TW332898B - Switching device - Google Patents

Switching device

Info

Publication number
TW332898B
TW332898B TW083110100A TW83110100A TW332898B TW 332898 B TW332898 B TW 332898B TW 083110100 A TW083110100 A TW 083110100A TW 83110100 A TW83110100 A TW 83110100A TW 332898 B TW332898 B TW 332898B
Authority
TW
Taiwan
Prior art keywords
switching element
base member
switching device
terminals
semiconductor assembly
Prior art date
Application number
TW083110100A
Other languages
English (en)
Inventor
Toshiki Tatsuta
Original Assignee
Toshiba Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17575881&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW332898(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Toshiba Co Ltd filed Critical Toshiba Co Ltd
Application granted granted Critical
Publication of TW332898B publication Critical patent/TW332898B/zh

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Inverter Devices (AREA)
  • Rectifiers (AREA)
  • Power Conversion In General (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Dc-Dc Converters (AREA)
TW083110100A 1993-11-05 1994-11-02 Switching device TW332898B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5276894A JP2531928B2 (ja) 1993-11-05 1993-11-05 半導体スタック

Publications (1)

Publication Number Publication Date
TW332898B true TW332898B (en) 1998-06-01

Family

ID=17575881

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083110100A TW332898B (en) 1993-11-05 1994-11-02 Switching device

Country Status (9)

Country Link
US (1) US5637918A (zh)
EP (1) EP0652630B1 (zh)
JP (1) JP2531928B2 (zh)
KR (1) KR0149064B1 (zh)
CN (1) CN1039073C (zh)
CA (1) CA2135027C (zh)
DE (1) DE69427629T2 (zh)
FI (1) FI945204A (zh)
TW (1) TW332898B (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3424532B2 (ja) * 1997-11-25 2003-07-07 株式会社日立製作所 電力変換装置
US6822866B2 (en) * 2000-11-03 2004-11-23 Smc Electrical Products Inc. Microdrive
SE525572C2 (sv) * 2002-12-23 2005-03-15 Danaher Motion Stockholm Ab Motordrivenhet av växelriktartyp
JP5346578B2 (ja) * 2005-03-31 2013-11-20 スタッツ・チップパック・リミテッド 半導体アセンブリおよびその作製方法
US7364945B2 (en) 2005-03-31 2008-04-29 Stats Chippac Ltd. Method of mounting an integrated circuit package in an encapsulant cavity
US7354800B2 (en) 2005-04-29 2008-04-08 Stats Chippac Ltd. Method of fabricating a stacked integrated circuit package system
US7394148B2 (en) 2005-06-20 2008-07-01 Stats Chippac Ltd. Module having stacked chip scale semiconductor packages
US7768125B2 (en) 2006-01-04 2010-08-03 Stats Chippac Ltd. Multi-chip package system
US7456088B2 (en) 2006-01-04 2008-11-25 Stats Chippac Ltd. Integrated circuit package system including stacked die
US7750482B2 (en) 2006-02-09 2010-07-06 Stats Chippac Ltd. Integrated circuit package system including zero fillet resin
FI120068B (fi) 2006-04-20 2009-06-15 Abb Oy Sähköinen liitos ja sähkökomponentti
CA2653207A1 (en) * 2006-06-23 2008-01-03 Mitsubishi Electric Corporation Power converter
JP5132175B2 (ja) * 2007-03-28 2013-01-30 三菱電機株式会社 電力変換装置
US7791884B2 (en) * 2008-11-10 2010-09-07 Rockwell Automation Technologies, Inc. Motor drive with heat pipe air cooling
DE202010004699U1 (de) * 2010-04-08 2010-07-22 Danfoss Silicon Power Gmbh Leistungsumrichter
US20130043071A1 (en) * 2011-08-17 2013-02-21 General Electric Company Thermal energy management component and system incorporating the same
US8634193B2 (en) 2011-12-05 2014-01-21 Rockwell Automation Technologies, Inc. Device and method using induction to improve natural convection cooling
JP6067536B2 (ja) * 2013-10-24 2017-01-25 東芝三菱電機産業システム株式会社 電力変換装置
DE102016110847B4 (de) * 2016-06-14 2022-02-17 Auto-Kabel Management Gmbh Leitungsintegrierter Schalter und Verfahren zum Herstellen eines leitungsintegrierten Schalters

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3648121A (en) * 1967-09-06 1972-03-07 Tokyo Shibaura Electric Co A laminated semiconductor structure
JPS62178538U (zh) * 1986-05-02 1987-11-12
DE3900512A1 (de) * 1989-01-10 1990-07-19 Tucker Gmbh Bostik Halbleiterbauelement fuer ein schaltnetzteil
DE3937045A1 (de) * 1989-11-07 1991-05-08 Abb Ixys Semiconductor Gmbh Leistungshalbleitermodul
JPH03216776A (ja) * 1990-01-22 1991-09-24 Mitsubishi Electric Corp 集積回路装置及びそれにより構成されたマイクロプロセッサ
JPH0555793A (ja) * 1991-08-29 1993-03-05 Matsushita Electric Ind Co Ltd 部品装着装置
JPH0715969B2 (ja) * 1991-09-30 1995-02-22 インターナショナル・ビジネス・マシーンズ・コーポレイション マルチチツプ集積回路パツケージ及びそのシステム
WO1994026083A1 (en) * 1993-04-23 1994-11-10 Irvine Sensors Corporation Electronic module comprising a stack of ic chips

Also Published As

Publication number Publication date
JPH07131981A (ja) 1995-05-19
EP0652630A2 (en) 1995-05-10
US5637918A (en) 1997-06-10
CA2135027C (en) 1998-09-22
DE69427629D1 (de) 2001-08-09
DE69427629T2 (de) 2001-10-18
FI945204A0 (fi) 1994-11-04
EP0652630A3 (en) 1997-01-22
CA2135027A1 (en) 1995-05-06
EP0652630B1 (en) 2001-07-04
JP2531928B2 (ja) 1996-09-04
KR0149064B1 (ko) 1998-12-01
CN1039073C (zh) 1998-07-08
CN1108825A (zh) 1995-09-20
FI945204A (fi) 1995-05-06

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent