TW350975B - Method and equipment of processing sample for optical analysis, and method of controlling the equipment thereof in the semiconductor device manufacturing process - Google Patents

Method and equipment of processing sample for optical analysis, and method of controlling the equipment thereof in the semiconductor device manufacturing process

Info

Publication number
TW350975B
TW350975B TW086114635A TW86114635A TW350975B TW 350975 B TW350975 B TW 350975B TW 086114635 A TW086114635 A TW 086114635A TW 86114635 A TW86114635 A TW 86114635A TW 350975 B TW350975 B TW 350975B
Authority
TW
Taiwan
Prior art keywords
equipment
optical analysis
controlling
semiconductor device
manufacturing process
Prior art date
Application number
TW086114635A
Other languages
English (en)
Inventor
Chun-Deuk Lee
Kyoung-Seop Lee
Hyun-Woon Lee
Jung-Keun Lee
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW350975B publication Critical patent/TW350975B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW086114635A 1997-03-07 1997-10-07 Method and equipment of processing sample for optical analysis, and method of controlling the equipment thereof in the semiconductor device manufacturing process TW350975B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970007775A KR100256440B1 (ko) 1997-03-07 1997-03-07 반도체 제조공정 중 광학적 분석용 액적 가공방법, 그리고 그를 위한 설비 및 그의 제어 방법

Publications (1)

Publication Number Publication Date
TW350975B true TW350975B (en) 1999-01-21

Family

ID=19499119

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086114635A TW350975B (en) 1997-03-07 1997-10-07 Method and equipment of processing sample for optical analysis, and method of controlling the equipment thereof in the semiconductor device manufacturing process

Country Status (4)

Country Link
US (1) US6010637A (zh)
JP (1) JP2930573B2 (zh)
KR (1) KR100256440B1 (zh)
TW (1) TW350975B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7410570B2 (en) 2005-12-30 2008-08-12 Industrial Technology Research Institute Separating device

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6536450B1 (en) 1999-07-07 2003-03-25 Semitool, Inc. Fluid heating system for processing semiconductor materials
WO2001002108A1 (en) 1999-07-06 2001-01-11 Semitool, Inc. Fluid heating system for processing semiconductor materials
US6420275B1 (en) * 1999-08-30 2002-07-16 Micron Technology, Inc. System and method for analyzing a semiconductor surface
JP4896899B2 (ja) * 2007-01-31 2012-03-14 東京エレクトロン株式会社 基板処理装置およびパーティクル付着防止方法
JP4936186B2 (ja) * 2008-01-07 2012-05-23 清水建設株式会社 表面汚染度評価方法及び表面汚染度評価装置
US8229719B2 (en) 2009-03-26 2012-07-24 Seiko Epson Corporation Finite element algorithm for solving a fourth order nonlinear lubrication equation for droplet evaporation
US8014986B2 (en) 2009-06-02 2011-09-06 Seiko Epson Corporation Finite difference algorithm for solving lubrication equations with solute diffusion
US8285530B2 (en) 2009-10-15 2012-10-09 Seiko Epson Corporation Upwind algorithm for solving lubrication equations
US8255194B2 (en) 2009-12-02 2012-08-28 Seiko Epson Corporation Judiciously retreated finite element method for solving lubrication equation
US8285526B2 (en) 2009-12-02 2012-10-09 Seiko Epson Corporation Finite difference algorithm for solving slender droplet evaporation with moving contact lines
US8271238B2 (en) 2010-03-23 2012-09-18 Seiko Epson Corporation Finite difference scheme for solving droplet evaporation lubrication equations on a time-dependent varying domain

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0560537A1 (en) * 1992-03-10 1993-09-15 Mds Health Group Limited Apparatus and method for liquid sample introduction
US5540821A (en) * 1993-07-16 1996-07-30 Applied Materials, Inc. Method and apparatus for adjustment of spacing between wafer and PVD target during semiconductor processing
JP3249316B2 (ja) * 1993-12-20 2002-01-21 株式会社東芝 全反射蛍光ｘ線分析が行われる被測定体の表面処理方法
US5730801A (en) * 1994-08-23 1998-03-24 Applied Materials, Inc. Compartnetalized substrate processing chamber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7410570B2 (en) 2005-12-30 2008-08-12 Industrial Technology Research Institute Separating device

Also Published As

Publication number Publication date
JPH10256330A (ja) 1998-09-25
US6010637A (en) 2000-01-04
JP2930573B2 (ja) 1999-08-03
KR100256440B1 (ko) 2000-05-15
KR19980072811A (ko) 1998-11-05

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees