TW271503B - Process of adhering plates - Google Patents

Process of adhering plates

Info

Publication number
TW271503B
TW271503B TW084106597A TW84106597A TW271503B TW 271503 B TW271503 B TW 271503B TW 084106597 A TW084106597 A TW 084106597A TW 84106597 A TW84106597 A TW 84106597A TW 271503 B TW271503 B TW 271503B
Authority
TW
Taiwan
Prior art keywords
space
work piece
plate
forming
adhering
Prior art date
Application number
TW084106597A
Other languages
Chinese (zh)
Inventor
Daisaku Kugo
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Application granted granted Critical
Publication of TW271503B publication Critical patent/TW271503B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)

Abstract

A process of adhering plates, which comprises: the step of keeping the work piece; the step of facing the surface of the plate which is required to adhere on the work piece towards the major face of the work piece; the step of housing the work piece and forming a first space which comprises the work piece and the plate; the step of forming a second space in which the plate is clamped corresponding to the first space; the step of forming a lower air pressure for the first space than the second space; the step of pressing and adhering the plate on the major face of the work piece by the difference of air pressure between the second space and the first space.
TW084106597A 1994-10-20 1995-06-26 Process of adhering plates TW271503B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28291294 1994-10-20

Publications (1)

Publication Number Publication Date
TW271503B true TW271503B (en) 1996-03-01

Family

ID=17658728

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084106597A TW271503B (en) 1994-10-20 1995-06-26 Process of adhering plates

Country Status (4)

Country Link
CN (1) CN1130565A (en)
DE (1) DE19528442A1 (en)
SG (1) SG45118A1 (en)
TW (1) TW271503B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19801651A1 (en) * 1998-01-15 1999-07-22 Bayerische Motoren Werke Ag Process for laminating a plastic film on the back of a decorative material to be back-foamed afterwards
DE19957850A1 (en) * 1999-12-01 2001-06-07 Draexlmaier Lisa Gmbh Covering and method of application involves holder with trough, positioner, pressure bell, feeder, ventilation holes
DE102008030927A1 (en) * 2008-07-02 2009-10-22 Robert Bürkle GmbH Method and device for laminating substantially plate-shaped workpieces under pressure and heat
JP5563423B2 (en) * 2010-10-19 2014-07-30 リンテック株式会社 Sheet sticking device and sticking method
CN106537573B (en) * 2015-04-23 2019-05-03 华为技术有限公司 A kind of pressing device and method
CN113382838B (en) * 2019-01-28 2023-04-11 本田技研工业株式会社 Pasting device and pasting method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3626446A1 (en) * 1986-08-05 1988-02-18 Man Technologie Gmbh Process for producing bodies with high surface quality
DE3816835A1 (en) * 1988-05-18 1989-11-30 Bayerische Motoren Werke Ag Profile strip for fastening to a motor vehicle
JPH06323311A (en) * 1993-05-12 1994-11-25 Toshiba Corp Pressure device

Also Published As

Publication number Publication date
DE19528442A1 (en) 1996-05-02
CN1130565A (en) 1996-09-11
SG45118A1 (en) 1998-01-16

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