TW352388B - A process for preparing a phenolic resin molding material containing none or a small amount of free ammonia - Google Patents

A process for preparing a phenolic resin molding material containing none or a small amount of free ammonia

Info

Publication number
TW352388B
TW352388B TW085114816A TW85114816A TW352388B TW 352388 B TW352388 B TW 352388B TW 085114816 A TW085114816 A TW 085114816A TW 85114816 A TW85114816 A TW 85114816A TW 352388 B TW352388 B TW 352388B
Authority
TW
Taiwan
Prior art keywords
selfcuring
phenolic resin
molding material
free ammonia
phenolic
Prior art date
Application number
TW085114816A
Other languages
Chinese (zh)
Inventor
Kuen-Yuan Huang
Hung-Shing Chen
Bing-Lu Peng
Bau-Sheng Hung
Original Assignee
Chang Chun Plastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chang Chun Plastics Co Ltd filed Critical Chang Chun Plastics Co Ltd
Priority to TW085114816A priority Critical patent/TW352388B/en
Application granted granted Critical
Publication of TW352388B publication Critical patent/TW352388B/en

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  • Phenolic Resins Or Amino Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A process for preparing a phenolic resin molding material either containing none of or a small amount of free ammonia comprises the direct crosslinking the selfcuring resol having at least one methylol functional group in one molecule, the non-selfcuring novolacor and other additives without drying, but directly through blending, cooling and granulation to form the phenolic molding material having none of less than 100 ppm free ammonia; in which the ratio of non-selfcuring novolac and the selfcuring resol is =1.0 (where the non-selfcuring phenolic resin % x the mole ratio of (F/P) formaldehyde and phenol reacted with non-selfcuring phenolic resin + the mole ratio of (F/P) formaldehyde and phenol or (F/M) of formaldyhyde and urea or 3 polycyanamide reacted with the selfcuring phenolic resin; the selfcuring resin is phenolic compound, and urea and 3-polycyanamide or their derivatives, and formaldehyde and its derivative will react under the presence of catalyst such as alkali metal, alkali earth oxide, or hydroxide, ammonia and amine compound or amino salt group.
TW085114816A 1996-11-30 1996-11-30 A process for preparing a phenolic resin molding material containing none or a small amount of free ammonia TW352388B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW085114816A TW352388B (en) 1996-11-30 1996-11-30 A process for preparing a phenolic resin molding material containing none or a small amount of free ammonia

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW085114816A TW352388B (en) 1996-11-30 1996-11-30 A process for preparing a phenolic resin molding material containing none or a small amount of free ammonia

Publications (1)

Publication Number Publication Date
TW352388B true TW352388B (en) 1999-02-11

Family

ID=57940046

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085114816A TW352388B (en) 1996-11-30 1996-11-30 A process for preparing a phenolic resin molding material containing none or a small amount of free ammonia

Country Status (1)

Country Link
TW (1) TW352388B (en)

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