TW350980B - Display processing method - Google Patents
Display processing methodInfo
- Publication number
- TW350980B TW350980B TW086111683A TW86111683A TW350980B TW 350980 B TW350980 B TW 350980B TW 086111683 A TW086111683 A TW 086111683A TW 86111683 A TW86111683 A TW 86111683A TW 350980 B TW350980 B TW 350980B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- rotation speed
- deceleration
- display
- injector
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23582996A JP3227595B2 (ja) | 1996-08-20 | 1996-08-20 | 現像処理方法及び現像処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW350980B true TW350980B (en) | 1999-01-21 |
Family
ID=16991884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086111683A TW350980B (en) | 1996-08-20 | 1997-08-14 | Display processing method |
Country Status (5)
Country | Link |
---|---|
US (1) | US5845170A (zh) |
JP (1) | JP3227595B2 (zh) |
KR (1) | KR100387407B1 (zh) |
SG (1) | SG65673A1 (zh) |
TW (1) | TW350980B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8411248B2 (en) | 2004-03-25 | 2013-04-02 | Nikon Corporation | Exposure apparatus and device fabrication method |
US8456610B2 (en) | 2003-04-10 | 2013-06-04 | Nikon Corporation | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US8830443B2 (en) | 2003-04-10 | 2014-09-09 | Nikon Corporation | Environmental system including a transport region for an immersion lithography apparatus |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010034009A (ko) * | 1998-01-09 | 2001-04-25 | 파스타 리미티드 | 선형 현상기 |
JP3445937B2 (ja) * | 1998-06-24 | 2003-09-16 | 東京エレクトロン株式会社 | 多段スピン型基板処理システム |
TW425598B (en) * | 1998-10-30 | 2001-03-11 | Tokyo Electron Ltd | Processing system |
US6092937A (en) * | 1999-01-08 | 2000-07-25 | Fastar, Ltd. | Linear developer |
US6376013B1 (en) | 1999-10-06 | 2002-04-23 | Advanced Micro Devices, Inc. | Multiple nozzles for dispensing resist |
US6796517B1 (en) | 2000-03-09 | 2004-09-28 | Advanced Micro Devices, Inc. | Apparatus for the application of developing solution to a semiconductor wafer |
JP3545676B2 (ja) | 2000-05-10 | 2004-07-21 | 東京エレクトロン株式会社 | 現像処理装置及び現像処理方法 |
JP3824057B2 (ja) * | 2000-09-13 | 2006-09-20 | 東京エレクトロン株式会社 | 液処理装置 |
US6786996B2 (en) | 2001-10-16 | 2004-09-07 | Applied Materials Inc. | Apparatus and method for edge bead removal |
US6708701B2 (en) | 2001-10-16 | 2004-03-23 | Applied Materials Inc. | Capillary ring |
US6770424B2 (en) * | 2002-12-16 | 2004-08-03 | Asml Holding N.V. | Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms |
US7498124B2 (en) * | 2003-09-30 | 2009-03-03 | Tokyo Electron Limited | Sacrificial surfactanated pre-wet for defect reduction in a semiconductor photolithography developing process |
US7031855B2 (en) * | 2004-06-17 | 2006-04-18 | Micrel, Incorporated | Current sense resistor circuit with averaging Kelvin sense features |
US7396412B2 (en) | 2004-12-22 | 2008-07-08 | Sokudo Co., Ltd. | Coat/develop module with shared dispense |
US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
JP5317504B2 (ja) * | 2008-03-24 | 2013-10-16 | 株式会社Sokudo | 現像装置および現像方法 |
JP4780808B2 (ja) * | 2009-02-03 | 2011-09-28 | 東京エレクトロン株式会社 | 現像処理方法及び現像処理装置 |
JP2013115274A (ja) * | 2011-11-29 | 2013-06-10 | Sharp Corp | 半導体装置の製造方法、現像装置、及び半導体装置 |
JP6142839B2 (ja) * | 2014-04-24 | 2017-06-07 | 東京エレクトロン株式会社 | 液処理方法、液処理装置、記憶媒体 |
JP6449752B2 (ja) * | 2014-12-01 | 2019-01-09 | 東京エレクトロン株式会社 | 現像処理方法、コンピュータ記憶媒体及び現像処理装置 |
JP7025872B2 (ja) * | 2016-12-02 | 2022-02-25 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
US10203606B1 (en) * | 2017-11-22 | 2019-02-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for dispensing developer onto semiconductor substrate |
KR102553224B1 (ko) | 2020-07-20 | 2023-07-10 | 세메스 주식회사 | 기판 처리 장치, 그리고 기판 처리 방법 |
CN112965347B (zh) * | 2020-11-12 | 2023-11-03 | 重庆康佳光电科技有限公司 | 晶圆显影装置、方法和晶圆 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2892476B2 (ja) * | 1990-09-14 | 1999-05-17 | 東京エレクトロン株式会社 | 帯状液体ノズル及び液処理装置及び液処理方法 |
KR100230753B1 (ko) * | 1991-01-23 | 1999-11-15 | 도꾜 일렉트론 큐슈리미티드 | 액도포 시스템 |
US5275658A (en) * | 1991-12-13 | 1994-01-04 | Tokyo Electron Limited | Liquid supply apparatus |
US5625433A (en) * | 1994-09-29 | 1997-04-29 | Tokyo Electron Limited | Apparatus and method for developing resist coated on a substrate |
-
1996
- 1996-08-20 JP JP23582996A patent/JP3227595B2/ja not_active Expired - Lifetime
-
1997
- 1997-08-14 TW TW086111683A patent/TW350980B/zh not_active IP Right Cessation
- 1997-08-15 US US08/912,236 patent/US5845170A/en not_active Expired - Fee Related
- 1997-08-18 KR KR1019970039183A patent/KR100387407B1/ko not_active IP Right Cessation
- 1997-08-19 SG SG1997002978A patent/SG65673A1/en unknown
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8456610B2 (en) | 2003-04-10 | 2013-06-04 | Nikon Corporation | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US8810768B2 (en) | 2003-04-10 | 2014-08-19 | Nikon Corporation | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US8830443B2 (en) | 2003-04-10 | 2014-09-09 | Nikon Corporation | Environmental system including a transport region for an immersion lithography apparatus |
US8836914B2 (en) | 2003-04-10 | 2014-09-16 | Nikon Corporation | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US9632427B2 (en) | 2003-04-10 | 2017-04-25 | Nikon Corporation | Environmental system including a transport region for an immersion lithography apparatus |
US9658537B2 (en) | 2003-04-10 | 2017-05-23 | Nikon Corporation | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US9910370B2 (en) | 2003-04-10 | 2018-03-06 | Nikon Corporation | Environmental system including a transport region for an immersion lithography apparatus |
US9977350B2 (en) | 2003-04-10 | 2018-05-22 | Nikon Corporation | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US8411248B2 (en) | 2004-03-25 | 2013-04-02 | Nikon Corporation | Exposure apparatus and device fabrication method |
TWI402893B (zh) * | 2004-03-25 | 2013-07-21 | 尼康股份有限公司 | 曝光方法 |
US10126661B2 (en) | 2004-03-25 | 2018-11-13 | Nikon Corporation | Exposure apparatus and device fabrication method |
Also Published As
Publication number | Publication date |
---|---|
SG65673A1 (en) | 1999-06-22 |
JPH1064802A (ja) | 1998-03-06 |
JP3227595B2 (ja) | 2001-11-12 |
KR100387407B1 (ko) | 2003-10-04 |
US5845170A (en) | 1998-12-01 |
KR19980018735A (ko) | 1998-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |