TW359061B - Selectively filled adhesive film containing a fluxing agent - Google Patents

Selectively filled adhesive film containing a fluxing agent

Info

Publication number
TW359061B
TW359061B TW086119886A TW86119886A TW359061B TW 359061 B TW359061 B TW 359061B TW 086119886 A TW086119886 A TW 086119886A TW 86119886 A TW86119886 A TW 86119886A TW 359061 B TW359061 B TW 359061B
Authority
TW
Taiwan
Prior art keywords
film containing
adhesive film
selectively filled
fluxing agent
agent
Prior art date
Application number
TW086119886A
Other languages
English (en)
Inventor
Daniel R Gamota
Robert W Pennisi
Cynthia M Melton
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of TW359061B publication Critical patent/TW359061B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW086119886A 1997-02-04 1997-12-29 Selectively filled adhesive film containing a fluxing agent TW359061B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/794,826 US5814401A (en) 1997-02-04 1997-02-04 Selectively filled adhesive film containing a fluxing agent

Publications (1)

Publication Number Publication Date
TW359061B true TW359061B (en) 1999-05-21

Family

ID=25163797

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086119886A TW359061B (en) 1997-02-04 1997-12-29 Selectively filled adhesive film containing a fluxing agent

Country Status (4)

Country Link
US (1) US5814401A (zh)
KR (1) KR100475324B1 (zh)
CN (1) CN1097305C (zh)
TW (1) TW359061B (zh)

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DE102013112723A1 (de) 2012-11-27 2014-05-28 Hung-Wen Chang Duale Stecknuß für Kombischraubenschlüssel

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US5985043A (en) * 1997-07-21 1999-11-16 Miguel Albert Capote Polymerizable fluxing agents and fluxing adhesive compositions therefrom
US6017634A (en) * 1997-07-21 2000-01-25 Miguel Albert Capote Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive
US6323062B1 (en) * 1998-04-27 2001-11-27 Alpha Metals, Inc. Wafer coating method for flip chips
JP3702788B2 (ja) * 1998-07-01 2005-10-05 セイコーエプソン株式会社 半導体装置の製造方法
AU2165100A (en) * 1998-12-07 2000-06-26 Dexter Corporation, The Underfill film compositions
US6194788B1 (en) * 1999-03-10 2001-02-27 Alpha Metals, Inc. Flip chip with integrated flux and underfill
EP1100123A1 (en) 1999-11-09 2001-05-16 Corning Incorporated Dip formation of flip-chip solder bumps
JP2001139894A (ja) * 1999-11-15 2001-05-22 Dow Corning Toray Silicone Co Ltd シリコーン系接着性シート、および半導体装置
US6680436B2 (en) 2000-07-12 2004-01-20 Seagate Technology Llc Reflow encapsulant
EP1334513A2 (en) * 2000-11-14 2003-08-13 Henkel Loctite Corporation Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
JP2003077944A (ja) * 2001-06-22 2003-03-14 Nitto Denko Corp 接着フィルム付き半導体ウェハの製造方法
US6582990B2 (en) * 2001-08-24 2003-06-24 International Rectifier Corporation Wafer level underfill and interconnect process
US20030111519A1 (en) * 2001-09-04 2003-06-19 3M Innovative Properties Company Fluxing compositions
US6610559B2 (en) 2001-11-16 2003-08-26 Indium Corporation Of America Integrated void-free process for assembling a solder bumped chip
US20030132513A1 (en) * 2002-01-11 2003-07-17 Motorola, Inc. Semiconductor package device and method
US6739497B2 (en) * 2002-05-13 2004-05-25 International Busines Machines Corporation SMT passive device noflow underfill methodology and structure
US6821878B2 (en) * 2003-02-27 2004-11-23 Freescale Semiconductor, Inc. Area-array device assembly with pre-applied underfill layers on printed wiring board
US20050087883A1 (en) * 2003-10-22 2005-04-28 Advanpack Solutions Pte. Ltd. Flip chip package using no-flow underfill and method of fabrication
US7475964B2 (en) * 2004-08-06 2009-01-13 Hewlett-Packard Development Company, L.P. Electrical contact encapsulation
US8555491B2 (en) * 2007-07-19 2013-10-15 Alpha Metals, Inc. Methods of attaching a die to a substrate
US8420722B2 (en) 2008-07-10 2013-04-16 Electronics And Telecommunications Research Institute Composition and methods of forming solder bump and flip chip using the same
WO2010122757A1 (ja) 2009-04-24 2010-10-28 パナソニック株式会社 半導体パッケージ部品の実装方法と実装構造体
US8070043B1 (en) 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8796133B2 (en) 2012-07-20 2014-08-05 International Business Machines Corporation Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections
US10629557B2 (en) * 2016-12-30 2020-04-21 Intel Corporation Improving mechanical and thermal reliability in varying form factors
CN111885810B (zh) * 2019-05-01 2022-07-26 钰桥半导体股份有限公司 导热线路板及其半导体组体

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US5128746A (en) * 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties
US5136365A (en) * 1990-09-27 1992-08-04 Motorola, Inc. Anisotropic conductive adhesive and encapsulant material
WO1992021150A1 (en) * 1991-05-23 1992-11-26 Motorola, Inc. Integrated circuit chip carrier
US5473512A (en) * 1993-12-16 1995-12-05 At&T Corp. Electronic device package having electronic device boonded, at a localized region thereof, to circuit board

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Publication number Priority date Publication date Assignee Title
DE102013112723A1 (de) 2012-11-27 2014-05-28 Hung-Wen Chang Duale Stecknuß für Kombischraubenschlüssel

Also Published As

Publication number Publication date
CN1097305C (zh) 2002-12-25
KR19980070398A (ko) 1998-10-26
KR100475324B1 (ko) 2006-06-21
CN1190253A (zh) 1998-08-12
US5814401A (en) 1998-09-29

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