TW328927B - IC card - Google Patents

IC card

Info

Publication number
TW328927B
TW328927B TW085115560A TW85115560A TW328927B TW 328927 B TW328927 B TW 328927B TW 085115560 A TW085115560 A TW 085115560A TW 85115560 A TW85115560 A TW 85115560A TW 328927 B TW328927 B TW 328927B
Authority
TW
Taiwan
Prior art keywords
frame
card
faceplate
face
lock
Prior art date
Application number
TW085115560A
Other languages
English (en)
Inventor
Shigeo Onoda
Katsunori Koshichi
Jun Obuchi
Makoto Oomori
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW328927B publication Critical patent/TW328927B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
    • H05K5/0265—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces of PCMCIA type
    • H05K5/0269—Card housings therefor, e.g. covers, frames, PCB
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/946—Memory card cartridge

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
TW085115560A 1996-03-25 1996-12-17 IC card TW328927B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6794796 1996-03-25
JP8252963A JPH09315062A (ja) 1996-03-25 1996-09-25 Ｉｃカード

Publications (1)

Publication Number Publication Date
TW328927B true TW328927B (en) 1998-04-01

Family

ID=26409174

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085115560A TW328927B (en) 1996-03-25 1996-12-17 IC card

Country Status (4)

Country Link
US (1) US5912806A (zh)
JP (1) JPH09315062A (zh)
KR (1) KR100240367B1 (zh)
TW (1) TW328927B (zh)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6773291B1 (en) 1993-11-12 2004-08-10 Intel Corporation Compliant communications connectors
US7074061B1 (en) 1993-11-12 2006-07-11 Intel Corporation Versatile communications connectors
WO1997047479A1 (fr) * 1996-06-14 1997-12-18 Seiko Epson Corporation Equipement electronique de type carte
US6116962A (en) 1997-11-17 2000-09-12 Xircom Inc Type III PCMCIA card with integrated receptacles for receiving standard communications plugs
JP3192402B2 (ja) * 1998-04-14 2001-07-30 日本圧着端子製造株式会社 Ｐｃカード用フレームキットおよびｐｃカードならびにｐｃカードの製造方法
DE19911990A1 (de) * 1999-03-17 2000-09-28 Trw Automotive Electron & Comp Metallgehäuse, insbesondere für ein Airbag-Steuergerät
US6333860B1 (en) 2000-03-20 2001-12-25 3Com Corporation Emi shield with connector cover extension
JP2002151866A (ja) * 2000-11-14 2002-05-24 Nec Corp 携帯機器の強度アップ実装構造
US6674652B2 (en) 2002-01-29 2004-01-06 3Com Corporation Integrated shield wrap
US6994568B2 (en) * 2004-03-04 2006-02-07 C-One Technology Corporation Portable storage device
US7375975B1 (en) * 2005-10-31 2008-05-20 Amkor Technology, Inc. Enhanced durability memory card
US7367817B1 (en) * 2006-11-09 2008-05-06 Chin-Chun Liu Housing of an electrical card
US9367712B1 (en) 2007-03-01 2016-06-14 Amkor Technology, Inc. High density memory card using folded flex
US7616448B2 (en) * 2007-09-14 2009-11-10 Delphi Technologies, Inc. Wrap-around overmold for electronic assembly
JP5366691B2 (ja) * 2008-07-29 2013-12-11 パナソニック株式会社 保護部材と共に用いる電子機器
KR20100030126A (ko) 2008-09-09 2010-03-18 삼성전자주식회사 메모리 장치 및 그를 포함하는 전자 장치
USD794641S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794644S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794643S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD795261S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
USD794034S1 (en) * 2009-01-07 2017-08-08 Samsung Electronics Co., Ltd. Memory device
USD794642S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD795262S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
KR101232937B1 (ko) * 2010-12-01 2013-02-13 경희대학교 산학협력단 Ｒｆｉｄ 태그가 실장된 바닥재
JP6171402B2 (ja) * 2013-03-01 2017-08-02 セイコーエプソン株式会社 モジュール、電子機器、および移動体
EP2835876A1 (de) * 2013-08-05 2015-02-11 Continental Automotive GmbH Modulgehäuse für elektronische Baugruppe

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2605480B2 (ja) * 1990-10-25 1997-04-30 三菱電機株式会社 Ｉｃカード
JPH06171275A (ja) * 1992-09-29 1994-06-21 Mitsubishi Electric Corp Ｉｃカードおよびその製造方法
US5339222A (en) * 1993-04-06 1994-08-16 The Whitaker Corporation Shielded printed circuit card holder
US5409385A (en) * 1993-10-07 1995-04-25 Genrife Company Limited I/O card and connection mechanism thereof
US5536905A (en) * 1994-04-04 1996-07-16 Motorola, Inc. Self secured housing for electronics

Also Published As

Publication number Publication date
JPH09315062A (ja) 1997-12-09
KR19980023965A (ko) 1998-07-06
US5912806A (en) 1999-06-15
KR100240367B1 (ko) 2000-01-15

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