TW330314B - Method for optimizing the adhesion between extruded material and passive layer - Google Patents
Method for optimizing the adhesion between extruded material and passive layerInfo
- Publication number
- TW330314B TW330314B TW086110477A TW86110477A TW330314B TW 330314 B TW330314 B TW 330314B TW 086110477 A TW086110477 A TW 086110477A TW 86110477 A TW86110477 A TW 86110477A TW 330314 B TW330314 B TW 330314B
- Authority
- TW
- Taiwan
- Prior art keywords
- optimizing
- adhesion
- extruded material
- polyimide
- passive layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1996134845 DE19634845C1 (de) | 1996-08-28 | 1996-08-28 | Verfahren zur Optimierung der Adhäsion zwischen Preßmasse und Passivierungsschicht in einem Kunststoffchipgehäuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW330314B true TW330314B (en) | 1998-04-21 |
Family
ID=7803965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW086110477A TW330314B (en) | 1996-08-28 | 1997-07-23 | Method for optimizing the adhesion between extruded material and passive layer |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE19634845C1 (fr) |
| TW (1) | TW330314B (fr) |
| WO (1) | WO1998009330A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10827645B2 (en) | 2018-08-10 | 2020-11-03 | Giga-Byte Technology Co., Ltd. | Fan expansion card and motherboard module |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999049512A1 (fr) * | 1998-03-20 | 1999-09-30 | Hitachi, Ltd. | Dispositif a semi-conducteur et procede de fabrication associe |
| DE10338078B4 (de) | 2003-08-19 | 2008-10-16 | Infineon Technologies Ag | Halbleiterelement mit verbesserten Haftungseigenschaften der nichtmetallischen Oberflächen und Verfahren zu dessen Herstellung |
| DE10355586B4 (de) * | 2003-11-28 | 2007-09-27 | Infineon Technologies Ag | Chip-on-Chip-Struktur und Verfahren zu deren Herstellung |
| US20110193211A1 (en) * | 2010-02-05 | 2011-08-11 | Qualcomm Incorporated | Surface Preparation of Die for Improved Bonding Strength |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4715941A (en) * | 1986-04-14 | 1987-12-29 | International Business Machines Corporation | Surface modification of organic materials to improve adhesion |
| EP0407585A4 (en) * | 1988-07-15 | 1992-06-10 | Toray Silicone Co. Ltd. | Semiconductor device sealed with resin and a method of producing the same |
| US5219787A (en) * | 1990-07-23 | 1993-06-15 | Microelectronics And Computer Technology Corporation | Trenching techniques for forming channels, vias and components in substrates |
| JP2912712B2 (ja) * | 1991-01-30 | 1999-06-28 | 松下電子工業株式会社 | 半導体装置の製造方法 |
| US5290399A (en) * | 1991-02-05 | 1994-03-01 | Advanced Micro Devices, Inc. | Surface planarizing methods for integrated circuit devices |
| JP2817664B2 (ja) * | 1995-04-24 | 1998-10-30 | 日本電気株式会社 | 半導体装置の製造方法 |
-
1996
- 1996-08-28 DE DE1996134845 patent/DE19634845C1/de not_active Expired - Fee Related
-
1997
- 1997-07-23 TW TW086110477A patent/TW330314B/zh active
- 1997-08-22 WO PCT/DE1997/001830 patent/WO1998009330A1/fr active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10827645B2 (en) | 2018-08-10 | 2020-11-03 | Giga-Byte Technology Co., Ltd. | Fan expansion card and motherboard module |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19634845C1 (de) | 1998-02-26 |
| WO1998009330A1 (fr) | 1998-03-05 |
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