SG45118A1 - Sheet-bonding method - Google Patents

Sheet-bonding method

Info

Publication number
SG45118A1
SG45118A1 SG1995001568A SG1995001568A SG45118A1 SG 45118 A1 SG45118 A1 SG 45118A1 SG 1995001568 A SG1995001568 A SG 1995001568A SG 1995001568 A SG1995001568 A SG 1995001568A SG 45118 A1 SG45118 A1 SG 45118A1
Authority
SG
Singapore
Prior art keywords
vol
film
workpiece
sheet
bonding method
Prior art date
Application number
SG1995001568A
Inventor
Daisaku Kugou
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of SG45118A1 publication Critical patent/SG45118A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)

Abstract

The method involves mounting a workpiece (1) and a film (2) to be attached to a main surface of the workpiece. A first vol. (20) is formed which is essentially sealed and which contains the vol. between the film and the workpiece. A second vol. (24) is formed opposite the first vol. and the film is placed between the two vol. Atmospheric pressure is set up in the first vol. and is lower than the pressure in the second vol. The film is attached to the main surface of the workpiece by form the film against the main surface using the difference between the pressures in the two vol.
SG1995001568A 1994-10-20 1995-10-16 Sheet-bonding method SG45118A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28291294 1994-10-20

Publications (1)

Publication Number Publication Date
SG45118A1 true SG45118A1 (en) 1998-01-16

Family

ID=17658728

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1995001568A SG45118A1 (en) 1994-10-20 1995-10-16 Sheet-bonding method

Country Status (4)

Country Link
CN (1) CN1130565A (en)
DE (1) DE19528442A1 (en)
SG (1) SG45118A1 (en)
TW (1) TW271503B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19801651A1 (en) * 1998-01-15 1999-07-22 Bayerische Motoren Werke Ag Process for laminating a plastic film on the back of a decorative material to be back-foamed afterwards
DE19957850A1 (en) * 1999-12-01 2001-06-07 Draexlmaier Lisa Gmbh Covering and method of application involves holder with trough, positioner, pressure bell, feeder, ventilation holes
DE102008030927A1 (en) * 2008-07-02 2009-10-22 Robert Bürkle GmbH Method and device for laminating substantially plate-shaped workpieces under pressure and heat
JP5563423B2 (en) * 2010-10-19 2014-07-30 リンテック株式会社 Sheet sticking device and sticking method
WO2016169018A1 (en) * 2015-04-23 2016-10-27 华为技术有限公司 Lamination device and method
US20220168945A1 (en) * 2019-01-28 2022-06-02 Honda Motor Co., Ltd. Bonding apparatus and bonding method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3626446A1 (en) * 1986-08-05 1988-02-18 Man Technologie Gmbh Process for producing bodies with high surface quality
DE3816835A1 (en) * 1988-05-18 1989-11-30 Bayerische Motoren Werke Ag Profile strip for fastening to a motor vehicle
JPH06323311A (en) * 1993-05-12 1994-11-25 Toshiba Corp Pressure device

Also Published As

Publication number Publication date
CN1130565A (en) 1996-09-11
DE19528442A1 (en) 1996-05-02
TW271503B (en) 1996-03-01

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