KR960019169U - Lead frame for semiconductor package - Google Patents
Lead frame for semiconductor packageInfo
- Publication number
- KR960019169U KR960019169U KR2019940029052U KR19940029052U KR960019169U KR 960019169 U KR960019169 U KR 960019169U KR 2019940029052 U KR2019940029052 U KR 2019940029052U KR 19940029052 U KR19940029052 U KR 19940029052U KR 960019169 U KR960019169 U KR 960019169U
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- semiconductor package
- package
- semiconductor
- lead
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
- H01L2224/48996—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/48998—Alignment aids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940029052U KR0137924Y1 (en) | 1994-11-02 | 1994-11-02 | Lead frame for semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940029052U KR0137924Y1 (en) | 1994-11-02 | 1994-11-02 | Lead frame for semiconductor package |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960019169U true KR960019169U (en) | 1996-06-19 |
KR0137924Y1 KR0137924Y1 (en) | 1999-02-18 |
Family
ID=19397232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940029052U KR0137924Y1 (en) | 1994-11-02 | 1994-11-02 | Lead frame for semiconductor package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0137924Y1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190043709A (en) | 2017-10-19 | 2019-04-29 | 강우진 | Construction Method Soft Surface Treatment And Strength of Reinforced Soil Using Waste Aggregates |
-
1994
- 1994-11-02 KR KR2019940029052U patent/KR0137924Y1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0137924Y1 (en) | 1999-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69518935D1 (en) | Semiconductor package | |
KR960012443A (en) | Semiconductor package | |
KR960019169U (en) | Lead frame for semiconductor package | |
KR960025512U (en) | Lead frame for semiconductor package | |
KR960025455U (en) | Semiconductor package | |
KR950023964U (en) | Lead frame for semiconductor package | |
KR960015639U (en) | Lead Frames for Semiconductor Packages | |
KR960019168U (en) | Lead Frames for Semiconductor Packages | |
KR940011119U (en) | Lead frame for semiconductor package | |
KR940006489U (en) | Lead frame for semiconductor package | |
KR980005498U (en) | Lead frame for semiconductor package | |
KR970007708U (en) | Lead frame for semiconductor package | |
KR950004830U (en) | Lead frame for semiconductor package | |
KR970046971U (en) | Lead frame structure for semiconductor package | |
KR980005511U (en) | Lead frame for lead on chip package | |
KR950025931U (en) | Lead frame for semiconductor | |
KR960038760U (en) | Lead Frames for Semiconductor Packages | |
KR930026525U (en) | Lead frame for semiconductor package | |
KR930026526U (en) | Lead frame for semiconductor package | |
KR960025500U (en) | Lead frame heater block structure for semiconductor package | |
KR960006383U (en) | Semiconductor package | |
KR960015635U (en) | Semiconductor package | |
KR960012677U (en) | Semiconductor package | |
KR970046976U (en) | Leadframe Structure for Semiconductor Package | |
KR960019172U (en) | Lead frame of semiconductor package |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application | ||
J201 | Request for trial against refusal decision |
Free format text: TRIAL AGAINST DECISION OF REJECTION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL |
|
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20081027 Year of fee payment: 11 |
|
EXPY | Expiration of term |