TW355811B - Programmable lead conditioner - Google Patents

Programmable lead conditioner

Info

Publication number
TW355811B
TW355811B TW084109483A TW84109483A TW355811B TW 355811 B TW355811 B TW 355811B TW 084109483 A TW084109483 A TW 084109483A TW 84109483 A TW84109483 A TW 84109483A TW 355811 B TW355811 B TW 355811B
Authority
TW
Taiwan
Prior art keywords
leads
conditioning
conditioner
electronic component
predetermined number
Prior art date
Application number
TW084109483A
Other languages
English (en)
Inventor
Michael D Glucksman
Weerakiat Wahawisan
Troy D Moore
Paul H Hasten
Dennis M Botkin
E Loveless James
Nmi Antao Joseph
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW355811B publication Critical patent/TW355811B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0421—Feeding with belts or tapes with treatment of the terminal leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0439—Feeding one by one by other means than belts incorporating means for treating the terminal leads only before insertion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW084109483A 1994-07-14 1995-09-12 Programmable lead conditioner TW355811B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/275,162 US5777886A (en) 1994-07-14 1994-07-14 Programmable lead conditioner

Publications (1)

Publication Number Publication Date
TW355811B true TW355811B (en) 1999-04-11

Family

ID=23051125

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084109483A TW355811B (en) 1994-07-14 1995-09-12 Programmable lead conditioner

Country Status (6)

Country Link
US (1) US5777886A (zh)
EP (1) EP0692928B1 (zh)
JP (1) JPH0846110A (zh)
KR (1) KR960005979A (zh)
DE (1) DE69505202T2 (zh)
TW (1) TW355811B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970053283A (ko) * 1995-12-26 1997-07-31 윌리엄 이. 힐러 반도체 패키지 윤곽 측정용 측정 유니트
JPH1012785A (ja) * 1996-06-21 1998-01-16 Nec Corp 表面実装部品リード修正装置
US6155311A (en) * 1997-07-01 2000-12-05 Precision Technologies, Inc. Lead conditioning system
US6734577B2 (en) * 2002-05-16 2004-05-11 Earl R. Holcomb, Jr. Vehicle auxiliary accessory system
JP2009111312A (ja) * 2007-11-01 2009-05-21 Trinc:Kk チップマウンター
US8393066B2 (en) * 2009-02-26 2013-03-12 Lawrence Livermore National Security, Llc Method and system for assembling miniaturized devices
CN104604357B (zh) * 2012-09-10 2017-10-13 富士机械制造株式会社 引脚矫正方法和引脚矫正装置
US11395447B2 (en) 2014-03-10 2022-07-19 Fuji Corporation Tape feeder

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4063347A (en) * 1976-10-01 1977-12-20 Usm Corporation Machine for inserting multi-lead components sequentially
US4387506A (en) * 1981-06-09 1983-06-14 Usm Corporation Component inserting machine
US4450619A (en) * 1981-06-09 1984-05-29 Usm Corporation Component inserting machine
US4705081A (en) * 1986-02-21 1987-11-10 Hewlett-Packard Company System for sensing and forming objects such as leads of electronic components
US5133390A (en) * 1990-11-21 1992-07-28 Microtek Industries, Inc. Tape automated bonding feeder and lead forming apparatus
US5185811A (en) * 1990-12-27 1993-02-09 International Business Machines Corporation Automated visual inspection of electronic component leads prior to placement
US5219404A (en) * 1991-05-20 1993-06-15 Texas Instruments Incorporated Lead conditioner for Quad semiconductor packages
US5487416A (en) * 1991-12-11 1996-01-30 Precision Technologies, Inc. Lead conditioning system for semiconductor devices
US5273081A (en) * 1991-12-11 1993-12-28 Precision Technologies, Inc. Lead conditioning apparatus and method for semiconductor devices
US5406372A (en) * 1993-04-16 1995-04-11 Modular Vision Systems Inc. QFP lead quality inspection system and method

Also Published As

Publication number Publication date
EP0692928A1 (en) 1996-01-17
KR960005979A (ko) 1996-02-23
JPH0846110A (ja) 1996-02-16
DE69505202D1 (de) 1998-11-12
EP0692928B1 (en) 1998-10-07
US5777886A (en) 1998-07-07
DE69505202T2 (de) 1999-03-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees