TW323978B - Fixture for work piece - Google Patents

Fixture for work piece

Info

Publication number
TW323978B
TW323978B TW086102035A TW86102035A TW323978B TW 323978 B TW323978 B TW 323978B TW 086102035 A TW086102035 A TW 086102035A TW 86102035 A TW86102035 A TW 86102035A TW 323978 B TW323978 B TW 323978B
Authority
TW
Taiwan
Prior art keywords
work piece
holding plate
fixture
fluid
elastic film
Prior art date
Application number
TW086102035A
Other languages
English (en)
Inventor
Fumihiko Hasegawa
Makoto Kobayashi
Fumio Suzuki
Original Assignee
Mutsubishi Gum Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mutsubishi Gum Kk filed Critical Mutsubishi Gum Kk
Application granted granted Critical
Publication of TW323978B publication Critical patent/TW323978B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW086102035A 1996-02-21 1997-02-20 Fixture for work piece TW323978B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8058299A JPH09225819A (ja) 1996-02-21 1996-02-21 被加工物の保持機構

Publications (1)

Publication Number Publication Date
TW323978B true TW323978B (en) 1998-01-01

Family

ID=13080354

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086102035A TW323978B (en) 1996-02-21 1997-02-20 Fixture for work piece

Country Status (5)

Country Link
US (1) US5913719A (zh)
EP (1) EP0791431A1 (zh)
JP (1) JPH09225819A (zh)
MY (1) MY129950A (zh)
TW (1) TW323978B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11904429B2 (en) 2020-10-13 2024-02-20 Applied Materials, Inc. Substrate polishing apparatus with contact extension or adjustable stop

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100485002B1 (ko) * 1996-02-16 2005-08-29 가부시키가이샤 에바라 세이사꾸쇼 작업물폴리싱장치및방법
WO1999048645A1 (en) * 1998-03-23 1999-09-30 Speedfam-Ipec Corporation Backing pad for workpiece carrier
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6102779A (en) * 1998-06-17 2000-08-15 Speedfam-Ipec, Inc. Method and apparatus for improved semiconductor wafer polishing
US6113466A (en) * 1999-01-29 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for controlling polishing profile in chemical mechanical polishing
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6231428B1 (en) 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
TW467795B (en) * 1999-03-15 2001-12-11 Mitsubishi Materials Corp Wafer transporting device, wafer polishing device and method for making wafers
US6315649B1 (en) * 1999-11-30 2001-11-13 Taiwan Semiconductor Manufacturing Company Ltd Wafer mounting plate for a polishing apparatus and method of using
US6663477B1 (en) * 2000-05-11 2003-12-16 International Business Machines Corporation Complaint membrane for restraining a workpiece and applying uniform pressure during lapping to improve flatness control
US6540590B1 (en) 2000-08-31 2003-04-01 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a rotating retaining ring
US6527625B1 (en) 2000-08-31 2003-03-04 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a soft backed polishing head
US6447368B1 (en) 2000-11-20 2002-09-10 Speedfam-Ipec Corporation Carriers with concentric balloons supporting a diaphragm
US6468131B1 (en) 2000-11-28 2002-10-22 Speedfam-Ipec Corporation Method to mathematically characterize a multizone carrier
US6582277B2 (en) 2001-05-01 2003-06-24 Speedfam-Ipec Corporation Method for controlling a process in a multi-zonal apparatus
JP3970561B2 (ja) * 2001-07-10 2007-09-05 株式会社荏原製作所 基板保持装置及び基板研磨装置
US6790123B2 (en) 2002-05-16 2004-09-14 Speedfam-Ipec Corporation Method for processing a work piece in a multi-zonal processing apparatus
US6846222B2 (en) * 2003-03-04 2005-01-25 Hitachi Global Storage Technologies Netherlands, B.V. Multi-chambered, compliant apparatus for restraining workpiece and applying variable pressure thereto during lapping to improve flatness characteristics of workpiece
JP4374370B2 (ja) * 2006-10-27 2009-12-02 信越半導体株式会社 研磨ヘッド及び研磨装置
JP5807580B2 (ja) 2012-02-15 2015-11-10 信越半導体株式会社 研磨ヘッド及び研磨装置
JP7070502B2 (ja) * 2019-05-16 2022-05-18 信越半導体株式会社 測定装置および研磨ヘッドの選定方法ならびにウエーハの研磨方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
JPH079896B2 (ja) * 1988-10-06 1995-02-01 信越半導体株式会社 研磨装置
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
JPH0569310A (ja) * 1991-04-23 1993-03-23 Mitsubishi Materials Corp ウエーハの鏡面研磨装置
FR2677293A1 (fr) * 1991-06-06 1992-12-11 Commissariat Energie Atomique Machine de polissage a tete support de plaquettes perfectionnee.
JPH05177523A (ja) * 1991-06-06 1993-07-20 Commiss Energ Atom 張設された微小研磨剤小板、および改良されたウエハー支持ヘッドを備えた研磨装置
US5230184A (en) * 1991-07-05 1993-07-27 Motorola, Inc. Distributed polishing head
JP3233664B2 (ja) * 1991-09-13 2001-11-26 土肥 俊郎 デバイス付きウェーハのプラナリゼーションポリッシング方法及びその装置
JP2849533B2 (ja) * 1993-08-18 1999-01-20 長野電子工業株式会社 ウェーハの研磨方法
US5584746A (en) * 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
JP3311116B2 (ja) * 1993-10-28 2002-08-05 株式会社東芝 半導体製造装置
US5643053A (en) * 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
US5449316A (en) * 1994-01-05 1995-09-12 Strasbaugh; Alan Wafer carrier for film planarization
JP3042293B2 (ja) * 1994-02-18 2000-05-15 信越半導体株式会社 ウエーハのポリッシング装置
JP3690837B2 (ja) * 1995-05-02 2005-08-31 株式会社荏原製作所 ポリッシング装置及び方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11904429B2 (en) 2020-10-13 2024-02-20 Applied Materials, Inc. Substrate polishing apparatus with contact extension or adjustable stop
TWI839644B (zh) * 2020-10-13 2024-04-21 美商應用材料股份有限公司 具有接觸延伸件或可調節止動件的基板拋光裝置

Also Published As

Publication number Publication date
US5913719A (en) 1999-06-22
EP0791431A1 (en) 1997-08-27
MY129950A (en) 2007-05-31
JPH09225819A (ja) 1997-09-02

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