TW347912U - Improved structure for lead frame of IC package - Google Patents

Improved structure for lead frame of IC package

Info

Publication number
TW347912U
TW347912U TW086217716U TW86217716U TW347912U TW 347912 U TW347912 U TW 347912U TW 086217716 U TW086217716 U TW 086217716U TW 86217716 U TW86217716 U TW 86217716U TW 347912 U TW347912 U TW 347912U
Authority
TW
Taiwan
Prior art keywords
package
lead frame
improved structure
improved
lead
Prior art date
Application number
TW086217716U
Other languages
Chinese (zh)
Inventor
Chung-Shing Tz
Rung-Yu Li
Original Assignee
Sampo Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sampo Semiconductor Corp filed Critical Sampo Semiconductor Corp
Priority to TW086217716U priority Critical patent/TW347912U/en
Publication of TW347912U publication Critical patent/TW347912U/en

Links

TW086217716U 1997-10-20 1997-10-20 Improved structure for lead frame of IC package TW347912U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086217716U TW347912U (en) 1997-10-20 1997-10-20 Improved structure for lead frame of IC package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086217716U TW347912U (en) 1997-10-20 1997-10-20 Improved structure for lead frame of IC package

Publications (1)

Publication Number Publication Date
TW347912U true TW347912U (en) 1998-12-11

Family

ID=54638633

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086217716U TW347912U (en) 1997-10-20 1997-10-20 Improved structure for lead frame of IC package

Country Status (1)

Country Link
TW (1) TW347912U (en)

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