003-04-25 | 2003-12-11 | Hon Hai Prec Ind Co Ltd | Heat sink |
WO2005008838A1 (en) * | 2003-07-07 | 2005-01-27 | Gryphics, Inc. | Normally closed zero insertion force connector |
GB2410617A (en) * | 2004-01-07 | 2005-08-03 | Jonathan David Cadd | Tube heatsink |
US7206203B2 (en) * | 2004-06-22 | 2007-04-17 | International Business Machines Corporation | Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins |
GB0511692D0 (en) * | 2005-06-08 | 2005-07-13 | Digital Projection Ltd | Heat transfer apparatus |
US20070215335A1 (en) * | 2006-03-14 | 2007-09-20 | Chun-Chi Chen | Heat sink |
US7644753B2 (en) * | 2006-05-23 | 2010-01-12 | Delphi Technologies, Inc. | Domed heat exchanger (porcupine) |
US8962306B2 (en) | 2006-09-08 | 2015-02-24 | Thermo Fisher Scientific Oy | Instruments and method relating to thermal cycling |
US7463484B2 (en) * | 2007-02-05 | 2008-12-09 | Inventec Corporation | Heatsink apparatus |
US7836939B2 (en) * | 2007-08-01 | 2010-11-23 | Harris Corporation | Non-contacting thermal rotary joint |
CN201336791Y (zh) * | 2008-12-17 | 2009-10-28 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
US8496049B2 (en) * | 2009-04-09 | 2013-07-30 | General Electric Company | Heat sinks with distributed and integrated jet cooling |
US9615482B2 (en) | 2009-12-11 | 2017-04-04 | General Electric Company | Shaped heat sinks to optimize flow |
US10274263B2 (en) | 2009-04-09 | 2019-04-30 | General Electric Company | Method and apparatus for improved cooling of a heat sink using a synthetic jet |
US8776871B2 (en) | 2009-11-19 | 2014-07-15 | General Electric Company | Chassis with distributed jet cooling |
US8695687B2 (en) | 2010-12-10 | 2014-04-15 | Palo Alto Research Center Incorporated | Hybrid pin-fin micro heat pipe heat sink and method of fabrication |
US8659042B2 (en) | 2010-12-21 | 2014-02-25 | Palo Alto Research Center Incorporated | Integrated reflector and thermal spreader and thermal spray fabrication method |
WO2012136579A1 (de) * | 2011-04-04 | 2012-10-11 | Ceramtec Gmbh | Keramische leiterplatte mit al-kühlkörper |
US20130306291A1 (en) * | 2012-05-16 | 2013-11-21 | Chia-Ming Tung | Strip heatsink |
WO2014018852A1 (en) * | 2012-07-27 | 2014-01-30 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University | Cold plate for electronics cooling |
CN103199066A (zh) * | 2013-03-03 | 2013-07-10 | 秦吉忠 | 一种肋线式散热器及制造方法 |
TWI516713B (zh) * | 2013-06-18 | 2016-01-11 | 旭闊系統股份有限公司 | Led照明裝置及其散熱器(二) |
CN104051375A (zh) * | 2014-01-03 | 2014-09-17 | 深圳市核创新照明科技有限公司 | 一种肋线式散热器及其制造方法 |
CN103794579A (zh) * | 2014-02-22 | 2014-05-14 | 秦顺宗 | 一种散热器 |
USD822624S1 (en) | 2016-08-30 | 2018-07-10 | Abl Ip Holding Llc | Heat sink |
DE102016222587A1 (de) * | 2016-11-16 | 2018-05-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wärmetauscherstruktur und Verfahren zu deren Herstellung und Verwendung |
US10415895B2 (en) * | 2016-11-21 | 2019-09-17 | Abl Ip Holding Llc | Heatsink |
USD822626S1 (en) * | 2016-11-21 | 2018-07-10 | Abl Ip Holding Llc | Heatsink |
US11071234B2 (en) * | 2018-10-30 | 2021-07-20 | Board Of Trastees Of The University Of Arkansas | Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3706127A (en) * | 1970-04-27 | 1972-12-19 | Ibm | Method for forming heat sinks on semiconductor device chips |
US4450505A (en) * | 1982-06-09 | 1984-05-22 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
US4479140A (en) * | 1982-06-28 | 1984-10-23 | International Business Machines Corporation | Thermal conduction element for conducting heat from semiconductor devices to a cold plate |
US4508163A (en) * | 1983-01-18 | 1985-04-02 | Aavid Engineering, Inc. | Heat sinks for integrated circuit modules |
SU1163126A1 (ru) * | 1983-06-15 | 1985-06-23 | Проектно-конструкторское бюро электрогидравлики АН УССР | Радиатор дл охлаждени полупроводниковых приборов |
US4712159A (en) * | 1986-04-14 | 1987-12-08 | Thermalloy Incorporated | Heat sink clip assembly |
US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
US5057903A (en) * | 1989-07-17 | 1991-10-15 | Microelectronics And Computer Technology Corporation | Thermal heat sink encapsulated integrated circuit |
US5057909A (en) * | 1990-01-29 | 1991-10-15 | International Business Machines Corporation | Electronic device and heat sink assembly |
US5057908A (en) * | 1990-07-10 | 1991-10-15 | Iowa State University Research Foundation, Inc. | High power semiconductor device with integral heat sink |
US5049981A (en) * | 1990-10-19 | 1991-09-17 | At&T Bell Laboratories | Heat sink for electronic circitry |
US5107330A (en) * | 1990-10-19 | 1992-04-21 | At&T Bell Laboratories | Self-adjusting heat sink design for vlsi packages |
SE467721B (sv) * | 1990-12-20 | 1992-08-31 | Ericsson Telefon Ab L M | Saett att tillverka vaermeoeverfoeringsorgan samt verktyg foer att genomfoera saettet |
-
1993
- 1993-06-29 US US08/085,232 patent/US5299090A/en not_active Expired - Lifetime
-
1994
- 1994-04-26 TW TW086220296U patent/TW366167U/zh unknown
- 1994-05-10 CA CA002123287A patent/CA2123287C/en not_active Expired - Lifetime
- 1994-06-22 EP EP94304526A patent/EP0632498B1/en not_active Expired - Lifetime
- 1994-06-22 DE DE69406201T patent/DE69406201T2/de not_active Expired - Lifetime
- 1994-06-28 KR KR1019940014929A patent/KR950002008A/ko not_active Application Discontinuation
- 1994-06-29 JP JP6146898A patent/JPH07321259A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP0632498A1 (en) | 1995-01-04 |
JPH07321259A (ja) | 1995-12-08 |
US5299090A (en) | 1994-03-29 |
DE69406201D1 (de) | 1997-11-20 |
KR950002008A (ko) | 1995-01-04 |
CA2123287C (en) | 1998-09-15 |
CA2123287A1 (en) | 1994-12-30 |
DE69406201T2 (de) | 1998-02-19 |
EP0632498B1 (en) | 1997-10-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW366167U (en) | Pin-fin heat sink | |
GB2275370B (en) | Heat sink | |
GB2325781B (en) | Heat sink | |
EP0527359A3 (en) | Heat sink | |
GB9505069D0 (en) | Heat sink | |
GB2284937B (en) | Heat sink attachment assembly | |
EP0809779A4 (en) | HEAT SOCKET ARRANGEMENTS | |
EP0616366A3 (en) | Heat sink and associated assembly structure. | |
EP0732741A3 (en) | Heatsink | |
IL108860A0 (en) | Heat sink | |
GB9918815D0 (en) | Heat sink | |
GB2294286A8 (en) | Heat sink mounting structure | |
GB2323434B (en) | Heat sink | |
SG72716A1 (en) | Tape-on heat sink | |
GB9403845D0 (en) | Heat sink | |
GB2270862B (en) | Heat sinks | |
AR244465A1 (es) | Un disipador termico. | |
GB2256526B (en) | Heat sinks | |
AU3330695A (en) | Heat sink | |
KR970006161Y1 (en) | Heat sink | |
GB2286663B (en) | Heat sink block | |
GB9717631D0 (en) | Semiconductor cooling | |
GB9301865D0 (en) | Heat sinks | |
KR950003349U (ko) | 도트(DOT) 프린트헤드의 히트싱크(heat sink) | |
GB9722655D0 (en) | Heat sink |