TW344868B - Process for using silicate glass as silicon integrated circuit doping - Google Patents

Process for using silicate glass as silicon integrated circuit doping

Info

Publication number
TW344868B
TW344868B TW086115341A TW86115341A TW344868B TW 344868 B TW344868 B TW 344868B TW 086115341 A TW086115341 A TW 086115341A TW 86115341 A TW86115341 A TW 86115341A TW 344868 B TW344868 B TW 344868B
Authority
TW
Taiwan
Prior art keywords
silicon substrate
doping
integrated circuit
silicate glass
gate region
Prior art date
Application number
TW086115341A
Other languages
Chinese (zh)
Inventor
Der-Tsyr Fann
Liang-Jiuh Shiah
Chorng-Shiun Jou
Yan-Shiun Wang
Original Assignee
Mos Electronics Taiwan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mos Electronics Taiwan Inc filed Critical Mos Electronics Taiwan Inc
Priority to TW086115341A priority Critical patent/TW344868B/en
Application granted granted Critical
Publication of TW344868B publication Critical patent/TW344868B/en

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Abstract

A process of using a silicate glass (SG) as a silicon integrated circuit doping, which is applicable on a silicon integrated circuit device having a gate oxide and a gate region on a silicon substrate, the process comprising the following steps: (a) exposing a surface of the silicon substrate where a doping is to be carrying out; (b) forming a doped SG layer on the exposed surface of the silicon substrate and the periphery of the gate region; (c) carrying out a thermal diffusion procedure thereby doping and forming a shallow junction region below the surface of the silicon substrate not covered by the gate region; and (d) carrying out an oxidation procedure thereby forming a drive-in stopping oxidation layer at the interfaces between the SG layer and the exposed silicon substrate and the gate region in order to ensure that the shallow junction region will not be affected by the following processes.
TW086115341A 1997-10-17 1997-10-17 Process for using silicate glass as silicon integrated circuit doping TW344868B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086115341A TW344868B (en) 1997-10-17 1997-10-17 Process for using silicate glass as silicon integrated circuit doping

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086115341A TW344868B (en) 1997-10-17 1997-10-17 Process for using silicate glass as silicon integrated circuit doping

Publications (1)

Publication Number Publication Date
TW344868B true TW344868B (en) 1998-11-11

Family

ID=58263780

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086115341A TW344868B (en) 1997-10-17 1997-10-17 Process for using silicate glass as silicon integrated circuit doping

Country Status (1)

Country Link
TW (1) TW344868B (en)

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees