TW343373B - Process for producing a semiconductor component - Google Patents

Process for producing a semiconductor component

Info

Publication number
TW343373B
TW343373B TW086117693A TW86117693A TW343373B TW 343373 B TW343373 B TW 343373B TW 086117693 A TW086117693 A TW 086117693A TW 86117693 A TW86117693 A TW 86117693A TW 343373 B TW343373 B TW 343373B
Authority
TW
Taiwan
Prior art keywords
layer
conductive semiconductor
semiconductor layer
forming
rough surface
Prior art date
Application number
TW086117693A
Other languages
Chinese (zh)
Inventor
Hidetoshi Hagiwara
Original Assignee
Okielectric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okielectric Industry Co Ltd filed Critical Okielectric Industry Co Ltd
Priority to TW086117693A priority Critical patent/TW343373B/en
Application granted granted Critical
Publication of TW343373B publication Critical patent/TW343373B/en

Links

Landscapes

  • Semiconductor Integrated Circuits (AREA)

Abstract

A process for producing a semiconductor component used as a capacitor, which comprises the following steps: forming a plug-shape conductive semiconductor layer on a conductive semiconductor substrate, in which the plug-shape conductive semiconductor layer is surrounded by an insulation layer; forming a semiconductor oxide layer on the insulation layer, the semiconductor oxide layer having an opening located on a position corresponding to the plug-shape conductive semiconductor layer; forming a conductive semiconductor layer and a conductive semiconductor layer with a rough surface on the plug-shape conductive semiconductor layer and the semiconductor oxide layer; forming an etch mask layer on the conductive semiconductor layer with a rough surface; etching back the etch mask layer until exposing the top surface of the conductive semiconductor layer with a rough surface, thereby forming the etch mask layer into an etch mask; contacting the conductive semiconductor layer with a rough surface with an etchant to react with a semiconductor oxide, thereby removing the top surface deposited on the conductive semiconductor layer, and the residual space between the grooves of the conductive semiconductor layer with a rough surface; using the etch mask to etch the conductive semiconductor layer with a rough surface, the conductive semiconductor layer and the semiconductor oxide layer, thereby forming an electrode having a vertical columnar shape, the vertical column having an open top and sealed bottom; forming a dielectric layer at least covering the electrode having a vertical columnar shape; and forming another electrode with a conductive material covering the dielectric layer.
TW086117693A 1997-11-25 1997-11-25 Process for producing a semiconductor component TW343373B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086117693A TW343373B (en) 1997-11-25 1997-11-25 Process for producing a semiconductor component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086117693A TW343373B (en) 1997-11-25 1997-11-25 Process for producing a semiconductor component

Publications (1)

Publication Number Publication Date
TW343373B true TW343373B (en) 1998-10-21

Family

ID=58263651

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086117693A TW343373B (en) 1997-11-25 1997-11-25 Process for producing a semiconductor component

Country Status (1)

Country Link
TW (1) TW343373B (en)

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