TW322593B - - Google Patents

Download PDF

Info

Publication number
TW322593B
TW322593B TW86106676A TW86106676A TW322593B TW 322593 B TW322593 B TW 322593B TW 86106676 A TW86106676 A TW 86106676A TW 86106676 A TW86106676 A TW 86106676A TW 322593 B TW322593 B TW 322593B
Authority
TW
Taiwan
Prior art keywords
landmark
corrosion
surrounding
magnet mechanism
magnetic
Prior art date
Application number
TW86106676A
Other languages
English (en)
Chinese (zh)
Original Assignee
Aneruba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aneruba Kk filed Critical Aneruba Kk
Priority to TW86106676A priority Critical patent/TW322593B/zh
Application granted granted Critical
Publication of TW322593B publication Critical patent/TW322593B/zh

Links

Landscapes

  • Physical Vapour Deposition (AREA)
TW86106676A 1997-05-19 1997-05-19 TW322593B (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW86106676A TW322593B (de) 1997-05-19 1997-05-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW86106676A TW322593B (de) 1997-05-19 1997-05-19

Publications (1)

Publication Number Publication Date
TW322593B true TW322593B (de) 1997-12-11

Family

ID=51567156

Family Applications (1)

Application Number Title Priority Date Filing Date
TW86106676A TW322593B (de) 1997-05-19 1997-05-19

Country Status (1)

Country Link
TW (1) TW322593B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414618B (zh) * 2005-08-26 2013-11-11 尼康股份有限公司 A holding device, an assembling system, a sputtering device, and a processing method and a processing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414618B (zh) * 2005-08-26 2013-11-11 尼康股份有限公司 A holding device, an assembling system, a sputtering device, and a processing method and a processing device

Similar Documents

Publication Publication Date Title
US6440282B1 (en) Sputtering reactor and method of using an unbalanced magnetron
KR100321536B1 (ko) 자전관스퍼터링또는자전관에칭용쌍극자고리자석
TW486718B (en) High-density plasma source for ionized metal deposition
JP4025193B2 (ja) プラズマ生成装置、それを有するエッチング装置およびイオン物理蒸着装置、プラズマにエネルギを誘導結合するｒｆコイルおよびプラズマ生成方法
EP1230666B1 (de) Plasmabehandlungsvorrichtung und -verfahren
KR100450380B1 (ko) 박막형성장치 및 박막형성방법
JP5554047B2 (ja) プラズマ処理装置
TW564495B (en) Plasma treatment apparatus
CN102859028A (zh) 使用远程等离子体源的介电沉积
US20110056912A1 (en) Plasma processing apparatus and plasma processing method
JP2005019968A (ja) 高密度プラズマ処理装置
TW201536944A (zh) 磁控濺鍍腔室及磁控濺鍍裝置
JP2005509747A (ja) プラズマスパッタリング用回転マグネトロンを組み合わせたマグネットアレイ
JP2002536556A (ja) イオン化金属堆積用高密度プラズマ源
JPH028365A (ja) スパッター被覆装置
US20050224344A1 (en) Plasma processing apparatus and method
US7922865B2 (en) Magnetic field generator for magnetron plasma, and plasma etching apparatus and method comprising the magnetic field generator
US8617363B2 (en) Magnetron sputtering apparatus
CN101142094A (zh) 磁控管溅射室上的分离磁体环
TW322593B (de)
WO2009154213A1 (ja) マグネトロンスパッタ方法及びマグネトロンスパッタ装置
US20130160950A1 (en) Plasma processing apparatus
US6045672A (en) Sputtering apparatus
JP2012204582A (ja) プラズマ処理装置
KR20010052285A (ko) 스퍼터링 장치 및 마그네트론 유닛

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees