TW320585B - - Google Patents

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Publication number
TW320585B
TW320585B TW085111784A TW85111784A TW320585B TW 320585 B TW320585 B TW 320585B TW 085111784 A TW085111784 A TW 085111784A TW 85111784 A TW85111784 A TW 85111784A TW 320585 B TW320585 B TW 320585B
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Taiwan
Prior art keywords
image
optical system
aforementioned
processing
light
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TW085111784A
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Chinese (zh)
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Mitsubishi Electric Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • B23K26/389Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/12Copper or alloys thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/16Composite materials, e.g. fibre reinforced
    • B23K2103/166Multilayered materials
    • B23K2103/172Multilayered materials wherein at least one of the layers is non-metallic
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G03F7/2006Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means

Description

經濟部中央揉準局員工消費合作社印裝 320585 Α7 Β7 五、發明説明(3 ) »明所鼷夕抟術翎_ 本發明為有鼷利用配線基板等加工之雷射加工裝置者 〇 以注之雷射加工裝置僅有使用《擇將雷射光束聚光後 在光束的焦點位置上進行加工•或在雷射光束傅送路徑上 插入屏蔽(lask)並使該屏蔽的像鑲小成像於加工面上而以 預定的光束直徑進行加工之任一方式之加工機。 _27表示為多曆印刷基板之剖視。多饜印刷基板是 Μ樹脂使印刷基板絕緣而Μ多層簠叠所構成。要將某一層 與其他1的配媒部份(銅萡)¾接時·於基板上開設作為停 止孔之盲孔(blind viahole)lS)t穿孔的通孔(through Λ hole)而將孔的_面啤加金鼷霣鑲 > 鞴此連接臛間的配鑲 部份。盲孔及通孔的孔徑是由於霣子零件插装密度的高密 度化而形成更小之孔徑•在最近則必須形成直徑大約數百 W·的孔徑•且必須在一 Η基板中同時進行不同孔徑的加 工。而形成大約如上述之孔徑時•傅统的讚孔加工困雞而 必須使用S射加工。此外•«著印刷基板的多靨化而形成 必須在一 Η基板中闻時進行不同孔深的甯孔加工。 又,由於多曆印刷基板配繚之高密度化而同樣必須以 雷射光學進行切斷加工。 在Μ雷射光束准行微小孔加工時,必須將笛射光束聚 焦於該加工孔徑的大小•而其方法有以下之2種方法。H a»使S射光束聚黑之方法(Μ下稱聚光光學糸統)·及在 --------c裝— (請先閱讀背面之注意事項再填寫本頁) 訂Printed and printed by the Ministry of Economic Affairs, Central Bureau of Accreditation and Employee's Consumer Cooperatives 320585 Α7 Β7 V. Description of the invention (3) »Mingsuo Zhixi Xuanzhuling_ This invention is for laser processing devices that have processed by using wiring boards etc. The laser processing device only uses "selectively condensing the laser beam to process at the focal position of the beam" or inserting a shield in the laser beam path and making the image of the shield small for imaging It is a processing machine of any method for processing on the surface with a predetermined beam diameter. _27 is a cross-sectional view of a multi-calendar printed circuit board. The multi-layer printed circuit board is composed of M resin insulating the printed circuit board and M multi-layered stack. To connect a certain layer to the other media part (copper), open a blind via hole (through hole Λ hole) as a stop hole on the substrate and connect the hole _Noodle beer plus gold 鹣 霣 > This connects the fitting part of the room. The diameters of blind holes and through holes are smaller because of the higher density of the insertion density of the ear parts. Recently, it is necessary to form an aperture with a diameter of about several hundred W. Processing of apertures. When forming an aperture approximately as described above, Fu Tong ’s Zankong processing must use S-shot processing. In addition, it is necessary to carry out the processing of different holes with different hole depths when the printed circuit board is formed into multiple layers. In addition, due to the high density of printed circuit board arrangements for multiple calendars, it is also necessary to perform the cutting process with laser optics. When the ML laser beam is processed in a quasi-small hole, the whistle beam must be focused on the size of the processing aperture. There are two methods below. H a »The method of condensing the S beam to black (hereafter referred to as the condensing optics system) · and installed in -------- c— (please read the precautions on the back before filling in this page)

I 本紙浪尺度適用中國國家揉準(CNS ) Α4规格(210Χ 297公釐) 3 3 8 437 32G5S5 A7 經濟部中央標準局貝工消費合作社印製 B7五、發明説明(4 ) 、 雷射光光程中(傅送路徑)設置屏蔽(lask)而拜透鏑使屏蔽 的像》小成像於加工面的方法(以下稱像轉射光學系铳)。 其次,說明聚光光學糸統及像轉射光學糸絞如下。 28表示習知之聚光光學系铳圓。聚光光學糸统是利 用透鏡將笛射光束聚焦後在雷射光束焦黏位置的附近加工 。此時,為了提高雷射光束的聚光性,有使用除去_29所 示笛射光束像差成份之空間濾波器(spacial filter)之情 形。 _28中* 1為笛射振邇器、2為雷射光束、5為聚光光 學糸統、6為XY工作台、7為被加工物、8為反射鏑、9為HC 裝置。將5之聚光光學系统表示於匪29。II中,51為《鏡 、52為特空間波器、53為聚光透鏞。空間濾波器52係將透 鏡51的聚焦位置•即光束放置於傅里Μ變換(Fourier transfor·)的位置上。特殊濾波器52係可除去光束之像差 成份而提高光束的聚光性能•例如詳佃說明於Walter Koechner, "Sol id- State Laser Engineering" .Springer-Verlag,1992,pp.174-180之中。 其次•說明其動作如下。 從雷射振»器1發出的雷射光束是利用逋鑪51傅里葉 變捵於空間濾波器52上•空間濾波器52僅雷射光束之空間 頻率的低頻率成份可穿透。而藉著空間濾波器52除去像差 成份的光束是利用聚光鳙53聚光於被加工物7的面上。 在HC装置9的記憧裝置上記馕有複數龌加工條件•即 笛射输出等的條件•而可選揮對應被加工物7的材«、板 (請先閲讀背面之注意事項再填寫本瓦) 裝·I This paper wave scale is applicable to China National Standard (CNS) Α4 specification (210Χ 297 mm) 3 3 8 437 32G5S5 A7 Printed by the Beigong Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs B. V. Invention description (4), laser light path The method of setting the shield (lask) in the middle (Fu transmission path) and using dysprosium to make the shielded image "small" on the processing surface (hereinafter referred to as the image conversion optical system). Next, the condensing optical system and the image conversion optical system will be explained as follows. 28 denotes the conventionally known condensing optics system. Condensing optics systems use a lens to focus the flute beam and process it near the laser beam focal point. At this time, in order to improve the condensing property of the laser beam, there is a case where a spatial filter (spacial filter) which removes the aberration component of the flared beam shown by _29 is used. In _28, * 1 is a whistle vibrator, 2 is a laser beam, 5 is a condensing optics system, 6 is an XY table, 7 is a workpiece, 8 is a reflective dysprosium, and 9 is an HC device. The condensing optical system of 5 is shown in Bandit 29. In II, 51 is a mirror, 52 is a special space wave device, and 53 is a condensing light-transmissive Yong. The spatial filter 52 places the focus position of the lens 51, that is, the beam at the position of Fourier Transform. The special filter 52 can remove the aberration component of the light beam and improve the light focusing performance. For example, it is described in Walter Koechner, " Sol id- State Laser Engineering ". Springer-Verlag, 1992, pp. 174-180 in. Next, explain the operation as follows. The laser beam emitted from the laser vibrator 1 is transformed into the spatial filter 52 by the Fourier transform of the furnace 51. The spatial filter 52 can penetrate only the low-frequency components of the spatial frequency of the laser beam. On the other hand, the light beam whose aberration component is removed by the spatial filter 52 is condensed on the surface of the object 7 by the condenser 53. On the memory device of HC device 9, it is recorded that there are multiple processing conditions for naan • conditions such as flute output • optional materials corresponding to the object 7 to be processed «, board (please read the precautions on the back before filling in this tile ) Outfit

、1T h 本紙张尺度適用中國國家梯準(CNS ) A4规格(210X 297公釐) 4 3 8 4 3 7 經濟部中央標準局員工消費合作杜印袈 A7 ΒΊ 五、發明説明(5 ) 厚、加工形狀等最遍當條件*並據Μ控制振搬器1 、ΧΥ工 作台6等。 _30是表示習知像轉射光學糸統圈。在雷射光束的傅 送路徑上設置屏蔽Uask),以透_將屏蔽的銷孔(pin hole)像缩小成像於加工面上*鞴屏蔽在加工面上獲得規 定直徑的雷射光束。 圈30中· 1為笛射振》器、2為雷射光束、3為像縛射 光學糸統、6為XY工作台、7為被加工物、8為反射鏡、9為 NC装置。將3之像轉射光學糸统表示於圈31中。31為透嫌 、32為屏蔽、33為透嫌。屏蔽32輿透鏡33與被加工物7的 位置闞係是以某一倍率使屏蔽的像成像被加工物7上的位 置闢偽是以某一倍率使屏蔽的像成像被加工物7上的位置 Μ係。針對上述之成像為例如在K.Iizuka,” Engineering Optics ".Springer-Verlag,1985,pp.145-164 中有詳细的 說明。 其次,說明’其動作如下。 從雷射振盪器1發出的雷射光束是藉著入射於像轉射 光學系统3之透《31聚光而照射在屏蔽32上。該聚光偽照 射於小直徑之屏蔽而可降低其能量損失者。透遴屏蔽32的 光束是從«鏡33以某一鏞小倍率使_蔽的像成像於被加工 物7面上。 在NC装置9之記憶裝置上記愐有複数加工條件•即 雷射_出等的條件·可理擇對應被加工物7的材質、板厚 、加工形成之最應當條件而據以控W振撤器1、XY工作台 本紙悵尺度適用f國國家梯準(CNS ) A4规格(210X 297公釐) 5 38437 --------------------IT------^.i- (請先閲讀背面之注意事項再填窍本頁) 經濟部中夬標準局員工消費合作社印製 A7 B7 五、發明説明(6 ) :: 6等。 又在像_射光學系絞中準備複數個不間的屏蘐賴此使 被加工物7上光束直徑發生變化*而要使被加工物7上之光 束直徑變化時則交換屏蔽。 Μ雷射光束進行»小加工時之里要#數為最小臨界孔 徑R及最大歯界孔深DOF 。最小臨界孔徑R與最大臨界孔深 DO Ρ偽形成如下式。、 1T h The paper standard is applicable to China National Standard (CNS) A4 specification (210X 297mm) 4 3 8 4 3 7 Employee consumption cooperation of the Central Bureau of Standards of the Ministry of Economic Affairs Du Yinhua A7 ΒΊ V. Description of invention (5) Thick, The most common conditions such as machining shape * and control of the vibrator 1 and X table 6 etc. according to M. _30 indicates the conventional image conversion optical system circle. Set a shield Uask on the laser beam transmission path to reduce the image of the shielded pin hole image on the processing surface. * The shield shield obtains a laser beam of a specified diameter on the processing surface. In circle 30, 1 is a flute laser device, 2 is a laser beam, 3 is an image-bound optical system, 6 is an XY table, 7 is a workpiece, 8 is a mirror, and 9 is an NC device. The image conversion optical system of the image 3 is shown in the circle 31. 31 is transparent, 32 is shielding, 33 is transparent. The position of the shield 32 and the lens 33 and the processed object 7 is to image the shielded image at a certain magnification on the position of the processed object 7 M series. The imaging for the above is described in detail in, for example, K. Iizuka, "Engineering Optics ". Springer-Verlag, 1985, pp. 145-164. Secondly, the description is as follows. The action is as follows. The laser beam is irradiated on the shield 32 by condensing the light 31 incident on the image conversion optical system 3. The light condensing is irradiated on the small-diameter shield to reduce the energy loss. The shield 32 The light beam is from the «mirror 33 with a small magnification to image the masked image on the surface of the object to be processed 7. On the memory device of the NC device 9, the complex processing conditions are recorded. According to the material, thickness, and processing conditions of the object 7 to be processed, it is possible to control the W vibrator 1, the XY table, and the paper size scale is applicable to the national standard of China (CNS) A4 specification (210X 297 Mm) 5 38437 -------------------- IT ------ ^. I- (please read the precautions on the back first and then fill in this page) A7 B7 printed by the Employee Consumer Cooperative of the Central Bureau of Standards and Economics of the Ministry of Economic Affairs 5. Description of the invention (6) :: 6 etc. In order to prepare a number of non-stop screens in the _radiation system The beam diameter on the object 7 changes * and the shielding is exchanged when the beam diameter on the object 7 changes. ΜLaser beams are used for small processing. ## is the minimum critical aperture R and the maximum margin The depth of hole DOF. The minimum critical hole diameter R and the maximum critical hole depth DO P are pseudo-formed as follows.

R = k 1 X λ x F D0F = k2 x λ x (ΡΛ2) 在此.F = D/f。 D為透鏡有效直涇、f為透縝之焦點距離、λ為雷射光的波 長、Icl、k2為被加工物7的材質及笛射光束的狀戆•即可 «像差的量或撗式Uode)等決定其值等。以聚光光畢系统 及像轉射光學系統比較kl、k2之值時形成如下。但是設定 該等為相同之被加工物7的材霣•且具有枏同之光束狀態 者。 kl(聚光光學系統)> kl (像轉射光學系统) k2(聚光光學系統)> k2(像轉射光學糸統) 亦即, R(聚光光學系统)>R(像轉射光學系统) D0M聚光光學系統)>D0F(像轉射光畢系统) 在加工中·像轉射光學系統比聚光光學系統可進行較 小的孔徑加工,而可加工之孔的深度則像轉射光學系铳較 聚光光學糸統淺。 (請先閲讀背面之注意事項再填寫本頁) 裝R = k 1 X λ x F D0F = k2 x λ x (ΡΛ2) where F = D / f. D is the effective lens of the lens, f is the transparent focal length, λ is the wavelength of the laser beam, Icl and k2 are the material of the workpiece 7 and the shape of the flared beam. That is, the amount of aberration or the formula Uode) determines its value. When comparing the values of kl and k2 with the condensing optical system and the image conversion optical system, it is formed as follows. However, it is assumed that these are the same material of the workpiece 7 and have the same beam state. kl (condensing optical system) > kl (image-transmitting optical system) k2 (condensing optical system) > k2 (image-transmitting optical system) That is, R (concentrating optical system) > R (image Transmitting optical system) D0M condensing optical system) > D0F (image-transmitting optical system) In processing · Image-transmitting optical system can be processed with a smaller aperture than the condensing optical system, and the depth of the hole that can be processed Then, the optical system like the conversion optics is shallower than the condensing optical system. (Please read the precautions on the back before filling out this page)

,1T 本紙張尺度遑用中國國家標準(CNS ) A4現格(210 X 297公釐) 6 3 8 4 3 7 經濟部中央橾準局貝工消費合作杜印製 3dG585 A7 B7 五、發明説明(7 ) _32是表示針對具有孔加工材質之聚光光學糸統及像 轉射光學系統的可加工領域。 因此,孔《小的加工是Μ具儋像轉射光學系統之霤射 加工機來進行,而孔深之深切加工則是利用具備聚光光學 系統的雷射加工機加以進行。又,多《印_基板的切斷加 工是由於對焦黏深度較深之光束的的需求度較重於加工面 之小光束直徑的需要度,因此在切*加工係Μ具》聚光光 學糸统之雷射加工«加Κ進行。 由上述•為有效利用一多雇印刷基板的加工埋績進行 切斷加工*及不同孔徑或孔深之貫穿孔加工或盲孔加工時 * 一台可切換聚光光學糸統及像轉射糸絞的笛射加工櫬是 不可或缺者。 利用多曆印刷基板之笛射光束的加工中•為了提高產 量不僅必須移動ΧΥ工作台*並利用驗«反射鏑( galvano*i「ro「)同時移勦光束而達到加工的高速化。鼸33 偽表示使用驗《反射鏑之霤射加工裝置。 _33中》1為笛射振1器、2為酋射光束、19為像轉射 光學糸統、6為XY工作台、7為被加工物、8為反射鏑、9為 NC裝置。將19之像縛射光學系統表示於圈34。31為通嫌 、32為屏蔽、3β為fefi嫌、37為驗《反射鏑。屏蔽32及 «鳙36及被加工物7間的位置闢係為將光束從驗霣反射鏡 37相對於「0透鏡36朝正下方降下時,以某一倍率使屏蔽 像願像於被加工物7上的位置Μ係。 其次,說明其動作如下。 本紙張尺度適用中國國家揉準(CNS ) Α4規格(210X 297公釐) 7 38437 (請先閲讀背面之注意事項再填窩本頁) 訂 經濟部中央橾準局貝工消费合作杜印裝 A7 B7 五、發明説明(8 ) 從雷射振通器1發出的雷射光束入射至像轉射光學糸 铳19中。入射於像轉射光學糸統19的光束為了照射屏蔽 32而輅透鏑31聚光。該聚光由於是照射小直徑的屏蔽因 此能源的損失較少。透過屏蔽32的光束是利用驗電反射鏡 37引導至轉射用之fS透鏞36上· »f0透鏡36K某一倍率 使編小的屏蔽像顯像於被加工物7面上。驗霣反射縯37可 將光束誘導至f Θ «鏡的任意位置·其结果,在被加工物 7上可«驗霣反射鏡37M光束挿描僅f0透》36的大小領域 悬。 在NC装置9上記憶装置中記憶有複歟髑加工條件•即 雷射_出等的條件,可對應被加工物7的材質、板厚、加 工形狀選擇最«當的條件,並據以控制振盪器1、XY工作 台6、驗霣反射饞37等。 雷射振邋器之輪出在額定輪出附近是圼安定吠態•但 是低输出時舍使變動暢度增大而形成不安定狀戆。孔加工 中*在一孔加工上1使用歟饀脈銜因此笛射輪出之差異值 對於加工結果的差異會造成S大的影響。 «明所欲_決夕制》 由於習知笛射加工裝置構成如上述而會存在有Μ下之 諸問颺。 --------- 僅具備聚光光學系统之雷射加工裝置與僅具有像轉射 光學糸絞之笛射加工裝置比較時具有較大之最小臨界加工 孔S ·因此不能進行小孔徑之加工。另一方面•僅具谢》 轉射光學系統的雷射加工裝置與僅具備聚光光學系妹之雷 本紙沬尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) 3 8 4 3 7 C -裝— (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部中央梂準局貝工消費合作杜印裝 A7 B7五、發明説明(9 ) 射加工裝置比較時只具較淺的孔徑加工深度*因此不能進 行如深孔之通孔或盲孔等的加工。且於切斷加工時,一旦 形成較厚之印刷基板板厚時•在加工面上必須Μ具有焦點 深度較深之光束,因此僅具備像轉射光學糸絞的雷射加工 裝置則無法進行加工。 又,像轉射光學系统在變化被加工物7上的光束直徑 時必須使屏蔽31變化。因此•舍降低因交換屏蔽時間時的 生產性。並且即使準備數種不同孔徑的屏蔽•仍不能對應 連缅變化之孔徑加工。 從驗«反射鏡37使光束相對於透鏡36正下方下降 時,與斜向下方比較時•如鼷35所示之屏蔽32與ίθ透鏡 36之間的距雛有著L1-L0的不同。其结果•從驗霣反射嫌 37使光束相對於f0透銕36斜向下方下降時,會使加工均 7上的屏蔽32的像棋期而不能進行良好的加工。 在變動幅度大之低鑰出領域中會造成加工结果差異的 加大。 本發明是為解決上述問路所研創者,其目的為獲得可 進行具有多種多樣的通孔或盲孔之配鑲基板的加工輿切断 加工之笛射加工裝置者。 解決册鼷夕方浃 本發明之笛射加工裝置係具備:具有插入於霤射振慂 器與被加工物間的光程中之屏蔽及使該屏蔽的像縮小成像 於加工面之S期的像_射光學糸統;聚光光學系統:選擇 前述像轉射光學糸铳及前述聚光光學糸統中任一糸铳之選 (請先閲讀背面之注意事項再填荈本頁), 1T This paper standard adopts the Chinese National Standard (CNS) A4 (210 X 297 mm) 6 3 8 4 3 7 Printed by 3dG585 A7 B7 of the Ministry of Economic Affairs Central Bureau of Industry and Fisheries Consumer Cooperation V. Description of invention ( 7) _32 indicates the processable area for the condensing optical system and image conversion optical system with hole processing materials. Therefore, the small processing of the hole is performed by the slide processing machine with an image conversion optical system, and the deep processing of the hole depth is performed using a laser processing machine with a condensing optical system. In addition, the "cutting process of printing_substrate is because the demand for the beam with deep focus sticking depth is heavier than that for the small beam diameter of the processing surface, so the cutting * processing system is M" Condenser optics The laser processing of the system is carried out «Plus K. From the above • To effectively use the processing performance of a multi-substrate printed circuit board for cutting processing * and through hole processing or blind hole processing with different apertures or hole depths * One switchable condensing optical system and image conversion projection system The processing of twisted flutes is indispensable. In the processing of whistle beam using multi-calendar printed substrates • In order to increase the output, it is necessary to move not only the XY table *, but also use the inspection «reflective dysprosium (galvano * i" ro ") to simultaneously move the beam to achieve high-speed processing. Pseudo-indicated use of the "reflective dysprosium glide processing device. _33 中" 1 is a whistle vibration device, 2 is a emissive beam, 19 is an image conversion optical system, 6 is an XY table, and 7 is a workpiece , 8 is the reflective dysprosium, 9 is the NC device. The 19-image binding optical system is shown in the circle 34. 31 is the common suspect, 32 is the shield, 3β is the fefi suspect, 37 is the test "reflective dysprosium. Shield 32 and« big The position between 36 and the object to be processed 7 is the position at which the shielded image is to be imaged on the object to be processed 7 at a certain magnification when the light beam is lowered directly downward from the eyepiece mirror 37 relative to the "0 lens 36" Secondly, explain its actions as follows. This paper scale is applicable to the Chinese National Standard (CNS) Α4 specification (210X 297 mm) 7 38437 (please read the precautions on the back before filling the nest page). Bureau Printing Industry Consumer Cooperation Du Printed A7 B7 V. Description of invention (8) From laser vibrator 1 The outgoing laser beam is incident on the image conversion optics 19. The light beam incident on the image conversion optics 19 is condensed through the dysprosium 31 to illuminate the shield 32. This condensed light is irradiated with a small diameter shield. Less energy loss. The light beam passing through the shield 32 is guided to the fS penetrating mirror 36 for retransmission using the electroscope mirror 37. »The f0 lens 36K has a certain magnification to display the small shield image on the object 7 On the surface, the spectroscopic reflection 37 can induce the light beam to any position of f Θ «mirror. As a result, on the object 7, the size field of the spectroscopic mirror 37M beam interpolation can only be f0 transparent 36. In the NC device 9, the memory device stores the complex machining conditions, that is, laser_out conditions, etc., and the most suitable conditions can be selected according to the material, plate thickness, and processing shape of the workpiece 7 and controlled accordingly. Oscillator 1, XY table 6, inspection reflector 37, etc. The wheel output of the laser vibrator is stable in the vicinity of the rated wheel output. However, when the output is low, the smoothness of the change is increased and it becomes unstable. Zigzag. In hole machining * 1 is used in a hole machining, so the whistle is out The difference value will have a big influence on the difference of the processing results. «Ming what you want _ Jue Xi system> Because the structure of the conventional flute processing device is as described above, there will be various questions about the ----. --- Compared with the laser processing device with only the condensing optical system and the whistle processing device with only the image conversion optics, it has a larger minimum critical processing hole S. Therefore, it is not possible to process small apertures. Another Regarding only "Thanks" "The laser processing device of the conversion optical system and the laser paper paper with only the condensing optics are applicable to the Chinese National Standard (CNS) Α4 specification (210X297 mm) 3 8 4 3 7 C-installed — (Please read the precautions on the back before filling out this page) Order the Central Printing Bureau of the Ministry of Economic Affairs Beigong Consumer Cooperation Du Printing Equipment A7 B7 V. Description of the invention (9) The injection processing device only has a shallower processing depth when compared * Therefore, it is not possible to process deep holes or blind holes. And in the cutting process, once a thick printed circuit board thickness is formed, it is necessary to have a beam with a deep focal depth on the processing surface, so it is impossible to process only with a laser processing device like a conversion optics. . In addition, the image conversion optical system must change the shield 31 when changing the beam diameter on the workpiece 7. Therefore, reduce productivity due to exchange shield time. And even if several kinds of shields with different apertures are prepared, they still cannot be processed with apertures that change continuously. When the mirror 37 causes the light beam to fall directly below the lens 36, when compared with the oblique downward direction, the distance between the shield 32 and the θ lens 36 as shown in Fig. 35 differs from L1-L0. As a result, when the light beam 37 is reflected downward from the corner detector 37, the beam falls obliquely downward with respect to the f0 translucent 36, which will cause the processing of the shield 32 on the processing board 7 to be difficult to perform good processing. In the field of low-key outflows with large changes, the difference in processing results will increase. The present invention is made by the inventors who have solved the above-mentioned problems, and its purpose is to obtain a flute processing apparatus that can perform processing and cutting processing of a mounting substrate having a variety of through holes or blind holes. The whistle processing device of the present invention is equipped with: a shield inserted in the optical path between the blasting vibrator and the object to be processed, and the image of the shield reduced to the S phase image of the processing surface Optical system; Condensing optical system: Choose the image conversion optics and any of the aforementioned condensing optical systems (please read the precautions on the back before filling this page)

A 丨裝· 訂 本紙悵尺度迻用中國國家揲準(CNS ) A4規格(210X297公釐) 9 3 8 4 37 A7 經濟部中央橾準局員工消費合作社印^ B7五、發明説明(1〇) ^ 擇裝置;控制前述讎轉射光學糸統及前述聚光光學糸絞及 前述選擇裝置之HC裝置;而對應於加工孔徑輿孔深選擇前 述像轉射系铳與聚光光學糸統中之任一系統者。 又·本發明係具備:具有插入於笛射振邇器與被加工 物間之光程中的屏敲及使该屏蔽的像缩小成像於加工面之 透鏑的像轉射光學系统;聚光光學糸眩:選擇前述像轉射 光學系统及前述聚光光學系械中任一系统之S擇裝置;控 制前逑像轉射光學系铳及前述聚光光學糸統及前述選揮装 置之NC裝置;而對«於纘孔成楢加工及外形切割加工等加 工内容薄擇前述像轉射糸統與聚光光學系統中之任一糸統 者0 又·本發明係具備:具有插入於酋射振鹽器輿被加工 物間光程中之可改變位置之屏蔽及具有使該屏蔽的像縮小 成»於加工面之可改變曲率之鏡的像縛射光學系統•及控 制該像轉射光學系絞之NC装置•而對應於孔徑而控制前述 曲率可變之鏡及前述屏蔽的位置。 又,本發明係具備:具有插入笛射振盪器與被加工物 間光程中之位置可變之屏蔽及具有使該屏蔽的像缩小成像 於加工面之曲率可變之鏑的像轉射光學系統、聚光光學系 統、選揮前迷儺轉射光學系統與荊述聚光光學系統中任一 糸統之«擇装置、控制前述像轉射光學糸統與前述聚光光 學糸统及前述《揮装置之NC裝置•而對應於孔徑而控制前 述曲率可變績及前迷屏蔽的位置。 又*本發明係具具有插入笛射振»器與被加工物 本紙浪尺度遑用中國國家標準(CNS ) A4規格(210X297公釐) --------C"* I 裝-- (請先閱讀背面之注意事項再填寫本頁) 訂 Γ 線 A7 經濟部中夬標準局員工消费合作杜印裝 B7五、發明説明(η) 1 間光程中之屏蔽及使該屏蔽的像縮小成像於加工面之曲率 可變之嫡及加工面與前述曲率可變之績之間距離變化之可 變裝置的像轉射光學糸统*及控制該像轉射光學系铳之HC 装置•而對懕其孔徑控制前述曲率可變鏡的曲率·及前述 加工面與前述曲率可變嫌之間的距離。 又·本發明係具備:具有插入雷射振盪器與被加工物 間光程中之屏蔽及使該賻蔽的像鑌小成像於加工面之曲率 可變鏡的像轉射光學系統、聚光光學系统、選擇前述像轉 射光學系妹與前述聚光光學糸统中任一糸统之選擇裝置、 控制前述像轉射光學糸統與前述聚光光學糸铳及前述選擇 裝置之NC裝置,在港揮前述像轉射光學系铳時,可對應孔 徑而控制前述曲率可變鎮的曲率,及前述加工面與前述曲 率可變鏡之間的距離。 又*本發明係具谢:具有插入雷射振盪器與被加工物 間光程中之位置可變之屏蔽及使該屏敲的像縮小成像於加 工面之曲宰可變之鑲的«縛射光學系统•及控制前述像轉 射光學系統之HC裝置•使笛射光束Μ —斜角入射至透鏑時 •可對應於入射角控制前述屏蔽的位置而修正孔徑。 本發明係具備:具有插入雪射振還器輿被加工物間光 程中之位置可變屏蔽及使該屏蔽的像繡小成像於加工面之 通鐃的像轉射光學糸铳、聚光光學糸铳、選擇前迷像轉射 光學系統與前述聚光光學系統中任一系統之龌揮裝置、控 制前述像轉射光學系統與前述聚光光學系铳及前迷《攆裝 置之HC裝置*當缠擇前迷儺轉射光學系统時,使雷射光束 本紙悵尺度適用中國國家橾隼(〇^)/\4規格(210>< 297公釐) (请先閱讀背面之注意事項再填荈本1) —裝_ 訂 320585 A7 經濟部中央橾準局員工消費合作社印裝 B7五、發明説明(12) 以一斜角入射至前述透鏡時NC裝置,使笛射光束κ 一斜角 入射於透鏞時•對應入射角控制前述屏蔽的位置而可播此 修正孔徑者。 本發明偽具備:具有插入雷射振盪器輿被加工物間光 程中之屏蔽及使該屏蔽的像缩小成像於加工面的透鏡之像 轉射光學糸統•及控制該像轉射光學系統之HC裝置,使前 述屏蔽的雷射光束入射側之雷射光束直搜變化拜Μ調節通 過前述屏蔽的能量,而可調節加工面上的能量。 本發明係具備:具有插入雷射振通器與被加工物間光 程中之屏蔽及使該屏蔽的像縮小成像於加工面的透《之像 轉射光學糸铳、聚光光學系统、選擇前述像轉射光學系統 輿前述聚光光學糸統中任一糸统之堪擇裝置、控制前述像 轉射光學糸統與前述聚光光學系統及前述選揮裝置之NC裝 置,當薄擇前述像轉射光學糸統時,使前述屏蔽之雷射光 束入射側的笛射光束直徑變化》以調節通過前述屏蔽的眭 量,而可調節加工面上之能量者。 餌明夕奮啪形16 鸾觖形魄1 以下說明本發明之第1實豳肜戆。裝置構成為如_1所 示。1為笛射振盪器、2為雷射光束、3為像轉射光學糸統 、5為聚光光學系統、6為)(Υ工作台、7為被加工物、8為反 射鏑、9為NC装置、10為附有可將笛射光束分射像轉射光 學系統3戎聚光光學系統5任一方而可作為選擇装置之》勛 装置1 1之鏑面。 1 2 (請先閲讀背面之注意事項再填寫本頁) 裝· 、1Τ " 本紙张尺度適用中國國家樣準(CNS ) Λ4規格(210 X 297公釐) 3 8 4 3 7 A7 B7 五、發明説明(i 3) 3之像轉射光學糸統與臞31相同。5之聚光光學系統則 與圈2 9相同。 其次說明其動作如下。NC裝置9之記懂裝置中記憶有 複數個加工條件,即笛射_出等的條件•可依據對應被加 工物7的材質,及孔徑戎孔的深度而«擇最遘當之加工條 件。並對應孔徑及孔深選擇像轉射光學糸统或聚光光學糸 统中癰於加工之一方而預先記憶於MC裝置9的記憶裝置中 ,操作貝將材質*及孔徑或孔深鑰入NC裝置9中時•可藉 NC装置9使反射鏞10動作而自動將光束分射於像轉射光學 (請先閲讀背面之注意事項再填荈本頁) 裝. 又 ο 示 所 2 B 如 為 程 流 之 時 。 此 行 。 進 上換 統切 条動 學手 光 Μ 光可 聚亦 或貝 統作 糸 搡 糸 學 光 射 轉 像 對 針 圓 於 示 表 例 之 域 領 用 及其 絞 。 使 其 料 材 之 別 分 铳 糸 學 光 光 聚 同 不 所 有 而 料 材 因 會 结 •1Τ 0 奮 射 1 射 分態轉 束形儺 光豳使 射實可 笛之間 使铳之 於系物 對一工 相任加 统被 系與 學器 光邋 光振 聚射 戎笛 統在 糸為 學態 光肜 射豳 轉實 像本 於 丨 任 中 統 糸 學 光 光 聚 或 統 系 學 光 S4 經濟部中央標準局負工消資合作杜印裝 者 卸 装 由 白 上 程 光 從 統 系 示 、 所统 3 i _ .糸 學 為射 成轉 構像 置為 裝 3 其 、 束 光 物 Η 加 被 為 7 5 器統0 糸 振學 射光 笛光 為聚 1為 射 雷 為 2 Η Υ X 為 6 為 9 置 裝 對學 相 光 為射 3 轉 1像 、使 由 白 可 而 、 程 鳞光 射 W 反間 為物 8 Η 、 加 被 與 器 0 振 、 射 台雷 作於 裝 勛 _ 的 置 裝 擇 龌 之 雌 脫 統 系1 任 5 統 系 學 光 光 聚 戎 3 統 本紙伕尺度適用中國國家標準(CMS )八4規格(210X 297公釐) 13 3 8 4 3 7 經濟部中央橾率局貝工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 3 8 4 3 7 A7 B7 五、發明説明(ι〇 ; 3之像轉射光學系统是與圈31相同。5的聚光光學糸統 則與鼸2 9相同。 其次說明其動作如下。NC裝置9之記憧装置中記憶有 複數個加工條件·即霤射輪出等的條件•可根據對應被加 工物7的材質•及孔徑或孔的深度而選擇最砉當加工條件 。並對應孔徑及孔深選擇像轉射光學糸统或聚光光學糸統 中適於加工之一方而預先記憶於HC裝置9之記慊裝置中* 操作貝將材質•及孔徑或孔深_入《(:装置9中時•可藉NC 裝置9使驅觔裝置13動作而自動將像轉射光學系统3或聚光 光學糸統5的任一系統裝著於雷射振盪器與被加工物之間 。此時之滾程係如圔4所示。又*操作貝亦可藉手動進行 上述之裝卸者。 奮觖形贿3 装置構成係輿_1相同。 其次說明其》作如下。NC裝置9之記憧裝置中記憶有 複數個加工條件,其可根據對應被加工物7的材霣*反孔 徑或孔深及孔加工或切断加工之加工内容而遘揮最適當的 條件。並對應該加工内容選擇像轉射光學系统或聚光光學 糸統中適於之加工條件而預先記憶於HC裝置9之記憶装置 中 > 搡作貝將加工方法輸入NC装置9中時,可《NC装置9使 反射鑌10動作自動將光束分射於像轉射光學系統或聚光光 畢糸統。此時之流程為黼5所示。又•搡作8亦可以手動 切捵進行。 奮豳形豔4 1 4 (請先閲讀背面之注意事項再填寫本頁) 裝- -9A 丨 Package and copying the standard size of the paper to the Chinese National Standard (CNS) A4 specification (210X297 mm) 9 3 8 4 37 A7 Printed by the Employee Consumer Cooperative of the Central Bureau of Standardization of the Ministry of Economic Affairs ^ B7 V. Invention Description (1〇) ^ Selective device; HC device that controls the aforementioned optical conversion optical system and the aforementioned condensing optical system and the aforementioned selection device; and selects one of the aforementioned image conversion system and condensing optical system corresponding to the processing aperture and hole depth Any system. Further, the present invention is provided with: a screen knocking optical system having a screen knock inserted in the optical path between the whistle vibrator and the object to be processed, and a dysprosium that reduces the shielded image and forms an image on the processing surface; Optical Dazzle: Select the S selection device of any system of the aforementioned image conversion optical system and the aforementioned condensing optical system; control the front image conversion optical system and the NC of the aforementioned condensing optical system and the aforementioned selection device The device; and for the processing contents such as 漵 缵 孔 成 楢 processing and shape cutting processing and so on, select any one of the aforementioned image conversion projection system and condensing optical system 0. The invention is provided with: Salt shaker and variable-position shielding in the optical path between the processed objects and the image-trapping optical system with a curvature-reducing mirror that reduces the shielding image to the processing surface • Controlling the image-transmitting optical system The NC device controls the position of the mirror with variable curvature and the shield corresponding to the aperture. In addition, the present invention includes an image conversion optical system having a shield with a variable position inserted in the optical path between the jet oscillator and the object to be processed, and a dysprosium with a variable curvature for reducing the image of the shield to the processing surface. Condensing optical system, selective optical system before selection and conversion of any optical system in Jingshu condensing optical system, control of the aforementioned image-transmitting optical system and the aforementioned condensing optical system, and the aforementioned "NC of waving device" The device controls the position of the aforementioned variable curvature and the front fan shield corresponding to the aperture. In addition, the present invention is equipped with a whistle inserter and an object to be processed. The paper size of the paper is not in accordance with the Chinese National Standard (CNS) A4 specification (210X297mm) -------- C " (Please read the precautions on the back before filling in this page) Order Γ line A7 Ministry of Economic Affairs, China Bureau of Standards and Staff's consumer cooperation du printing B7 5. Invention description (η) 1 shield in the optical path and reduce the image of the shield The image conversion optical system * of the variable curvature of the processing surface and the variable distance between the processing surface and the aforementioned variable curvature performance and the HC device that controls the image conversion optical system Its aperture controls the curvature of the variable curvature mirror and the distance between the processed surface and the variable curvature. Furthermore, the present invention is provided with: an image conversion optical system and a condensing optical system having a shield inserted in the optical path between the laser oscillator and the object to be processed and a curvature variable mirror for imaging the shielded image small on the processing surface 1. A selection device for selecting any one of the aforementioned image conversion optical system and the aforementioned condensing optical system, and an NC device for controlling the aforementioned image conversion optical system and the aforementioned condensing optical system and the aforementioned selection device. When the image conversion optical system is used, the curvature of the variable curvature town and the distance between the processed surface and the variable curvature mirror can be controlled according to the aperture. * The present invention is thanks to: «Bonding optics with a variable position shield inserted in the optical path between the laser oscillator and the object to be processed and the image of the screen knocked down to be imaged on the processing surface System • And the HC device that controls the aforementioned image-transmitting optical system • When the flared beam M is incident on the dysprosium at an oblique angle • The aperture can be corrected by controlling the position of the shielding corresponding to the incident angle. The invention is provided with an image-transmitting optical guillotine and a condensing optical guillotine with a variable position shield inserted in the optical path between the snow radiating device and the processed object, and a small image embroidering the shield on the processing surface.铳, select the front camber conversion optical system and the condensing optical system of any of the sway device, control the image conversion optical system and the aforementioned condensing optical system, and the front fan "HC device 撵 device * when When selecting the optical system of the former Nuo conversion, make the laser beam scale suitable for the Chinese National Falcon (〇 ^) / \ 4 specifications (210 > < 297mm) (Please read the precautions on the back before filling荈 本 1) — Installation _ order 320585 A7 Printed and printed on the B7 employee consumer cooperative of the Central Central Bureau of Economics B. V. Description of invention (12) The NC device enters the aforementioned lens at an oblique angle, so that the flute beam κ enters at an oblique angle When penetrating the yoke, control the position of the aforementioned shield according to the incident angle and broadcast the corrected aperture. The invention is provided with: an image conversion optical system having a shield inserted into the laser oscillator and the optical path between the processed objects and a lens that reduces the image of the shield to be imaged on the processing surface; and an HC that controls the image conversion optical system The device can directly change the laser beam on the incident side of the shielded laser beam and adjust the energy passing through the shield to adjust the energy on the processing surface. The invention is provided with: a shield inserted in the optical path between the laser vibrator and the object to be processed, and a transparent image reduction optical image of the shield to be imaged on the processing surface, a condensing optical system, a selection of the aforementioned image The conversion optical system and the optional device of any one of the above-mentioned condensing optical systems, the NC device that controls the image-transforming optical system and the above-mentioned condensing optical system and the above-mentioned selection device, when the image conversion is selected thinly In the case of optical systems, the diameter of the flared beam on the incident side of the laser beam of the shield is changed to adjust the amount of light passing through the shield and the energy on the processing surface can be adjusted. Bai Xie Ming Xi Fang Ping shape 16 Luan Ji shape soul 1 The following describes the first real gimmick of the present invention. The device is constructed as shown in _1. 1 is a lasing oscillator, 2 is a laser beam, 3 is an image conversion optical system, 5 is a condensing optical system, 6 is a) (Υ table, 7 is a workpiece, 8 is a reflection dysprosium, 9 is The NC device 10 is a dysprosium surface of the "Hun device 1 1" with either one of which can be used as a selection device with either the diffracted beam splitting image conversion optical system 3 or the condensing optical system 5. 1 2 (Please read the note on the back first Please fill in this page again for details), 1T " This paper size is applicable to China National Standard (CNS) Λ4 specification (210 X 297mm) 3 8 4 3 7 A7 B7 5. Description of the invention (i 3) 3 The conversion optical system is the same as that of Lin 31. The condensing optical system of 5 is the same as the circle 2 9. Next, the operation is described as follows. The NC device 9 remembers that there are a plurality of processing conditions stored in the device, that is, flue shot_out, etc. Conditions • The most suitable processing conditions can be selected according to the material of the object to be processed 7 and the depth of the aperture. And the corresponding aperture and depth of the hole can be selected like the conversion optical system or the condensing optical system. It is pre-stored in the memory device of MC device 9 in the process of one process, operate the shell material * and the hole diameter or hole depth When entering the NC device 9 • The NC device 9 can be used to operate the reflective yoke 10 to automatically split the light beam to the image conversion optics (please read the precautions on the back before filling this page). Also ο Show 2 B If it is the time of Chengliu. This trip. Enter the upper system and change the strip to learn the light. The light can be gathered or the shell can be used as a light. It is like a circle of needles and it is used in the domain of the example. Make the difference between the material and the light and light, the light and the light are condensed, and the material will be knotted • 1Τ 0 漸 射 1 shot, split state, beam-shaped Nuo light, so that the shot can be made between the flute. For the first phase of the work, the system is combined with the school's light, light and vibration, and the Rongzi flute system is in the form of a light, and it turns into a real image. The Ministry of Central Standards Bureau undertook the cooperation between consumers and consumers. The unloading was shown by Cheng Shangguang from the white system, and it was 3 i_. 7 5 System 0 Shitotsu, the light flute light is poly 1 and the lightning is 2 Υ X is 6 and 9 is installed. It is 3 turns to 1 image for the school phase light, so that it can be shot by Bai Keer, Cheng scale light is 8 W in the reverse, plus 0 vibration by the device and the device, and the shooting platform is made to be installed_ The installation and selection of the female and female systems 1 Ren 5 System Studies Guangguangjurong 3 The paper size scale is applicable to the Chinese National Standard (CMS) 84 specifications (210X 297 mm) 13 3 8 4 3 7 Central Ministry of Economic Affairs The paper standard printed by the Beigong Consumer Cooperative Society of China is applicable to the Chinese National Standard (CNS) A4 (210X 297 mm) 3 8 4 3 7 A7 B7 5. Description of the invention (ι〇; 3 The image conversion optical system is Same as circle 31. The condensing optics system of 5 is the same as that of Mi 29. Next, the operation will be described as follows. The memory of the NC device 9 stores a plurality of processing conditions in the device, that is, the conditions such as the ejection wheel, etc. • The most suitable processing conditions can be selected according to the material of the workpiece 7 to be processed, and the hole diameter or the depth of the hole. Corresponding to the aperture and the depth of the hole, select one of the conversion optical system or the condensing optical system that is suitable for processing, and it is pre-stored in the memory device of the HC device 9 * Operation shell material * Aperture or hole depth_IN "(: When the device 9 is in operation • The NC device 9 can be used to operate the rib driving device 13 to automatically install any system such as the conversion optical system 3 or the condensing optical system 5 in the laser oscillator and the workpiece At this time, the rolling process is shown in Fig. 4. The operator can also manually perform the above loading and unloading. Fenji shape bribe 3 The device structure is the same as _1. Secondly, it is explained as follows. NC The memory of the device 9 has a plurality of processing conditions memorized in the device, and the most suitable conditions can be swayed according to the processing contents corresponding to the material * reverse aperture or hole depth of the workpiece 7 and the processing of hole processing or cutting processing. The processing conditions should be selected such as the suitable processing conditions in the conversion optical system or the condensing optical system and stored in advance in the memory device of the HC device 9> When inputting the processing method into the NC device 9, the NC The device 9 makes the reflection mirror 10 act automatically to split the light beam to the image converted light The system or spotlight is complete. The process at this time is shown in 黼 5. In addition, it can also be manually cut through the operation 8. Fen Bin Xingyan 4 1 4 (please read the precautions on the back before filling this page ) Pack--9

S.V 經濟部中央標準局员工消費合作社印裝 A7 B7 五、發明説明(15) 相對於使笛射光束分射為像轉射光學糸統或聚光光學 糸統任一系統之實豳形態3 *本實腌肜態為在霤射振盪器 與被加工物之間可使像轉射光學糸铳或聚光光學糸铳中任 一系統從光程上自由装卸者。 裝置構成係與圈3相間。 其次說明其動作如下。NC裝置9之記憶裝置中記惕有 複數個加工條件·即留射鑰出等的條件•可根據對應之被 加工物7的材質•及孔徑或孔深及孔加工或切跚加工選擇 最遘當加工條件。並對應該加工闪容選擇像轉射光畢糸» 戎聚光光學糸铳中適於加工的一系絞而預先記憶在HC裝置 9的記憶裝置中•當搡作員將材霣,及孔徑或孔深輸入NC 裝置9中時,可藉HC裝置9使_動裝置13動作而自動將像轉 射光學系統3或聚光光學系統5任一糸统裝著於®射振盪器 與被加工物之間。此時之流程為如_6所示。又·搡作貝 亦可«手動進行上述之裝卸。 啻觖形糖5 在習知例之像轉射光學系統中•籣單表示使屏蔽32與 轉射《鏡33間的距離dl、轉射进鏡33與被加工物7之間的 距離d2、轉射«鏡焦距f、屏蔽32的像成像時之倍率Μ的關 係如下。 [1 / d 1 ] > [ 1 / d 2 ] = 1 / f , Μ = [ d 2 ] / [ d 1 ] 於此•如M曲率可變之反射鏡替代轉射透鏡時可變化 其焦距•其结果可使倍率(4變化。曲率可變之反射鏑係如SV A7 B7 Printed by the Employees ’Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Description of the invention (15) Relative to splitting the whistle beam into a system such as a conversion optical system or a condensing optical system 3 * The true state is that between the slip oscillator and the object to be processed, any system like transfer optics or condensing optics can be freely loaded and unloaded from the optical path. The device configuration is interposed with the ring 3. Next, the operation will be described as follows. The memory device of the NC device 9 remembers that there are a plurality of processing conditions, that is, the conditions for leaving the key out, etc. • The material of the object to be processed 7 can be selected according to the corresponding material, and the hole diameter or the hole depth, and the hole processing or cutting processing is the most suitable When processing conditions. And choose the flashing light that should be processed, such as the transfer light Bi Shi »A series of twists suitable for processing in the Rong Condensing Optics, which is pre-stored in the memory device of the HC device 9 • When the staff member will make the material, and the aperture or depth When input to the NC device 9, the HC device 9 can be used to activate the moving device 13 to automatically install either the image conversion optical system 3 or the condensing optical system 5 between the laser oscillator and the workpiece. The flow at this time is shown in _6. You can also carry out the above loading and unloading manually.啻 視 形 糖 5 In the conventional image conversion optical system, the single sheet represents the distance dl between the shield 32 and the conversion mirror 33, the distance d2 between the conversion into the mirror 33 and the object 7, The relationship between the conversion «mirror focal length f and the magnification M of the image of the mask 32 is as follows. [1 / d 1] > [1 / d 2] = 1 / f, Μ = [d 2] / [d 1] Here • If the mirror with variable curvature M is used instead of the conversion lens, its focal length can be changed • As a result, the magnification (4 can be varied. The variable curvature of the reflective dysprosium is as

Special issue of the J.0pt..Soc.Ai.63[March 1977]¾¾ 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐)~~ 15 38437 (請先閲讀背面之注意事項再填葙本頁) -裝 訂 經濟部中央標準局員工消費合作社印製 本紙浪尺度適用中國國家標準(CNS ) /V»規格(210X297公釐) 3 8 437 A7 B7 五、發明説明(ΐβ) J.W.Hardy, "Active Optics : A Hew technology for the control of light, ”Proc.IEEE66,6 5 1 -697[June 1978]中 所詳述。 装置構成係如團7所示。1為雷射振盪器、2為雷射光 束、16為像轉射光學系統、6為XY工作台、7為被加工物、 8為反射鏑、9為HC裝置。16之像轉射光學糸統係表示於圔 8之中。31為透鏡、34是利用匾動裝置14可改變位置之屏 蔽、35為可變曲率之反射鏡。位置可變屏蔽34與曲率可變 反射鏡35與被加工物7的位置闞係是Μ某一倍率使屏蔽的 像成像於被加工物7上的位置Μ係。 其次*說明其動作如下。由[2]式可獲得· f = d2/ [M>1] , M = d2/dl [3] 以小的倍車M,即為了使被加工物7上的光束直徑較小 時,由於d2[曲率可變反射鏡35與被加工物7之間的距鑲 ]為一定值|因此設dl為[位置可變屏蔽3 4與曲率可變反射 鏑35之間的距雕]較大值並設定小倍率Μ,調節曲率可變反 射嫌35的曲率使其形成相當於其倍車Μ之焦距f。因此•操 作貝一旦將孔搜輸入HC装置時,決定曲率可變反射》35之 焦距及屏蔽34的位置而動作形成可對應孔棰之倍率。此時 的流程係如 9所示。 _形戆6 裝置構成為如圔1〇所示。丨為笛射振«器、2為雷射光 束、16為像轉射光學糸铳、5為聚光光學糸統、6為XY工作 台、7為被加工物、8為反射縝、9為NC裝置、13為可將像 16 (請先閲請背面之注意事項再填寫本頁) 裝 、-· A7 320585 B7 五、發明説明(17) 轉射光學糸統3或聚光光學糸统5任一糸統相對於笛射振盪 器與被加工物間的光程而可自由裝卸之驅動裝置。 16之像轉射光學系铳與團8相同。5之聚光光學糸铳則 輿圔2 9相同。 其次說明其動作如下。NC裝置9之記憶装置中記憧有 複數個加工條件·即雷射輸出等的條件,可根據對應被加 工物7的材霣、孔徑戎孔深及孔加工戎切《加工内容而遘 擇最遘當之加工條件。並對應該加工内容及孔徑或孔深等 選擇像轉射光學系统戎聚光光學糸統中適於加工之一系铳 而預先記憶於H C装置9之記憶装置中•當操作貝將加工方 法及孔徑戎孔深等_入1<(:裝置9中時•可》NC装置9使_動 裝置13動作而自動將像轉射光學糸統16或聚光光學糸統 5之任一系统裝著在笛射振»器與被加工物之間。並且在 使光束分射於像轉射光學糸统16時·可決定形成對應孔徑 倍率之曲率可變反射鏡35的焦距及屏蔽34的位置而動作。 此時之流程係表現於画11。 奮_形觴7 装置構成為如圈12所示。1為雷射振盪器、2為雷射光 束、17為像轉射光學系统、6為XY工作台、7為被加工物、 8為反射鏡、9為NC裝置。像轉射光學系铳17可藉W勘裝置 15使位置改變•且像轉射光學系統17與被加工物7之間的 距離亦為可變者。 17之像轉射光學糸统係丧示於圈U。31為透鏡、32為 屏蔽、35為曲率可變之反射縯。屏蔽32與曲率可變反射鏡 17 --------Γ -裝------訂----- (請先閱讀背面之注意事項再填寫本頁) 經濟部中央橾準局貝工消費合作社印裝 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 3 8 4 3 7 經濟部中央橾準局員工消费合作社印裝 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X297公釐) 3 8 437 Α7 Β7 五、發明説明(18) 35與被加工物7的位置闞係是以某一倍率使屏蔽的像成像 於被加工物7上的位置W係。 其次,說明其動作如下。由式[2]可獾得, f = dl X Μ/ [1, M = d2/dl 設小倍率M*即設定小的被加工物7上之光束直徑時* 由於dl (屏蔽32與曲率可變反射鏡之間的距離)為一定值· 因此可使d2(曲率可變反射嫌35與被加工物7之間的距離 )為一小值而獲得小的倍率Μ *賴此可調節曲率可變反射鏡 35的曲率而形成相當於其倍率Μ之焦距f。 因此·當搡作員將孔徑輪入NC装置中時•可決定形成 對應孔徑倍率之曲率可變反射鏑35的焦钜及像轉射光學糸 絞17與被加工物7之間的距難而動作。此時之潦程係表現 於 _ 14。 奮麻形豔8 装置構成為如鼷15所示。1為笛射振盪器、2為笛射光 束、17為像轉射光學糸統、5為聚光光學系統、6為XY工作 台、7為被加工物、8為反射鏑、9為NC裝置、13為可將像 轉射光學系統3或聚光光學糸統5任一系統相對於雷射振盪 器與被加工物間的光程而可自由裝卸之驅動裝置。像轉射 光學系統17係可藉驅動裝置15形成位置可變者•而嫌轉射 光學系统17與被加工物7之間的距雛亦為可變者。 17之像轉射光學糸統輿圈〗3相同。5之聚光光學糸統 則與_ ‘2 9相同。 其次說明其動作如下。NC装置9之紀慊裝置中K懂有 18 --------裝------訂------^ ^ (請先閱讀背面之注意事項再填寫本頁) 經濟部中央橾準局貝工消費合作社印裝 A7 B7 五、發明説明(19) 複數《加工晓件,即笛射輸出等的條件,可根據對應被加 工物7的材質、孔徑或孔深及孔加工或切蹰加工内容而S 揮最遘當之加工條件。並對應該加工内容及孔徑或孔深等 選擇像轉射光學系統或聚光光學系統中遘於加工之一糸統 而預先記憶於NC裝置9之記憶裝置中,畨操作員將加工方 法及孔徑或孔深等輸入HC装置9時•可箱HC装置9使謳動裝 置U動作而自動將像轉射光學糸統17戎聚光光學糸统5之 任一糸統裝著於雷射振盪器與被加工物之間。並且在裝著 像轉射光學系统17時 > 可決定形成對應孔徑倍率之曲率可 變反射鏑35的焦距及像轉射光學糸統17及被加工物7之間 的距雛而動作。此時之流程偽表現於圖16。 啻淪形噍fl 裝置構成係如_丨7所示。1為笛射振«器、2為笛射光 束、18為像轉射光學糸铳、6為XY工作台、7為被加工物、 8為反射鏡、9為HC裝置、18之像轉射光學系统係表示於Μ 18中。31為透鏑、34為利用腿動装置14使位置為可變之屏 蔽、36為轉射用遇嫌、37為酴霣反射_。位置可變屏 蔽34輿通鏑34與被加工物7的位置Μ係是將光束從期霣反 射鏡3 7降下至fe透鏡之正下方時,以某一倍率使屏蔽的 像成像於被加工物7上的位置鼷偽。 其次說明其勒作如F。將光束從驗霣反射鑌3 7 F降至 f Θ通鏡3 6的正下方輿斜向下方時•可藉N C裝置9自動控制 形成一定之屏喊34與卩Θ 8S鏑36間光程的畏度。此時之流 埕是表琨於IM6。 本紙张尺度適用中國國家標準(CNS ) Λ4規格(210X 297公釐) ~ ~~~ 19 3 〇 4 〇 7 ^ ,裝-- (請先閲讀背面之注意事項再填荈本f )Special issue of the J.0pt..Soc.Ai.63 [March 1977] ¾¾ This paper size is applicable to China National Standard (CNS) A4 specification (210X 297mm) ~~ 15 38437 (Please read the notes on the back first (Fill this page) -Standard paper printed by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy applies the Chinese National Standard (CNS) / V »specifications (210X297mm) 3 8 437 A7 B7 V. Description of Invention (1β) JWHardy , " Active Optics: A Hew technology for the control of light, ”detailed in Proc. IEEE66, 6 5 1 -697 [June 1978]. The structure of the device is shown in Group 7. 1 is a laser oscillator, 2 is the laser beam, 16 is the image conversion optical system, 6 is the XY table, 7 is the object to be processed, 8 is the reflective dysprosium, and 9 is the HC device. The image conversion optical system of 16 is shown in 圔 8. Medium. 31 is a lens, 34 is a shield whose position can be changed by the plaque moving device 14, 35 is a variable curvature mirror. The variable position shield 34 and the variable curvature mirror 35 and the position of the object 7 are At a certain magnification, the masked image is imaged at the position M on the workpiece 7. Next, the operation will be explained It can be obtained from the formula [2]: f = d2 / [M > 1], M = d2 / dl [3] Turn M at a small multiple, that is, to make the beam diameter on the object 7 small, Since d2 [distance setting between the variable curvature mirror 35 and the workpiece 7] is a certain value | therefore, dl is set to [distance engraving between the position variable mask 34 and the variable curvature dysprosium 35] Value and set a small magnification M, adjust the curvature of the variable curvature reflection 35 to make it a focal length f equivalent to its multiplier M. Therefore, once the operation shell enters the hole search into the HC device, the curvature variable reflection is determined. The focal length and the position of the shield 34 can be formed to correspond to the magnification of the hole. The process at this time is shown in 9. _ 形 戆 6 The device is configured as shown in 圔 10. Laser beam, 16 is the image conversion optics, 5 is the condensing optics, 6 is the XY table, 7 is the workpiece, 8 is the reflection, 9 is the NC device, 13 is the image 16 ( Please read the precautions on the back first and then fill out this page) Installation,-· A7 320585 B7 V. Description of the invention (17) Transmitting optical system 3 or condensing optical system 5 With the optical path between the workpiece and the freely removable drive device 16 of the image transfer optical system of gun shot and the same group converging optical Ito gun 8 .5 Yu Ya of the same 29. Next operation will be described below. In the memory device of the NC device 9, there are a plurality of processing conditions, that is, laser output conditions, etc., which can be selected according to the material size, aperture diameter and hole processing corresponding to the object 7 to be processed. The proper processing conditions. And should choose the processing content and aperture or hole depth, etc. like the conversion optical system Rong Condensing optical system is suitable for processing one of the system is pre-stored in the memory device of the HC device 9 when the operation method will be the processing method and aperture Hole depth etc. _IN1 < (: When in device 9 • Available》 NC device 9 activates _ moving device 13 to automatically install any system like transfer optical system 16 or condensing optical system 5 in the flute Between the vibrator and the object to be processed. When the light beam is split on the image conversion optical system 16, the focal length of the variable curvature mirror 35 corresponding to the aperture magnification and the position of the shield 34 can be determined and operated. The flow at this time is shown in drawing 11. Fen_Xing 觞 7 The device is configured as shown in circle 12. 1 is a laser oscillator, 2 is a laser beam, 17 is an image conversion optical system, and 6 is an XY table 7 is the object to be processed, 8 is the mirror, and 9 is the NC device. The image conversion optical system 17 can change the position by the W survey device 15 and the distance between the image conversion optical system 17 and the object 7 It is also variable. The image conversion optical system of 17 is shown in circle U. 31 is a lens, 32 is a shield, 35 is Reflectance with variable curvature. Shield 32 and variable curvature mirror 17 -------- Γ -installed ------ order ----- (please read the notes on the back before filling in this Page) The paper standard of the Beigong Consumer Cooperative of the Ministry of Economic Affairs of the Ministry of Economic Affairs is applicable to the Chinese National Standard (CNS) A4 specification (210X 297mm) 3 8 4 3 7 The scale is applicable to the Chinese National Standard (CNS) Λ4 specification (210X297mm) 3 8 437 Α7 Β7 5. Description of the invention (18) 35 and the position of the object to be processed 7 The system is to image the shielded image to be processed at a certain magnification Position W on object 7. Secondly, the operation is explained as follows. According to equation [2], the badger can be obtained, f = dl X Μ / [1, M = d2 / dl, set a small magnification M *, that is, set a small workpiece When the beam diameter on 7 * is dl (the distance between the shield 32 and the variable curvature mirror) is a certain value, so d2 (the distance between the variable curvature reflection 35 and the workpiece 7) can be A small value to obtain a small magnification M * depending on the curvature of the variable curvature mirror 35 can be adjusted to form a focal length f corresponding to its magnification M. Therefore, when When the operator turns the aperture into the NC device, it is possible to determine the distance between the focal point of the variable reflection dysprosium 35 corresponding to the aperture magnification and the image transfer optics 17 and the object to be processed. The path is expressed in _ 14. Fen Ma Xingyan 8 The device is configured as shown in Figure 15. 1 is a flared oscillator, 2 is a flared beam, 17 is an image conversion optical system, and 5 is a condensing optical system , 6 is the XY table, 7 is the workpiece, 8 is the reflective dysprosium, 9 is the NC device, and 13 is the image conversion optical system 3 or the condensing optical system 5. Drive device that can be detached freely with the optical path between the processed objects. The image conversion optical system 17 can be formed with a variable position by the driving device 15, and the distance between the conversion optical system 17 and the workpiece 7 is also variable. The image of 17 is the same as that of optical transmission system 3. 5's condensing optics system is the same as _ ‘2 9. Next, the operation will be described as follows. There are 18 of the K devices in the Ji device of the NC device 9 -------- installed ------ ordered ---- ^ ^ (please read the precautions on the back before filling this page) Economy A7 B7 printed by Beigong Consumer Cooperative of Central Ministry of Industry and Commerce 5. V. Description of invention (19) The plural "conditions of processing small pieces, ie, the output of blasting, etc., can be based on the material, aperture or hole depth and hole of the object 7 to be processed Processing or cutting the processing content and S is the most appropriate processing condition. And should choose the processing content and aperture or hole depth, etc., like the conversion optical system or the condensing optical system, which is one of the processing systems and is pre-stored in the memory device of the NC device 9, the operator will process the method and aperture or When the hole depth is input to the HC device 9, the box HC device 9 can operate the transfer device U to automatically install any one of the image conversion optical system 17, the condensing optical system 5, and the laser oscillator and the workpiece between. When the image conversion optical system 17 is mounted, the focal length of the variable reflection dysprosium 35 corresponding to the aperture magnification and the distance between the image conversion optical system 17 and the workpiece 7 can be determined and operated. The flow at this time is pseudo-represented in Figure 16. The composition of the fl device is shown in _ 丨 7. 1 is a whistle beam oscillator, 2 is a ray beam, 18 is an image conversion optics, 6 is an XY table, 7 is a workpiece, 8 is a mirror, 9 is an HC device, and 18 is image conversion The optical system is shown in M 18. 31 is a transparent dysprosium, 34 is a shield whose position is changed by using a leg moving device 14, 36 is a suspect for retransmission, and 37 is a sound reflection. The variable position shield 34, the position of the dysprosium 34 and the workpiece 7 is based on lowering the beam from the anti-mirror mirror 37 to just below the fe lens, and imaging the shielded image on the workpiece at a certain magnification The position on 7 is false. Secondly, it will be described as F. When the light beam is reduced from the inspection mirror 3 7 F to the right below the f Θ through mirror 3 6 and obliquely downwards • It can be automatically controlled by the NC device 9 to form a certain screen. The optical path between the 34 and the 8 8 Dysprosium Fearfulness. At this time, the stream is expressed in IM6. The size of this paper is applicable to the Chinese National Standard (CNS) Λ4 specification (210X 297mm) ~ ~~~ 19 3 〇 4 〇 7 ^, installed-(please read the precautions on the back before filling in the book f)

*1T ί 级 經濟部中央橾準局員工消費合作社印装 本紙張尺度逡用中國國家標準(CNS ) Α4規格(210X297公釐) 3 8 4 3 7 A7 B7 五、發明説明(20 ) 謇_形«Μ 0 裝置構成為如鼸20所示。1為雷射振邇器、2為笛射光 束、18為像轉射光學糸絞、5為聚光光學糸统、6為XY工作 台、7為被加工物、8為反射鏑、9為M C裝置、13為可將像 轉射光學糸統18或聚光光學系統5任一糸统相對於笛射振 1器與被加工物間的光程而可自由裝卸之驅動裝置。 18之像轉射光學系铳與_18相同。5之聚光光學系统 則輿國2 9相同。 其次說明其動作如下。NC裝置9之記憶裝置中記憧有 複败個加工條件,即笛射_出等的條件,可根據對應被加 工物7的材質、孔徑戎孔深及孔加工成切斷加工之加工内 容而堪擇最壤當的加工條件。並對應該加工内容及孔徑或 孔深等選揮像轉射光學条铳戎聚光光學系統中適於加工之 一糸統而預先記憶於NC裝置9之記憶装置中•凿播作貝將 加工方法及孔徑戎孔深等_入NC裝置9時,可賴NC裝置9使 釀動装置13動作而自動將像轉射光學系統18或聚光光學 糸铳5之任一糸統裝著於笛射振徽器與被加工物之間。並 且在裝者像轉射光學糸統18時•使光束從驗霣反射鏑37下 降至ίθ透鑲36之正下方與斜向下方時,可ISNC裝置9自動 控制屏蔽34的位置而使屏蔽34及卩0进鏑36間形成一定之 距離•即使以驗霣反射«37掃描光束時亦不致在被加工物 7上肜成横襴之屏蔽34的像,即可形成一足的孔徑。此時 之流程係表示於_ 21。 富_形雔1 1 2 0 (請先閱讀背面之注意事項再填寫本頁) -裝 、1Τ 經濟部中央橾準局員工消費合作社印裝 A7 B7 五 '發明説明(21) 装置構成為如_22所示。1為雷射振邐器、2為笛射光 束、19為像轉射光學系統、6為XY工作台、7為被加工物、 8為反射鏑、9為NC裝置。 19之像轉射光學系铳表示於圖23 。38是藉_動装置 12而可變位置之透鏡、32為屏敲、33為透鏑。屏蔽32與透 鏡33與被加工物7的位置Μ係是某一倍率使屏蔽的像成像 於被加工物7上的位置鼷儀。 其次*說明其動作如下。可使位置可變透鐃沿著光袖 移動及變化屏蔽之光束人射俩之光束直徑而改變通過屏蔽 之光束的能量。例如在屏蔽上開設一直徑為的銷孔( pin hole)而Μ直徑2·*的光束照射屏蔽的銷孔時·能源之 穿透率為25¾ 。光束直徑為3··時能董之穿透率為11* 。 如上述•當位置可變«鏡38沿著光紬移勛時可調節加工面 上笛射的輸出。 HC裝置9之記憶裝置中記憶有*数個加工條件•即雷 射_出等的條件,可根據對應被加工物7的材«、孔徑或 孔深遘擇最適當之加工條件。並對«該笛射輸出《NC裝置 9使位置可變«鏡38沿著光蛐移動。旦位置可變透鏑38的 移動是Μ手勦進行。此時之一實豳例之流程是表示於鬮24 〇 譬胞形魄1 2 裝置構成為如_25所示。丨為笛射振«器、2為笛射光 束、19為像轉射光學系統、5為聚光光學糸統、6為ΧΥ工作 台、7為被加工物、8為反射鏡、9為N C裝董、13為可將像 本紙張尺度適用中國國家標準(CNS ) Α4说格(210X297公釐) ~ 7777^ I 1 3 〇 4 7 -------—裝-- (請先閱讀背面之注意事項再填荈本頁) 、1Τ 線 五、發明説明(22) A7 B7 0 振 射 -ΜΘ 於 對 相 方 - 任 5 統 糸 學 光 光 聚 或 9 11 統 學 光 射 轉 置 装 動 18 之 卸 裝 由 白 可 而 程 光 的 間 物Η 加 被 輿 器 像 之 同 相 3 2 _ 與 統 糸 學 光 射 轉 相 9 2 圈 與 則 統 糸 學 光 光 聚 之 同 下 如 作 動 其 明 說 次 其 有 憶 記 中 置 装 憶 記 之 9 置 裝 加内 或之將 被 工徑工 Μ 應加孔加作 對之 及於搡 據工容壤當 根加 内中, 可斷 工統中 . 切加系 置 件戒該學裝 條工 應光愤 的加對光記 等孔 並聚之 出及。或 9 輸 深件统 置 射孔條 系装 笛或 工學NC 即徑加 光於 , 孔的射憶 件、當 轉記 條質適 像先 工材最擇預 加的擇 遵而 個 7 選等统 數 物而深 系 複工 容孔一 使 9 置 装 C Ν0 可 時 9 置 裝 C Ν 入 输 等 深 孔 戎 徑 孔 及 法 方Η 加 系 學 光 光 聚 或 9 H 统 糸 學 光 射 轉 像 將 動 § 而 作 動 3 置 装 動 鼷 且 並 ο 間 之 物Η 加 被 與 器 盪 振 射 笛 於 著 裝 統 系1 任 之 5 统 裝 C Η 藉 而 出 輸 之 射 笛 應 對 可 時 9 il 統 糸 學 光 射 轉 像 著 裝 在 銳 透 變 可 置 位 且 Ο 動 移 袖 光 著 沿 8 3 鏡 通 變 可 置 位 使 9 置 6 2 圔 如 偽 程 流 之 時 此 ο 之 行 進 動 手Μ 可 亦 貝 作 搡 為 動 移 的 示 所 ^ I -- (請先閱讀背面之注意事項再填荈本頁) -59 f 經濟部中央橾準局貝工消资合作社印袈 粜 效 明0 0 效 之 載 記 所 F Μ 成 達 可 而 成 構 之 述 上 於 由 明 發 本 微 更 行 進 可 統 糸 學 光 光 聚 較 統 系 學 光 射 轉 像 於 由 據 根 進 眭 更 統 學 光 射 轉0 較 則 統 糸 學 光 光 « 而Η 加 的 孔 光 光 聚 及 統 系 學 光 射 轉 像 用 兼 明 發 本 此 因Η 加 之 孔 深 行 束 光 的 度 深 。 黏 域 焦 領之 工 切 加深 之可 深要 孔須 S: 時 徑 _ 孔 切 大板 擴基 此線 輔配 可在 而 , 統又 系 學 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X 297公釐) 3 8 4 3 7 A7 B7 五、發明説明(23) -,因此從聚光光學系铳較像_射光學系統可獲得較深焦點 經濟部中央橾準局員工消费合作社印裝 學 鱗上 面形像徑間 及變止所光 更的被被元被 光 連面 物工成直時 雛纜防時上 統狀與變單因 光 可物 工加與束的 距連可化面 糸形統改每止 聚 而工 加等置光須 的徑此變物 學工系缅以防 與 化加 被徑位的所 間直因束工 光加學連是可 铳。赛被 在孔蔽上時 物束,光加 光等光而統而 糸 Η 的短 統 Η 屏面化 工光用上被 聚搜射化¾位 學加距鎺 系加ii物變 加上作面化 較孔轉變學傾 光孔焦以 學可可工徑 被面元物變 統 Η 像的光的 射與之可 光大 ,加直 輿物單工短 糸加鳝距射 W 轉工縝且 光擴中被束 統工每加縮 學可可焦轉光 像加射 , 聚可統變光 糸加以被此 光大 ,鏡it之 用斷 反徑。較 而系 改之 學被 是因轉 射擴 中射 a 蔽 兼切像直間統 ·學續上 光使統止可 _ 可統 反並屏 知之成束時系 徑光連 面 射可 系防並 像而系 像 ,止 獲度與光的學直射可物 轉 ,學 可。 。上 ,學成«防 可密置的要光束轉而工 像時光而化間面徑光與直可 , 精位上 須射光 像化加 變 距射位 劣時物 直射 離束此 點高蔽面所轉的在變被 改焦轉偏的的 工束轉距光因 乙行屏物化像小並的使 當的像的度須加光is的的 , 束進使工變.更。距短 ,鏡於輸精所在的在間上用 光可,加徑外得圍焦缩 者射由光工時,小並之面作 之時又被直此獲範鏑可 再反且之加徑又得。物物位 度統 化束 能的射並 像 ,蔽成直 獲_ 工工單 深糸 變光 上吠反 ,。 成化屏造束 能範加加為 --------C -裝------訂------^级 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 23 3 8 4 3 7 經濟部中央標準局負工消費合作社印裝 A7 B7 五、發明説明(24) 加工物面上光束變化時所造成加工精度的劣化。並可賴此 鏞短變化被加工物面上光束直徑時所領的時間。 又,在像轉射光學糸统中,由於可變之屏蔽位置而可 防止使用驗轚反射鏡及ίθ透鏡時加工精度的劣化。 又,像轉射光學糸統較聚光光學系铳更能在被加工面 上獲得小的光束直徑,因此可擴大可加工之孔徑等加工形 吠的範圍。且於像轉射光學糸統中,由於可變之屏蔽位置 而可藉此防止使用驗電反射箱及透鏑時加工精度之劣 化。 此外,像轉射光學糸統中.笛射振盪器的動作在播定 之額定_出附近的狀慇下,於加工面上獲得播定之低输出 而形成可高精度加工者。 再者,由於兼用像轉射光學系統及聚光光學系統而擴 大可加工之孔徑及孔深的領域,且於像轉射光學系絞中, 笛射振徽器的動作在穩定之額定輸出附近的狀態下,可於 加工面上獲得穩定之低输出而形成高精度之加工者。 謹忒夕CT ffl說明 H1為本發明第1及第2實豳肜態之笛射加工櫬之構 成_。 _2為本發明第1實拖肜戆之控制方法之流程_。 繭3為本發明第2實胞肜戆之雷射加工機之構成Η。 Η4為本發明第2實豳形戆之控制方法之浼程 _5為本發明第3實胞形戆之控制方法之流程1Β。 _6 4本發明第4實豳肜戆之倥糾方法之潦程圏。 本紙張尺度遑用中國國家標準(CNS ) Α4規格(210ΧΜ7公釐) ~ ΓΤΤΤ^ (請先閱讀背面之注意事項再填寫本頁) 裝 '1Τ 320585 A7 B7 經濟部中央橾隼局貝工消費合作社印策 五、發明説明( 25 ) 圈 7為 本 發 明 第 5 實 m 形 態 之 雷 射 加 工 櫬 之 m 成 圔 〇 圖 8為 本 發 明 第 5 及 第 6 實 胞 形 m 之 像 轉 射 光 學 % 统 之 構 成 圔° 圏 9為 本 發 明 第 5 竇 形 態 之 控 制 方 法 之 流 程 画 〇 讕 10為 本 發 明 第 6 霣 陁 形 態 之 雷 射 加 工 櫬 之 構 成 圈 0 圈 1 1為 本 發 明 第 6 實 施 形 m 之 控 制 方 法 之 滾 程 H 0 _ 1 2為 本 發 明 第 7 實 拖 形 態 之 笛 射 加 工 懺 之 構 成 豳 0 圏 1 3為本發明第7及第8 實拖形態之像轉射光學糸統 之 構 成 钃° Η 1 4為 本 發 明 第 7 實 胞 形 態 之 控 制 方 法 之 潦 程 鬮 〇 ia 1 5為 本 發 明 第 8 實 施 形 m 之 雷 射 加 工 櫬 之 構 成 _ 〇 画 16為 本 發 明 第 8 霣 m 形 戆 之 控 制 方 法 之 流 程 鬮 0 圖 1 7為 本 發 明 第 9 實 胞 形 態 之 雷 射 加 工 機 之 構 成 圔 0 m 18為 本 發 明 第 9 及 第 1 0 實 胞 形 態 之 像 轉 射 光 學 糸 統 之 構 成 圔。 圖 19為 本 發 明 第 9 實 胞 形 態 之 控 制 方 法 之 m 程 圖 0 圖 20為 本 發 明 第 1 0實 施 形 態 之 雷 射 加 工 機 之 構 成 m 0 m 2 1為 本 發 明 第 10實 胞 形 戆 之 控 制 方 法 之 敬 程 園 0 圈 22為 本 發 明 第 1 I實 拖 形 m 之 笛 射 加 工 機 之 構 成 黼 0 m 23為 本 發 明 第 1 1及 第 12 實 豳 肜 態 之 慊 轉 射 光 學 糸 統 之 構 成 讕。 m 24為 本 發 明 第 1 1實 胞 肜 態 之 控 制 Η 法 之 程 _ 0 m 2 5為 本 發 明 第 1 2實 豳 形 態 之 雷 射 加 工 櫬 之 構 成 _ 0 钃 2 6為 本 發 明 第 1 2實 豳 肜 態 之 倥 制 Η 法 之 流 程 _ 〇 本紙張尺度逋用中國國家揉準(CNS ) Λ4規格(21 OX 297公釐) A7 B7 五、發明説明(μ) H27為多曆印刷基板之剖視曬。 鼸28為習知笛射加工櫬之構成圏。 圖29為習知聚光光學糸統之構成函。 圈30為習知雷射加工機之構成。 國31為習知像轉射光學系統之構成圖。 鼷32為某材質之聚光光學糸铳反像轉射光學糸統之可 加工領域。 _33為習知笛射加工橢之構成鬮。 圔34為使用習知霣流縝之像轉射光學系統之構成鼷。 圔3 5為表示使用習知霣流嫌與透銳時光程畏度之 僱位圃。 ---------装-- (請先閱讀背面之注意事項再填艿本頁) 符賊說明 1 雷射振1器 3 像轉射光學系铳 6 XY工作台 8 反射鏑 7 9 雷射光束 聚光光學系統 被加工物 *11 經濟部中央標準局員工消費合作社印袈 0246813 5 11111333 * 5 射 _ 動像轉縝射率霣鏑光 反驅 _ 影像透轉曲驗通« 統 系統 學条 光學 置置射光 鏞装裝轉射 鏡 射 嫌反鏞 射變射 篇 反可反 δ 統統 系系 蔽 學學 屏 置置置光光 變 装装装射射 可 動動動轉轉蔽置 Hillli像像屏位 1 3 5 7 9 2 4 1 1 1 n 1 3 3 鏡 透 鏡 进器 變波 可 Λ 童間 位空 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公t ) 26 3 8 4 3 7* 1T ί Level Ministry of Economic Affairs Central Consumers ’Bureau Cooperative Staff Cooperative Printed Paper Scale Use Chinese National Standard (CNS) Α4 Specification (210X297mm) 3 8 4 3 7 A7 B7 V. Description of Invention (20) 謇 _ 形The «Μ 0 device is configured as shown in 鹸 20. 1 is a laser vibrator, 2 is a flared beam, 18 is an image conversion optics, 5 is a condensing optical system, 6 is an XY table, 7 is a workpiece, 8 is a reflective dysprosium, 9 is The MC device 13 is a driving device that can freely mount and dismount the image conversion optical system 18 or the condensing optical system 5 with respect to the optical path between the whistle vibrator 1 and the object to be processed. The image conversion optical system of 18 is the same as _18. The condensing optical system of 5 is the same as that of other countries. Next, the operation will be described as follows. In the memory device of the NC device 9, there are recorded processing conditions, that is, the conditions such as flute shot_out, etc., which can be processed according to the material, aperture diameter and hole processing of the processed object 7 into the cutting process. The most suitable processing conditions can be chosen. And should be processed content and aperture or hole depth, etc., select the image conversion optical strip, the Rongrong condensing optical system, which is suitable for processing. It is pre-stored in the memory device of the NC device 9. The cutting method and aperture荣 孔 深 等 _When entering the NC device 9, the NC device 9 can operate the brewing device 13 to automatically install any one of the image conversion optical system 18 or the condensing optics 5 to the flute vibration emblem. Between the processed object. And when the image of the installer is transferred to the optical system 18, when the light beam is lowered from the ytterbium reflection dysprosium 37 to directly below and obliquely below the Θθ translucent 36, the position of the shield 34 can be automatically controlled by the ISNC device 9 to make the shield 34 And a certain distance is formed between the dysprosium 36 and even if the «37 scanning beam is reflected by the inspection test, the image of the shield 34 on the workpiece 7 is not hovered, and a full aperture can be formed. The flow at this time is shown in _21.富 _ 形 雔 1 1 2 0 (please read the precautions on the back and then fill out this page)-installed, 1T printed by the Central Consumer ’s Bureau of the Ministry of Economic Affairs Employee Consumer Cooperative A7 B7 Five 'Invention Description (21) The device is configured as such_ 22 is shown. 1 is a laser vibrator, 2 is a flute beam, 19 is an image conversion optical system, 6 is an XY table, 7 is a workpiece, 8 is a reflective dysprosium, and 9 is an NC device. The image conversion optical system of 19 is shown in Fig. 23. 38 is a lens whose position can be changed by the moving device 12, 32 is a screen knock, and 33 is a transparent dysprosium. The position M of the mask 32, the lens 33, and the workpiece 7 is a position meter where the shielded image is formed on the workpiece 7 at a certain magnification. Secondly, the operation is explained as follows. The position of the variable-transmissible laser can be moved along the optical sleeve and the beam diameter of the shielded beam can be changed to change the energy of the beam passing through the shield. For example, when a pin hole with a diameter of 2 mm is opened on the shield and the beam with a diameter of 2 · * illuminates the shielded pin hole, the energy penetration rate is 25¾. When the beam diameter is 3 ··, the penetration rate of Neng Dong is 11 *. As described above • When the variable position «mirror 38 moves along the light axis, the output of the shot on the processing surface can be adjusted. The memory device of the HC device 9 memorizes * several processing conditions, that is, laser_out conditions, etc., and the most suitable processing conditions can be selected according to the material of the object 7 to be processed, the hole diameter, or the hole depth. And the output of "the NC device 9 makes the position variable" mirror 38 is moved along the optical cricket. Once the position of the variable dysprosium 38 is moved, it is carried out manually. At this time, the flow of a practical example is shown in Yu Jian 24. For example, the cell structure 1 2 is configured as shown in _25.丨 Flame vibration device, 2 is the ray beam, 19 is the image conversion optical system, 5 is the condenser optical system, 6 is the XY table, 7 is the workpiece, 8 is the mirror, 9 is the NC The installation director, 13 is to apply the Chinese paper standard (CNS) Α4 said standard (210X297mm) ~ 7777 ^ I 1 3 〇4 7 --------- installation (please read first Note on the back and then fill this page), 1T line 5. Invention description (22) A7 B7 0 振 射 -ΜΘ on the opposite side-ren 5 糸 学 光光 聚 或 9 11 体 学 光光 转 转动 动18 is unloaded by Bai Ke and Cheng Guang's intermediary Η plus the same phase of the image of the public device 3 2 _ in phase with the Tongshi Xueguang shot 9 2 circles and then the same Shitou Xueguang light gathering together as if it is clear. There are 9 installations in the memory of the memory, or they will be added to the hole by the diameter of the tool. The hole should be added to the right. According to the working capacity, the root of the root can be broken, and the system can be broken. Chejia The fittings or the fittings should be indignantly added to the holes such as Guangji and brought together. Or 9 for the deep parts, the perforated strip is installed with a flute or the engineering NC, that is, the diameter is added to the light, the perforated piece of the hole, when the transfer strip quality is suitable for the first material, the most pre-selected choice, and the 7 choices Waiting for the statistical data and the deep-recovery of the first hole, the 9 is equipped with C Ν0, and the 9 is equipped with C Ν. The shot turns like a move § and the action 3 installs the moving objects and the other things Η plus is oscillated with the device to oscillate the whistle in the clothing system 1 of any 5 uniforms C Η the whistle taken out by the response to the time 9 il 絸 学 学 光 射 像 Dressed in sharp and translucent can be set and motility sleeves can be set along 8 3 Mirror pass variable can be set to make 9 set 6 2 When the flow of pseudo process is like this Yi Bei Zuo Shao is an indicator of movement ^ I-(please read the precautions on the back before filling in this page) -59 f Ministry of Economic Affairs Central Bureau of Industry and Commerce Beigong Consumers ’Cooperative Cooperative Insignia 0 0 effect The description of the structure of the record of F Μ Cheng Dak can be described by Yu Mingfa More progress can be achieved through the integration of the system's light-convergence than the system-based light-transformation. From the root-based system, the system-based light-conversion can be compared to the system-based light-conversion. It is because of the fact that H is combined with the depth of the hole and the depth of the beam is deep. The deeper and deeper holes required for the work-cutting and deepening of the sticky collar of the sticky domain must be S: time diameter _ hole-cutting large plate expansion base. This line can be equipped with auxiliary equipment, and the paper size is applicable to the Chinese National Standard (CNS) Α4 specification ( 210X 297 mm) 3 8 4 3 7 A7 B7 5. Description of the invention (23)-Therefore, it can be obtained from the condensing optics system _ shot optical system can get a deeper focus Printed by the Central Consumers ’Bureau of the Ministry of Economic Affairs Employee Consumer Cooperative The shape of the image above the scale and the change of the light are changed by the light-connected object into a straight line. It is necessary to change the path of the light-giving whisker for each stop of the polymerization and the processing and other equipment. This is to prevent the direct connection between the beam and the light and the connection between the beam and the light. When the game is covered in the hole, the object beam, light plus light and other light are unified and the short system Η screen surface chemical light is collected and searched by ¾ position learning distance from the system and the object is added to the surface The conversion of the hole is based on the conversion of the hole and the focus of the hole. In order to learn the cocoa diameter, the light emitted by the image of the facet is changed. The light of the image is larger than that of the light, and the straight object is simple. Every time the beam is integrated, the coke is converted into a light image, and the poly variable light is added to this light, and the mirror is used to break the reverse path. The reason for the system reform is that it is due to the conversion and expansion of the mid-range shot. A masking and tangent direct system. The continuation of the glazing makes it possible to stop the system._ It can be reversed and the screen is known. It is similar to the image, the learning of the degree of interception and light can be transferred directly, and the learning can be. . On the top, learn «Anti-tightenable to turn the light beam to the image time and the surface diameter and light can be changed, the precise position must be irradiated with light imaging plus variable distance shooting position when the object is directly off the beam at this point. The rotating beam of the power beam that has been changed in focus and deflected due to the fact that the physical image of the B-line screen is small and the appropriate image intensity must be added to the light is. The distance is short, the mirror can be used for light in the middle of the insemination, and the extra-focused person can be shot by the light working hours, and when the small face is made, it can be directly obtained by Fan Dy. Got again. The material level is unified with the beam energy and the image is covered in a straight line. The Chenghua screen beam energy can be added as -------- C-installed ------ ordered -------- ^ (please read the precautions on the back before filling this page) This The paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) 23 3 8 4 3 7 Printed A7 B7 by the Consumer Labor Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Description of invention (24) When the beam on the processed object changes Causes deterioration of processing accuracy. It can also depend on the time taken to change the beam diameter on the processed object. In addition, in the image conversion optical system, due to the variable shielding position, it is possible to prevent the deterioration of the processing accuracy when the inspection mirror and theta lens are used. In addition, the conversion optical system can obtain a smaller beam diameter on the surface to be processed than the condensing optical system. Therefore, the range of processing shapes such as the aperture that can be processed can be expanded. Moreover, in the image conversion optical system, due to the variable shielding position, it is possible to prevent the processing accuracy from deteriorating when using the electroscope reflector and dysprosium. In addition, as in the transmission optical system, the action of the whistle oscillator is in the vicinity of the rated rated output, and the low output of the broadcast is obtained on the processing surface to form a high-precision processor. In addition, because of the combined use of the image conversion optical system and the condensing optical system, the field of apertures and depths that can be processed is expanded, and in the image conversion optical system, the action of the whistle oscillator is near the stable rated output In the state of, can obtain stable low output on the processing surface and form a high-precision processor. Notes to CT ffl H1 is the composition of the first and second real whispering process of the present invention. _2 is the flow of the first real procrastination control method of the present invention_. Cocoon 3 is the configuration of the second real cell laser processing machine of the present invention. Η4 is the second process of the control method of the second embodiment of the present invention _5 is the process 1B of the third control method of the embodiment of the present invention. _6 4 The fourth method of the present invention is the correct method of correction. This paper uses the Chinese National Standard (CNS) Α4 specification (210ΧΜ7mm) ~ ΓΤΤΤ ^ (please read the precautions on the back and then fill out this page) to install '1Τ 320585 A7 B7 Ministry of Economic Affairs Central Falcon Bureau Beigong Consumer Cooperative Seal Policy V. Description of the Invention (25) Circle 7 is the 5th real m form of the laser processing of the present invention. FIG. 8 is the image conversion optics of the 5th and 6th real cell form m of the present invention. Composition 9 ° is the flow chart of the 5th sinus morphology control method of the present invention. 10 is the 6th morphology of laser processing of the present invention. The circle 0 circle 1 1 is the sixth embodiment of the invention. The rolling method of the control method H 0 _ 1 2 is the composition of the 7th real drag form of the present invention. The 0 3 1 is the image conversion optical system of the 7th and 8th real drag form of the present invention. The composition of °° Η 1 4 is the seventh control method of the actual cell morphology of the present invention顄 〇ia 15 is the eighth embodiment of the present invention, the shape of the laser processing 椇 composition _ 〇 16 is the present invention, the eighth m shape control method flow 0 0 Figure 17 is the ninth real cell of the invention The configuration of the laser processing machine of form 0 m 18 is the structure of the image conversion optical system of the ninth and tenth real cell forms of the present invention. FIG. 19 is a m-process chart of the ninth real cell form control method of the present invention. FIG. 20 is a configuration of a laser processing machine according to the tenth embodiment of the present invention. M 0 m 2 1 is the tenth real cell form of the present invention. Jing Chengyuan 0 circle 22 of the control method is the composition of the first I tow-shaped masticating machine of the present invention. 0 m 23 is the first, first and twelfth embodiment of the present invention. The composition is flat. m 24 is the 1st 1st state of the present invention to control the state of the H-method_ 0 m 2 5 is the 1st 2nd form of the present invention of the laser processing configuration _ 0 钃 2 6 is the 1st of the present invention 2 The process of making H method in real state _ 〇The paper size is based on the Chinese National Standard (CNS) Λ4 specification (21 OX 297 mm) A7 B7 5. Description of the invention (μ) H27 is a multi-calendar printed circuit board Sectional drying. Man 28 is a constituent of the traditional flute shooting process. Fig. 29 is a composition of the conventional condensing optical system. The circle 30 is a structure of a conventional laser processing machine. Country 31 is a composition diagram of a conventional image conversion optical system. Nao 32 is a processable field of the condensing optics of a certain material, which is the reflection image conversion optical system. _33 is the composition of the conventional ellipsoid processing ellipse.圔 34 is a component that uses a conventional optical image conversion optical system.圔 3 5 is an employment place that indicates the use of conventional knowledge and the fear of sharp time. --------- install-- (Please read the precautions on the back before filling this page) Explanation of the thief 1 Laser vibration 1 device 3 Image conversion optical system 6 XY table 8 Reflective dysprosium 7 9 Laser beam condensing optical system processed object * 11 Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs Printed 0202213 5 11111333 * 5 System Articles Optics Set-up Optoelectronics Equipped with Conversion Mirror Mirrors Anti-prosthetic Transformable Articles Reversible δ All systems and systems of the science of science and technology set-up Optoelectronics Optical Modified Equipmen Image screen position 1 3 5 7 9 2 4 1 1 1 n 1 3 3 Mirror lens into the wave can be changed Λ Children's space space The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 g) 26 3 8 4 3 7

Claims (1)

8 8 8 8 abcd 320585 經濟部中央榡準局属工消費合作社印製 六、申請專利範圍 1 | 1 . 一 種 雷 射 加 工 裝 置 係 具 谢 : 具 有 插 入 笛 射 振 盥 器 與 1 I 被 加 X 物 間 之 光 程 中 的 屏 蔽 及 使 該 屏 蔽 的 像 縮 小 成 像 1 1 於 加 工 面 的 m 縯 之 像 轉 射 光 學 % 铳 ; 聚 光 光 學 % 統 > ^—> 1 1 請 1 1 可 m 擇 前 述 像 轉 射 光 學 糸 統 與 前 述 聚 光 光 學 系 統 任 一 先 閲 1 I 1 I 系 統 之 選 擇 裝 置 ; 及 控 制 前 述 像 轉 射 光 學 系 統 與 ^ j. 刖 背 fj 1 | 之 1 述 聚 光 光 學 系 铳 與 前 述 m 擇 % 统 之 NC裝 置 : 而 對 應 於 意 1 事 1 加 工 孔 徑 與 孔 深 選 擇 前 述 像 轉 射 光 學 系 統 及 前 述 聚 光 項 再 1 一 填 光 學 系 铳 之 任 一 糸 统 為 特 徽 者 0 % 裝 頁 1 2 ·— 棰 m 射 加 工 裝 置 係 具 備 具 有 插 入 茵 射 振 灌 器 與 1 被 加 X 物 間 之 光 程 屮 的 屏 蔽 及 使 該 屏 蔽 的 像 縮 小 成 像 1 1 於 加 工 面 的 透 鏡 之 像 轉 射 光 學 系 統 聚 光 光 學 .系 统 1 I 1 可 選 擇 前 述 像 轉 射 光 學 % 統 與 前 述 聚 光 光 學 系 統 任 一 訂 I 糸 統 之 m 擇 裝 置 及 控 制 刖 述 像 轉 射 光 學 糸 統 與 前 1 1 述 聚 光 光 學 系 統 與 前 述 選 擇 糸 统 之 NC 装 置 而 對 應 1 1 1 鑽 孔 與 槽 加 工 及 外 形 切 m 加 I 等 的 加 工 内 容 而 m 擇 前 1 I, 線 述 像 轉 射 光 學 系 統 及 前 述 聚 光 光 學 糸 統 之 任 —— % 统 Ά 1 特 激 者 0 1 1 3 ,— 種 雷 射 加 工 裝 t 係 具 備 ; 具 有 插 入 笛 射 振 激 器 與 1 1 被 加 工 物 間 之 光 程 屮 的 位 Μ 可 變 屏 蔽 及 使 該 屏 蔽 的 像 1 I 縮 小 成 像 於 加 工 面 的 曲 率 6J m 反 射 鏑 之 像 轉 射 光 學 系. I 1 | 铳 及 控 制 該 像 轉 射 光 學 % 統 之 NC装 置 而 對 應 於 孔 1 1 徑 控 制 前 述 曲 率 可 變 射 銕 之 曲 率 a 前 述 m m 位 置 1 1 特 微 者 〇 1 1 4 * 一 禰 笛 射 加 I 裝 置 係 具 備 » 具 有 插 入 雷 射 抿 通 器 與 1 1 本紙張尺度適用中國國家#準(CNS ) A4洗格(210X297公釐) 27 3 8 4 3 7 A8 B8 C8 D8 經濟部t央揉率局貝工消費合作社印製 六、申請專利範圍 1 I 被 加 工 物 間 之 光 程 中 的 位 置 可 變 屏 蔽 及 使 該 屏 m 的 像 1 1 m 小 成 像 於 加 工 面 的 曲 率 可 變 反 射 鏡 之 像 轉 射 光 學 % 1 1 統 • • 聚 光 光 學 % 絞 • m 擇 前 述 像 轉 射 光 學 % 统 與 前 述 1 | 聚 光 光 學 糸 铳 任 一 % 統 之 m 擇 裝 置 ; 及 » 控 制 前 述 像 請 閲 背 1 1 m 射 光 學 系 统 與 前 述 聚 光 光 學 糸 統 與 前 述 選 揮 系 统 之 1 1 NC裝置 當 凿 擇 前 述 像 光 學 糸 统 時 對 麽 於 孔 徑 控 m ί 事 項 再 填 寫 本 1 1 I 前 〇 述 曲 率 可 變 反 射 鏡 的 曲 率 及 前 述 屏 蔽 位 置 為 特 激 者 1, 裝 I 5 * 一 種 雷 射 加 工 装 置 係 具 拥 : 具 有 插 入 笛 射 振 盪 器 與 頁 '—^ 1 1 被 加 工 物 間 之 光 程 中 的 屏 蔽 及 使 該 U 蔽 的 像 縮 小 成 像 1 I 於 加 工 面 的 曲 率 可 變 反 射 鏡 及 可 使 加 工 面 與 刖 述 曲 率 1 I 可 變 反 射 m 間 距 離 變 化 的 可 變 裝 置 所 構 成 之 像 轉 射 光 1 訂 1 學 系 統 孔 徑 控 制 前 述 曲 率 可 變 反 射 鏑 及 刖 述 加 工 1 1 t 面 與 荊 述 曲 率 及 控 制 該 像 轉 射 光 學 系 统 之 NC装 置 : 而 1 1 對 應 於 孔 徑 控 m 可 變 反 射 鏑 之 曲 率 及 前 迷 加 工 面 與 1 卜 前 述 曲 率 可 變 反 射 鏑 間 之 距 離 為 持 激 者 〇 線 1 6 . 一 種 霤 射 加 I 裝 置 係 具 谢 • 具 有 插 入 雷 射 振 盪 器 與 1 I 被 加 工 物 間 之 光 程 中 的 屏 蔽 及 使 該 m 蔽 的 像 縮 小 成 像 1 1 I 於 加 工 面 的 曲 率 可 變 反 射 鏡 之 像 轉 射 光 學 系 統 聚 光 I 1 光 學 統 * 可 m 擇 前 述 m 像 轉 射 光 學 % 铳 與 前 述 聚 光 1 1 光 學 統 任 一 系 統 之 m 揮 裝 置 > 控 m -mJL, 刖 述 倣 轉 射 1 1 光 學 系 統 與 前 述 聚 光 光 學 % 統 輿 前 迷 擇 糸 統 之 HC裝 1 1 置 : 當 發 揮 前 述 m 光 學 % 統 時 , 對 應 於 孔 徑 控 制 前 迷 1 1 曲 率 可 變 反 射 m 的 曲 率 » 及 前 述 加 工 面 與 前 述 曲 率 "I 1 1 1 28 本紙伕尺度逋用中困國家橾準(CNS ) A4洗格(210 X 297公釐) TWTTT A8 B8 C8 D8 六、申請專利範圍 … 變反射鏡之間的距離為特激者。 7. —棰雷射加工装置,係具備:具有插入雷射振置器與 像 的 蔽 屏 該 使 及 蔽 屏 變 可 置 位 的 中 程 光 之 間 物Η 加 被 糸 學 光 射 轉 像 之 鑌 射 反 變 可 率 曲 的 面Η 加 於 像 成 小0 鏡 透 於 對 相 當 置 装 C Ν 之 統 糸 學 光 射 轉 像 該 制 控 及 統 制 控 藉 而 角 射 入 於 應 對 時 射 入 束 光 射 雷 使 角 斜1Μ 修置 而裝 置工 位加 蔽射 屛笛 迷種 前 一 8 者 微 特 為 播 孔 其 正 與 器 锻 振 射 笛 入 插 有 具 備 具 係 像 的» 該 使 及00 變 可 置 位 的 中 程 光 之 間 物Η 加 被 光 光 聚 統 糸 學 光 射 轉 像 之 鏡m 的 面Η 加 於 像 成 小 鑲 統 糸 學 任 統 糸 學學 光光 光射 聚轉 述像 前述 與 前 統制 系控 學 , 光及 射 ., 轉置 像裝 述擇 前 選 擇之 選統 可糸 : 而 置角 裝射 HC人 之 於 統磨 糸 對 擇 ’ 選時 述統 前 糸 與學 统光 糸 射 學轉 光學 光光 聚像 述述 前 前 與擇 統選 糸 雷 者 徹 特 為 徑 孔 其 £ 修 置 位 蔽 屏 述r 制 控 輻 與 器 盪 振 射 笛 入 插 有 具0 具 係 置 裝Η 加 射 笛 種1 9 (請先閲讀背面之注意事項再填寫本頁) -f -裝· -1T 經濟部十央櫺準局男工消費合作社印«- 像 成、 編 像 的Μ 0 . 該統 使糸 及學 蔽光 屏射 的轉 屮像 程之 光銳 之透 間的 物面 工 Η 加 加 被於 射 轉 像 該 制 控 及 Nf徑之 之直上 統束面 糸光工 學射加 光雷節 侧 調 射並 入 · 束 Μ 光能 射的 笛蔽 之 屏 蔽述 屏 前 述過 前通 賴節 可 調 : 化 置變 装的 者 激 特 為 t 胩 統 糸 學 光 光 聚 統 糸 學 光 具屏射 偽的轉 , 中 像 Μ 程之 裝光縝 工之 通 加間的 射物面 笛 工工 械加加 一 被於 與像 器成 醴小 振編 射像 留的 入蔽 插W 有該 具使 : 及 備M 本紙張尺度逍用十國國家揉準(CNS ) A4洗格(210 X 297公釐) 29 A8 B8 C8 D8 申請專利範圍 可堪擇前述像轉射光學系統與前述聚光光學系铳任一 前前光陡 輿擇射的 統遴雷蔽 糸當之屏 學:蔽述 光置«前 射裝述過。 IIHC前通者 像之 縈節微 述铳 可調特 前系 其化為 制擇,變 S 控選 時的能 , 述 統徑之 及前 系 直上 .,與 學束面 置統光光工 裝系 射射加 擇學轉笛節 S 光學側調 之光 光射並 統聚像 入, 糸述 述束量 -------^ ' 裝-- (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部中央梂準局貝工消費合作社印装 本紙張尺度逍用中國國家棵準(CNS ) A4洗格(210X297公釐) 3 8 4 3 78 8 8 8 abcd 320585 Printed by the Industrial and Consumer Cooperative of the Central Bureau of Economics of the Ministry of Economic Affairs VI. Patent application scope 1 | 1. A laser processing device is attached. Xie: It has an insert flute and a vibrator and 1 I to be added X Shielding in the optical path between and reducing the image of the shielding image 1 1 m-like image conversion optics on the processing surface Conversion optics; condensing optics% system > ^ — > 1 1 please 1 1 optional m Any of the aforementioned image conversion optical system and the aforementioned condensing optical system. 1 I 1 I system selection device; and the control of the aforementioned image conversion optical system and the ^ j. 刖 背 fj 1 |銳 and the above-mentioned m optional% of the NC device: and corresponding to the meaning of one thing 1 processing aperture and hole depth, select the aforementioned image conversion optical system and the aforementioned condensing item and then fill the optical system 铳 any task Ito is a special emblem. 0%. Page 1 2 · — The ray shooting device is equipped with a shield with an optical path inserted between the X-ray irrigator and an object to be added X, and the image of the shield is reduced and imaged 1 1 Condensing optics of the image conversion optical system of the lens on the processing surface. System 1 I 1 can choose any of the aforementioned image conversion optical system and the aforementioned condensing optical system. I choose the optional device and control image of the system Conversion optical system and the front 1 1 The condensing optical system corresponds to the aforementioned NC device of the selection system and corresponds to the processing content of 1 1 1 drilling and groove processing and shape cutting m plus I and m selects the front 1 I, line The image conversion optical system and any of the aforementioned condensing optics systems-% system Ά 1 special exciter 0 1 1 3, a laser processing equipment t system; with an inserted flute laser exciter and 1 1 plus The position of the optical path between the objects is variable and the shielding image 1 I is reduced to the curvature of the imaged processing surface. 6J m reflective dysprosium image conversion optics. I 1 | 铳 and control the image conversion optics % The conventional NC device corresponds to the hole 1 1 diameter to control the curvature of the aforementioned variable curvature laser a aforesaid mm position 1 1 extraordinary 〇1 1 4 * A thy flute plus I device is equipped with »Inserted laser channel The device and 1 1 paper scale are applicable to the Chinese national standard #CN (CNS) A4 wash grid (210X297 mm) 27 3 8 4 3 7 A8 B8 C8 D8 Printed by Beigong Consumer Cooperative, Ministry of Economic Affairs Range 1 I Variable position shielding in the optical path between the processed objects and the image conversion optics of the curvature variable mirror that makes the screen m image 1 1 m small on the processing surface% 1 1 System • Condenser Optical% twist • m Select the aforementioned image conversion optical% system and the aforementioned 1 | Spotlight Select the appropriate device for any of the system; and »For the control of the aforementioned image, please refer to the 1 1 NC device of the 1 1 m projection optical system and the aforementioned condensing optical system and the aforementioned selective optical system. At the same time, fill in the details of the aperture control m ί. 1 1 I The curvature of the variable curvature mirror and the shielding position mentioned above are for the extreme shocker 1, equipped with I 5 * A laser processing device is equipped with: Insert the radiating oscillator and the page '— ^ 1 1 The shielding in the optical path between the processed object and reduce the image of the U-shielded image 1 I The variable curvature mirror on the processing surface and the processing surface and the description Curvature 1 I. Variable reflection m. The image is composed of a variable device that changes the distance. The aperture of the system is controlled by the aperture of the system. The curvature of the variable reflection dysprosium and the description processing 1 1 t surface and the curvature of the image and the control of the image rotation NC device of the shooting optical system: 1 1 corresponds to the curvature of the variable-reflective dysprosium with aperture control m and the distance between the front surface and the processing surface and the variable curvature dysprosium with the aforementioned curvature is the stimulus line 1 6. A glide plus I device is equipped with Xie • has Shielding inserted in the optical path between the laser oscillator and the object to be processed and reducing the image of the m-shielded image 1 1 I Image conversion optical system of a variable curvature mirror on the processing surface Condensing I 1 Optics System * The m image conversion optics can be selected from the above-mentioned m image conversion optics and the above-mentioned condensing 1 1 m-wave device of any system of the optical system > control m -mJL, which describes the pseudo-transition 1 1 optical system and the above-mentioned concentrating optics% The HC device of the front and front fans selects the HC device 1 1 set: when the aforementioned optical% system is used, the curvature corresponding to the aperture control front 1 1 curvature variable reflection m »and the aforementioned processing surface and the aforementioned curvature " I 1 1 1 28 The size of the paper is to be used in the middle-struggling national standard (CNS) A4 (210 X 297 mm) TWTTT A8 B8 C8 D8 VI. Patent application… The distance between the variable mirrors is extreme. 7. —Laser processing device, equipped with: interposed between the laser vibrator and the image shielding screen, and the medium-range light that can be set and the shielding screen can be set. The anti-curvature surface that can be curved is added to the image as a small mirror. The lens is transparent to the control light of the corresponding CN. The control and control control angle angle is used to respond to the incident beam. The light-emitting mine has an oblique angle of 1M, and the installation station is covered with a cover. The first one of the fans is a special hole. It is inserted with a forged vibrating shot flute. Intermediate light that can be set between the object Η and the surface of the mirror m of the photo-convergence mirror image of the photo-convergence system is added to the image of the small-set system, the study of the light-convergence paraphrase Like the control system of the previous and pre-control system, light and shot., Transpose the image to describe the selection system before the selection: and set the angle to shoot the HC person to the control system. Xuetong Guangshi Learn to convert optical light and light imaging before and before, and choose the one who chooses the mine to be the diameter hole. Repair the position shielding screen r. Control the spoke and the device oscillate the flute. There are 0 tools. Η Add the flute type 1 9 (please read the precautions on the back before filling in this page) -f-installed The system makes the surface work between the bright and transparent transitions of the Ito and the X-ray shielded light screens added to the direct beam control surface of the control and the Nf path. The thunder knot side is merged into the beam. The beam is shielded by the flute shield of the light beam. The previous pass can be adjusted by the festival: the person who disguises the crossover is t. 賩 系 糸 学 光光 光 聚 絸 学 光With the pseudo-rotation of the screen shot, the projected face flute tool plus plus one of the image of the Cheng Mengzhuang and the light and engineering pass plus the one is inserted into the plug-in plug left by the small vibration editing image formed by the imager. The tool makes: and prepares the paper size to be used in the ten-country national standard (CNS) A4 washing grid 210 X 297 mm) 29 A8 B8 C8 D8 The scope of patent application can be selected from the aforementioned image conversion optical system and the aforementioned condensing optical system. Covered with light set «Front shot equipment described. The IIHC predecessor's image is a little detailed description of the adjustable front system, which is changed into a choice, changing the energy of the S control selection, the total diameter and the front system are straight up., And the light beam tooling system is set up with the learning surface Shooting plus optional transfer section S Optical side-tuned light beam and integrated image input, the amount of light is described ------- ^ 'outfit-(please read the precautions on the back before filling in this Page) Ordered by the Ministry of Economic Affairs, Central Bureau of Economics and Management, Beigong Consumer Cooperative, the paper size can be easily used by China National Standard (CNS) A4 Washing (210X297mm) 3 8 4 3 7
TW085111784A 1996-04-24 1996-09-26 TW320585B (en)

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CN1425531A (en) 2003-06-25
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JPH09293946A (en) 1997-11-11

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