KR950023964U - Lead frame for semiconductor package - Google Patents

Lead frame for semiconductor package

Info

Publication number
KR950023964U
KR950023964U KR2019940000409U KR19940000409U KR950023964U KR 950023964 U KR950023964 U KR 950023964U KR 2019940000409 U KR2019940000409 U KR 2019940000409U KR 19940000409 U KR19940000409 U KR 19940000409U KR 950023964 U KR950023964 U KR 950023964U
Authority
KR
South Korea
Prior art keywords
lead frame
semiconductor package
package
semiconductor
lead
Prior art date
Application number
KR2019940000409U
Other languages
Korean (ko)
Other versions
KR970003199Y1 (en
Inventor
백승대
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019940000409U priority Critical patent/KR970003199Y1/en
Publication of KR950023964U publication Critical patent/KR950023964U/en
Application granted granted Critical
Publication of KR970003199Y1 publication Critical patent/KR970003199Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019940000409U 1994-01-12 1994-01-12 Lead frame KR970003199Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940000409U KR970003199Y1 (en) 1994-01-12 1994-01-12 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940000409U KR970003199Y1 (en) 1994-01-12 1994-01-12 Lead frame

Publications (2)

Publication Number Publication Date
KR950023964U true KR950023964U (en) 1995-08-23
KR970003199Y1 KR970003199Y1 (en) 1997-04-14

Family

ID=19375519

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940000409U KR970003199Y1 (en) 1994-01-12 1994-01-12 Lead frame

Country Status (1)

Country Link
KR (1) KR970003199Y1 (en)

Also Published As

Publication number Publication date
KR970003199Y1 (en) 1997-04-14

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20080619

Year of fee payment: 12

EXPY Expiration of term