TW359002B - Manufacturing method of field oxide insulation cells - Google Patents

Manufacturing method of field oxide insulation cells

Info

Publication number
TW359002B
TW359002B TW086107125A TW86107125A TW359002B TW 359002 B TW359002 B TW 359002B TW 086107125 A TW086107125 A TW 086107125A TW 86107125 A TW86107125 A TW 86107125A TW 359002 B TW359002 B TW 359002B
Authority
TW
Taiwan
Prior art keywords
substrate
oxide layer
layer
oxide
forming
Prior art date
Application number
TW086107125A
Other languages
Chinese (zh)
Inventor
Tzung-Shi Ke
Yun-Ding Hung
Original Assignee
Archtech Telecom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Archtech Telecom Corp filed Critical Archtech Telecom Corp
Priority to TW086107125A priority Critical patent/TW359002B/en
Application granted granted Critical
Publication of TW359002B publication Critical patent/TW359002B/en

Links

Landscapes

  • Local Oxidation Of Silicon (AREA)
  • Semiconductor Memories (AREA)
  • Element Separation (AREA)

Abstract

Manufacturing method of field oxide insulation cells, including the following steps: (a) provision of a substrate, forming the first oxide layer on the substrate; (b) defining a first oxide layer patterns, exposing the substrate, with the substrate without the first oxide layer as the first component sector, including the substrate of the first oxide layer as the second component sector; (c) forming a second oxide layer between the substrate and the first oxide layer; (d) forming a silicon nitride layer on the surface of the second oxide layer; (e) coating of a photoresist layer on the surface of the silicon nitride layer, for defining the patterns of the photoresist for defining on the substrate a plurality of active sectors; (f) removal of the silicon nitride layer the second oxide layer and the first oxide layer with the photoresist as mask, and exposing the substrate and then removal of the photoresist layer; and (g) oxidization to the exposed substrate, for forming a plurality of first oxide layers in the first component sector and a plurality of second oxide layers on the surface of the second component, for completing the making of the field oxide insulation cells.
TW086107125A 1997-05-27 1997-05-27 Manufacturing method of field oxide insulation cells TW359002B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086107125A TW359002B (en) 1997-05-27 1997-05-27 Manufacturing method of field oxide insulation cells

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086107125A TW359002B (en) 1997-05-27 1997-05-27 Manufacturing method of field oxide insulation cells

Publications (1)

Publication Number Publication Date
TW359002B true TW359002B (en) 1999-05-21

Family

ID=57940571

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086107125A TW359002B (en) 1997-05-27 1997-05-27 Manufacturing method of field oxide insulation cells

Country Status (1)

Country Link
TW (1) TW359002B (en)

Similar Documents

Publication Publication Date Title
TW358236B (en) Improved local silicon oxidization method in the manufacture of semiconductor isolation
WO2000014797A3 (en) Isolation region forming methods
TW429419B (en) Method of manufacturing semiconductor devices
EP1388902A3 (en) Fabricating method of Gunn diode
TW343364B (en) Process for producing twin gate oxide elements
TW377489B (en) Manufacturing process of shallow trench isolation area
KR950034585A (en) Method of forming insulating layer on high temperature metal layer
TW359002B (en) Manufacturing method of field oxide insulation cells
EP1237185A3 (en) A method for manufacturing isolating structures
TW333684B (en) The producing method for semiconductor capacitor electrode plate
CA2355614A1 (en) Combination cmp-etch method for forming a thin planar layer over the surface of a device
JPS63133629A (en) Manufacture of integrated circuit device
TW374853B (en) Dry etching method of thin film and method for manufacturing thin film semiconductor device
TW375778B (en) Process for forming rugged polysilicon
JPS6421988A (en) Semiconductor laser device
EP0961320A3 (en) Semiconductor wafer comprising an epitaxial layer and an alignment mark
JPH11329923A5 (en)
JPS642357A (en) Manufacture of semiconductor device
TW358170B (en) Semi-transparent phase shift mask structure and the manufacturing method
TW375776B (en) Process for forming self-aligned twin well region having planar surface
KR960010053B1 (en) Contact manufacturing method of semiconductor device
TW429515B (en) Manufacturing method for forming shallow trench isolation structure
KR20020051406A (en) Method of manufacturing a inductor device
TW357434B (en) Split gate structure having spacer and the manufacturing method
KR960016771B1 (en) Method of manufacturing the isolation elements on the semiconductor device