TW343241B - Recording paper - Google Patents
Recording paperInfo
- Publication number
- TW343241B TW343241B TW085103779A TW85103779A TW343241B TW 343241 B TW343241 B TW 343241B TW 085103779 A TW085103779 A TW 085103779A TW 85103779 A TW85103779 A TW 85103779A TW 343241 B TW343241 B TW 343241B
- Authority
- TW
- Taiwan
- Prior art keywords
- emulsions
- lies
- layer
- range
- recording layer
- Prior art date
Links
Abstract
A recording paper having a recording layer comprising 100 parts by weight of synthetic silica and 10-100 parts by weight of an aqueous resin or aqueous emulsion selected from polyvinyl alcohol, starch, casein, soybean protein, cellulose derivatives, styrene/acrylic resins, isobutyrene/maleic anhydride resins, acrylic emulsions, vinyl acetate emulsions, vinylidene chloride emulsions, polyester emulsions, styrene/butadiene latex or acrylonitrile/butadiene latex as its principal components, the layer being formed on at least one surface of a base paper and the amount of the layer lying within the range of 0.5-4.0 g/m2 in terms of solids on each surface on which the layer is formed, in which either the critical surface tension of the recording layer surface (γc) lies within the limits 32≰γc≰42 dyne/cm or the contact angle measured using water lies in the range of 100°-120°, or alternatively, the critical surface tension of the recording layer surface (γc) lies within the limits 32≰γc≰42 dyne/cm and the contact angle measured using water lies in the range of 100°-120°.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10062895A JP3150569B2 (en) | 1995-03-31 | 1995-03-31 | Dual-purpose recording paper for inkjet recording and electrophotographic transfer paper |
Publications (1)
Publication Number | Publication Date |
---|---|
TW343241B true TW343241B (en) | 1998-10-21 |
Family
ID=14279109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085103779A TW343241B (en) | 1995-03-31 | 1996-03-27 | Recording paper |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3150569B2 (en) |
TW (1) | TW343241B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9269701B2 (en) | 2012-09-28 | 2016-02-23 | Intel Corporation | Localized high density substrate routing |
US9349703B2 (en) | 2013-09-25 | 2016-05-24 | Intel Corporation | Method for making high density substrate interconnect using inkjet printing |
US9666549B2 (en) | 2013-09-25 | 2017-05-30 | Intel Corporation | Methods for solder for through-mold interconnect |
US9929119B2 (en) | 2012-12-06 | 2018-03-27 | Intel Corporation | High density substrate routing in BBUL package |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2004266919B2 (en) * | 2003-08-26 | 2010-03-04 | Nippon Paper Industries Co., Ltd. | Process for producing inkjet recording medium |
JP2011011492A (en) * | 2009-07-03 | 2011-01-20 | Ricoh Co Ltd | Inkjet recording method |
-
1995
- 1995-03-31 JP JP10062895A patent/JP3150569B2/en not_active Expired - Fee Related
-
1996
- 1996-03-27 TW TW085103779A patent/TW343241B/en not_active IP Right Cessation
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9269701B2 (en) | 2012-09-28 | 2016-02-23 | Intel Corporation | Localized high density substrate routing |
US9679843B2 (en) | 2012-09-28 | 2017-06-13 | Intel Corporation | Localized high density substrate routing |
US10366951B2 (en) | 2012-09-28 | 2019-07-30 | Intel Corporation | Localized high density substrate routing |
US10796988B2 (en) | 2012-09-28 | 2020-10-06 | Intel Corporation | Localized high density substrate routing |
US9929119B2 (en) | 2012-12-06 | 2018-03-27 | Intel Corporation | High density substrate routing in BBUL package |
US10199346B2 (en) | 2012-12-06 | 2019-02-05 | Intel Corporation | High density substrate routing in package |
US10438915B2 (en) | 2012-12-06 | 2019-10-08 | Intel Corporation | High density substrate routing in package |
US10861815B2 (en) | 2012-12-06 | 2020-12-08 | Intel Corporation | High density substrate routing in package |
US11251150B2 (en) | 2012-12-06 | 2022-02-15 | Intel Corporation | High density substrate routing in package |
US9349703B2 (en) | 2013-09-25 | 2016-05-24 | Intel Corporation | Method for making high density substrate interconnect using inkjet printing |
US9666549B2 (en) | 2013-09-25 | 2017-05-30 | Intel Corporation | Methods for solder for through-mold interconnect |
Also Published As
Publication number | Publication date |
---|---|
JP3150569B2 (en) | 2001-03-26 |
JPH08269893A (en) | 1996-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |