TW328150B - The method for planarization semiconductor wafer - Google Patents

The method for planarization semiconductor wafer

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Publication number
TW328150B
TW328150B TW085115457A TW85115457A TW328150B TW 328150 B TW328150 B TW 328150B TW 085115457 A TW085115457 A TW 085115457A TW 85115457 A TW85115457 A TW 85115457A TW 328150 B TW328150 B TW 328150B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
deposition layer
layer
planarization
planarization semiconductor
Prior art date
Application number
TW085115457A
Other languages
Chinese (zh)
Inventor
qiu-shan You
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Priority to TW085115457A priority Critical patent/TW328150B/en
Application granted granted Critical
Publication of TW328150B publication Critical patent/TW328150B/en

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Abstract

A method for planarization semiconductor wafer includes the following steps: (a) Provide a semiconductor substrate with non-uniformity surface; (b) Form deposition layer on substrate to fill it into non-uniformity surface; (c) Form photoresist layer with periodic pattern on deposition layer; (d) Use photoresist layer with periodic pattern as mask to etch deposition layer; (e) Proceed CMP step to planarize deposition layer.
TW085115457A 1996-12-13 1996-12-13 The method for planarization semiconductor wafer TW328150B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW085115457A TW328150B (en) 1996-12-13 1996-12-13 The method for planarization semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW085115457A TW328150B (en) 1996-12-13 1996-12-13 The method for planarization semiconductor wafer

Publications (1)

Publication Number Publication Date
TW328150B true TW328150B (en) 1998-03-11

Family

ID=58262405

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085115457A TW328150B (en) 1996-12-13 1996-12-13 The method for planarization semiconductor wafer

Country Status (1)

Country Link
TW (1) TW328150B (en)

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