TW347911U - Improved structure for lead frame of semiconductor device - Google Patents

Improved structure for lead frame of semiconductor device

Info

Publication number
TW347911U
TW347911U TW086207193U TW86207193U TW347911U TW 347911 U TW347911 U TW 347911U TW 086207193 U TW086207193 U TW 086207193U TW 86207193 U TW86207193 U TW 86207193U TW 347911 U TW347911 U TW 347911U
Authority
TW
Taiwan
Prior art keywords
semiconductor device
lead frame
improved structure
improved
lead
Prior art date
Application number
TW086207193U
Other languages
Chinese (zh)
Inventor
wan-shun Zhou
Original Assignee
wan-shun Zhou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by wan-shun Zhou filed Critical wan-shun Zhou
Priority to TW086207193U priority Critical patent/TW347911U/en
Publication of TW347911U publication Critical patent/TW347911U/en

Links

TW086207193U 1997-05-05 1997-05-05 Improved structure for lead frame of semiconductor device TW347911U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086207193U TW347911U (en) 1997-05-05 1997-05-05 Improved structure for lead frame of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086207193U TW347911U (en) 1997-05-05 1997-05-05 Improved structure for lead frame of semiconductor device

Publications (1)

Publication Number Publication Date
TW347911U true TW347911U (en) 1998-12-11

Family

ID=54638632

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086207193U TW347911U (en) 1997-05-05 1997-05-05 Improved structure for lead frame of semiconductor device

Country Status (1)

Country Link
TW (1) TW347911U (en)

Similar Documents

Publication Publication Date Title
GB9723468D0 (en) Method of semiconductor device fabrication
GB9807784D0 (en) Lead frame structure and semiconductor package using same and fabrication method thereof
EP0723292A3 (en) Semiconductor device
GB2325081B (en) Semiconductor imaging device
GB2323968B (en) Semiconductor device
TW467401U (en) Lead frame and the semiconductor device utilizing the lead frame
GB2323212B (en) Secure semiconductor device
GB2308740B (en) Semiconductor device
GB2290660B (en) Resin-sealed semiconductor device
GB9909182D0 (en) Lead frames for semiconductor devices
GB2303963B (en) Semiconductor device
GB2332301B (en) Semiconductor device
TW347911U (en) Improved structure for lead frame of semiconductor device
TW335218U (en) Semiconductor lead frame
GB2322233B (en) Semi-conductor imaging device
TW347912U (en) Improved structure for lead frame of IC package
SG68064A1 (en) Semiconductor device
GB2304993B (en) Semiconductor device
KR0111796Y1 (en) Semiconductor lead frame
GB2304992B (en) Semiconductor device
KR960025512U (en) Lead frame for semiconductor package
KR960019169U (en) Lead frame for semiconductor package
KR950023962U (en) Lead frame of semiconductor device
KR970050354U (en) Taping device of lead frame
KR980005498U (en) Lead frame for semiconductor package