TW366167U - Pin-fin heat sink - Google Patents

Pin-fin heat sink

Info

Publication number
TW366167U
TW366167U TW086220296U TW86220296U TW366167U TW 366167 U TW366167 U TW 366167U TW 086220296 U TW086220296 U TW 086220296U TW 86220296 U TW86220296 U TW 86220296U TW 366167 U TW366167 U TW 366167U
Authority
TW
Taiwan
Prior art keywords
pin
heat sink
fin heat
fin
sink
Prior art date
Application number
TW086220296U
Other languages
English (en)
Inventor
Kevin James Brady
Charles Cohn
Original Assignee
At & T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Corp filed Critical At & T Corp
Publication of TW366167U publication Critical patent/TW366167U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW086220296U 1993-06-29 1994-04-26 Pin-fin heat sink TW366167U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/085,232 US5299090A (en) 1993-06-29 1993-06-29 Pin-fin heat sink

Publications (1)

Publication Number Publication Date
TW366167U true TW366167U (en) 1999-08-01

Family

ID=22190306

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086220296U TW366167U (en) 1993-06-29 1994-04-26 Pin-fin heat sink

Country Status (7)

Country Link
US (1) US5299090A (zh)
EP (1) EP0632498B1 (zh)
JP (1) JPH07321259A (zh)
KR (1) KR950002008A (zh)
CA (1) CA2123287C (zh)
DE (1) DE69406201T2 (zh)
TW (1) TW366167U (zh)

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US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
US5533257A (en) * 1994-05-24 1996-07-09 Motorola, Inc. Method for forming a heat dissipation apparatus
US5673177A (en) * 1995-08-01 1997-09-30 International Business Machines Corporation Heat sink structure with corrugated wound wire heat conductive elements
US5696405A (en) * 1995-10-13 1997-12-09 Lucent Technologies Inc. Microelectronic package with device cooling
US6409521B1 (en) 1997-05-06 2002-06-25 Gryphics, Inc. Multi-mode compliant connector and replaceable chip module utilizing the same
EP0889524A3 (en) * 1997-06-30 1999-03-03 Sun Microsystems, Inc. Scalable and modular heat sink-heat pipe cooling system
US5860472A (en) * 1997-09-03 1999-01-19 Batchelder; John Samual Fluid transmissive apparatus for heat transfer
US6026895A (en) * 1998-02-06 2000-02-22 Fujitsu Limited Flexible foil finned heatsink structure and method of making same
US6807059B1 (en) * 1998-12-28 2004-10-19 James L. Dale Stud welded pin fin heat sink
US6572396B1 (en) 1999-02-02 2003-06-03 Gryphics, Inc. Low or zero insertion force connector for printed circuit boards and electrical devices
US6830460B1 (en) 1999-08-02 2004-12-14 Gryphics, Inc. Controlled compliance fine pitch interconnect
WO2001009980A2 (en) * 1999-08-02 2001-02-08 Gryphics, Inc. Controlled compliance fine pitch interconnect
US6957963B2 (en) * 2000-01-20 2005-10-25 Gryphics, Inc. Compliant interconnect assembly
US6939143B2 (en) * 2000-01-20 2005-09-06 Gryphics, Inc. Flexible compliant interconnect assembly
CN1305131C (zh) * 2000-11-20 2007-03-14 英特尔公司 用于高密度封装应用的高性能的散热器结构
US6633484B1 (en) * 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
US6671172B2 (en) 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US6657862B2 (en) 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6695045B2 (en) * 2002-03-19 2004-02-24 Mitac Technology Corporation Bladed heat sink
US6817405B2 (en) * 2002-06-03 2004-11-16 International Business Machines Corporation Apparatus having forced fluid cooling and pin-fin heat sink
US20040150956A1 (en) * 2003-01-24 2004-08-05 Robert Conte Pin fin heat sink for power electronic applications
TW566838U (en) * 2003-04-25 2003-12-11 Hon Hai Prec Ind Co Ltd Heat sink
WO2005008838A1 (en) * 2003-07-07 2005-01-27 Gryphics, Inc. Normally closed zero insertion force connector
GB2410617A (en) * 2004-01-07 2005-08-03 Jonathan David Cadd Tube heatsink
US7206203B2 (en) * 2004-06-22 2007-04-17 International Business Machines Corporation Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins
GB0511692D0 (en) * 2005-06-08 2005-07-13 Digital Projection Ltd Heat transfer apparatus
US20070215335A1 (en) * 2006-03-14 2007-09-20 Chun-Chi Chen Heat sink
US7644753B2 (en) * 2006-05-23 2010-01-12 Delphi Technologies, Inc. Domed heat exchanger (porcupine)
US8962306B2 (en) 2006-09-08 2015-02-24 Thermo Fisher Scientific Oy Instruments and method relating to thermal cycling
US7463484B2 (en) * 2007-02-05 2008-12-09 Inventec Corporation Heatsink apparatus
US7836939B2 (en) * 2007-08-01 2010-11-23 Harris Corporation Non-contacting thermal rotary joint
CN201336791Y (zh) * 2008-12-17 2009-10-28 鸿富锦精密工业（深圳）有限公司 散热装置
US8496049B2 (en) * 2009-04-09 2013-07-30 General Electric Company Heat sinks with distributed and integrated jet cooling
US9615482B2 (en) 2009-12-11 2017-04-04 General Electric Company Shaped heat sinks to optimize flow
US10274263B2 (en) 2009-04-09 2019-04-30 General Electric Company Method and apparatus for improved cooling of a heat sink using a synthetic jet
US8776871B2 (en) 2009-11-19 2014-07-15 General Electric Company Chassis with distributed jet cooling
US8695687B2 (en) 2010-12-10 2014-04-15 Palo Alto Research Center Incorporated Hybrid pin-fin micro heat pipe heat sink and method of fabrication
US8659042B2 (en) 2010-12-21 2014-02-25 Palo Alto Research Center Incorporated Integrated reflector and thermal spreader and thermal spray fabrication method
WO2012136579A1 (de) * 2011-04-04 2012-10-11 Ceramtec Gmbh Keramische leiterplatte mit al-kühlkörper
US20130306291A1 (en) * 2012-05-16 2013-11-21 Chia-Ming Tung Strip heatsink
WO2014018852A1 (en) * 2012-07-27 2014-01-30 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Cold plate for electronics cooling
CN103199066A (zh) * 2013-03-03 2013-07-10 秦吉忠 一种肋线式散热器及制造方法
TWI516713B (zh) * 2013-06-18 2016-01-11 旭闊系統股份有限公司 Led照明裝置及其散熱器(二)
CN104051375A (zh) * 2014-01-03 2014-09-17 深圳市核创新照明科技有限公司 一种肋线式散热器及其制造方法
CN103794579A (zh) * 2014-02-22 2014-05-14 秦顺宗 一种散热器
USD822624S1 (en) 2016-08-30 2018-07-10 Abl Ip Holding Llc Heat sink
DE102016222587A1 (de) * 2016-11-16 2018-05-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wärmetauscherstruktur und Verfahren zu deren Herstellung und Verwendung
US10415895B2 (en) * 2016-11-21 2019-09-17 Abl Ip Holding Llc Heatsink
USD822626S1 (en) * 2016-11-21 2018-07-10 Abl Ip Holding Llc Heatsink
US11071234B2 (en) * 2018-10-30 2021-07-20 Board Of Trastees Of The University Of Arkansas Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3706127A (en) * 1970-04-27 1972-12-19 Ibm Method for forming heat sinks on semiconductor device chips
US4450505A (en) * 1982-06-09 1984-05-22 Sperry Corporation Apparatus for cooling integrated circuit chips
US4479140A (en) * 1982-06-28 1984-10-23 International Business Machines Corporation Thermal conduction element for conducting heat from semiconductor devices to a cold plate
US4508163A (en) * 1983-01-18 1985-04-02 Aavid Engineering, Inc. Heat sinks for integrated circuit modules
SU1163126A1 (ru) * 1983-06-15 1985-06-23 Проектно-конструкторское бюро электрогидравлики АН УССР Радиатор дл охлаждени полупроводниковых приборов
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US4849856A (en) * 1988-07-13 1989-07-18 International Business Machines Corp. Electronic package with improved heat sink
US5057903A (en) * 1989-07-17 1991-10-15 Microelectronics And Computer Technology Corporation Thermal heat sink encapsulated integrated circuit
US5057909A (en) * 1990-01-29 1991-10-15 International Business Machines Corporation Electronic device and heat sink assembly
US5057908A (en) * 1990-07-10 1991-10-15 Iowa State University Research Foundation, Inc. High power semiconductor device with integral heat sink
US5049981A (en) * 1990-10-19 1991-09-17 At&T Bell Laboratories Heat sink for electronic circitry
US5107330A (en) * 1990-10-19 1992-04-21 At&T Bell Laboratories Self-adjusting heat sink design for vlsi packages
SE467721B (sv) * 1990-12-20 1992-08-31 Ericsson Telefon Ab L M Saett att tillverka vaermeoeverfoeringsorgan samt verktyg foer att genomfoera saettet

Also Published As

Publication number Publication date
EP0632498A1 (en) 1995-01-04
JPH07321259A (ja) 1995-12-08
US5299090A (en) 1994-03-29
DE69406201D1 (de) 1997-11-20
KR950002008A (ko) 1995-01-04
CA2123287C (en) 1998-09-15
CA2123287A1 (en) 1994-12-30
DE69406201T2 (de) 1998-02-19
EP0632498B1 (en) 1997-10-15

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