TW359855B - Device for treating substrates - Google Patents

Device for treating substrates

Info

Publication number
TW359855B
TW359855B TW086115551A TW86115551A TW359855B TW 359855 B TW359855 B TW 359855B TW 086115551 A TW086115551 A TW 086115551A TW 86115551 A TW86115551 A TW 86115551A TW 359855 B TW359855 B TW 359855B
Authority
TW
Taiwan
Prior art keywords
arrangement
treating substrates
substrate
vapours
lifting
Prior art date
Application number
TW086115551A
Other languages
English (en)
Inventor
Martin Weber
Original Assignee
Steag Micro Tech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Micro Tech Gmbh filed Critical Steag Micro Tech Gmbh
Application granted granted Critical
Publication of TW359855B publication Critical patent/TW359855B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G3/00—Apparatus for cleaning or pickling metallic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Soil Working Implements (AREA)
  • Fixing For Electrophotography (AREA)
  • Weting (AREA)
TW086115551A 1996-11-04 1997-10-21 Device for treating substrates TW359855B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19645425A DE19645425C2 (de) 1996-11-04 1996-11-04 Vorrichtung zum Behandeln von Substraten

Publications (1)

Publication Number Publication Date
TW359855B true TW359855B (en) 1999-06-01

Family

ID=7810611

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086115551A TW359855B (en) 1996-11-04 1997-10-21 Device for treating substrates

Country Status (8)

Country Link
US (1) US6244282B1 (zh)
EP (1) EP0946971B1 (zh)
JP (1) JP3299988B2 (zh)
KR (1) KR100321233B1 (zh)
AT (1) ATE221252T1 (zh)
DE (2) DE19645425C2 (zh)
TW (1) TW359855B (zh)
WO (1) WO1998020522A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW499696B (en) * 1999-04-27 2002-08-21 Tokyo Electron Ltd Processing apparatus and processing method
US7156927B2 (en) * 2002-04-03 2007-01-02 Fsi International, Inc. Transition flow treatment process and apparatus
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4493333A (en) * 1982-11-23 1985-01-15 Interlab, Inc. Corrosion-resistant work transfer system
US5022419A (en) * 1987-04-27 1991-06-11 Semitool, Inc. Rinser dryer system
JPH065671B2 (ja) 1988-04-15 1994-01-19 大日本スクリーン製造株式会社 浸漬式基板処理装置
JPH03258380A (ja) 1990-03-07 1991-11-18 Meisho Kk 有機溶剤を使用した洗浄装置
JPH04157724A (ja) 1990-10-22 1992-05-29 Dan Kagaku:Kk 洗浄装置
JPH05129268A (ja) 1991-10-31 1993-05-25 Fuji Electric Co Ltd ウエーハ洗浄装置
JP2902222B2 (ja) * 1992-08-24 1999-06-07 東京エレクトロン株式会社 乾燥処理装置
JP3239472B2 (ja) 1992-09-04 2001-12-17 ソニー株式会社 洗浄装置の給排気制御方法及び被洗浄物の洗浄方法
JP3200291B2 (ja) * 1993-10-29 2001-08-20 東京エレクトロン株式会社 洗浄装置
JPH07273079A (ja) 1994-03-29 1995-10-20 Tokyo Electron Ltd 洗浄装置
DE19537879C2 (de) * 1994-04-15 1998-04-09 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Behandeln von Substraten
DE4413077C2 (de) * 1994-04-15 1997-02-06 Steag Micro Tech Gmbh Verfahren und Vorrichtung zur chemischen Behandlung von Substraten
DE19546990C2 (de) * 1995-01-05 1997-07-03 Steag Micro Tech Gmbh Anlage zur chemischen Naßbehandlung
DE19637875C2 (de) * 1996-04-17 1999-07-22 Steag Micro Tech Gmbh Anlage zur Naßbehandlung von Substraten
DE19616402C2 (de) * 1996-04-24 2001-11-29 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter

Also Published As

Publication number Publication date
WO1998020522A1 (de) 1998-05-14
KR100321233B1 (ko) 2002-01-19
DE19645425A1 (de) 1998-05-07
DE19645425C2 (de) 2001-02-08
JP2000516532A (ja) 2000-12-12
EP0946971B1 (de) 2002-07-24
KR20000053050A (ko) 2000-08-25
EP0946971A1 (de) 1999-10-06
ATE221252T1 (de) 2002-08-15
DE59707815D1 (de) 2002-08-29
JP3299988B2 (ja) 2002-07-08
US6244282B1 (en) 2001-06-12

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