TW327234B - Scan aligner and method of exposure using the scan aligner - Google Patents

Scan aligner and method of exposure using the scan aligner

Info

Publication number
TW327234B
TW327234B TW086107725A TW86107725A TW327234B TW 327234 B TW327234 B TW 327234B TW 086107725 A TW086107725 A TW 086107725A TW 86107725 A TW86107725 A TW 86107725A TW 327234 B TW327234 B TW 327234B
Authority
TW
Taiwan
Prior art keywords
adjustment plate
exposure
projecting
semiconductor wafer
adjustment
Prior art date
Application number
TW086107725A
Other languages
English (en)
Inventor
Tatsuhiko Togi
Keita Asanuma
Original Assignee
Toshiba Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Co Ltd filed Critical Toshiba Co Ltd
Application granted granted Critical
Publication of TW327234B publication Critical patent/TW327234B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
TW086107725A 1996-06-05 1997-06-05 Scan aligner and method of exposure using the scan aligner TW327234B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14309996A JP3805829B2 (ja) 1996-06-05 1996-06-05 スキャン露光装置およびスキャン露光方法

Publications (1)

Publication Number Publication Date
TW327234B true TW327234B (en) 1998-02-21

Family

ID=15330893

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086107725A TW327234B (en) 1996-06-05 1997-06-05 Scan aligner and method of exposure using the scan aligner

Country Status (3)

Country Link
JP (1) JP3805829B2 (zh)
KR (1) KR100283838B1 (zh)
TW (1) TW327234B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102402140A (zh) * 2010-09-17 2012-04-04 上海微电子装备有限公司 一种对准系统

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3548464B2 (ja) * 1999-09-01 2004-07-28 キヤノン株式会社 露光方法及び走査型露光装置
JP4905617B2 (ja) * 2001-05-28 2012-03-28 株式会社ニコン 露光方法及びデバイス製造方法
US7683351B2 (en) * 2006-12-01 2010-03-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0329312A (ja) * 1989-06-27 1991-02-07 Toshiba Corp 反射型縮小投影露光装置における位置合せ方法およびその装置
JPH04348018A (ja) * 1991-01-14 1992-12-03 Topcon Corp 位置合わせ光学装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102402140A (zh) * 2010-09-17 2012-04-04 上海微电子装备有限公司 一种对准系统
CN102402140B (zh) * 2010-09-17 2014-02-19 上海微电子装备有限公司 一种对准系统

Also Published As

Publication number Publication date
JP3805829B2 (ja) 2006-08-09
KR100283838B1 (ko) 2001-04-02
JPH09326348A (ja) 1997-12-16
KR980005337A (ko) 1998-03-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees