TW313744B - - Google Patents

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Publication number
TW313744B
TW313744B TW85104564A TW85104564A TW313744B TW 313744 B TW313744 B TW 313744B TW 85104564 A TW85104564 A TW 85104564A TW 85104564 A TW85104564 A TW 85104564A TW 313744 B TW313744 B TW 313744B
Authority
TW
Taiwan
Prior art keywords
aluminum
heat
foil
layer
sheet
Prior art date
Application number
TW85104564A
Other languages
English (en)
Chinese (zh)
Original Assignee
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Polymer Co filed Critical Shinetsu Polymer Co
Application granted granted Critical
Publication of TW313744B publication Critical patent/TW313744B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24959—Thickness [relative or absolute] of adhesive layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
TW85104564A 1995-04-28 1996-04-17 TW313744B (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10627195 1995-04-28

Publications (1)

Publication Number Publication Date
TW313744B true TW313744B (2) 1997-08-21

Family

ID=14429427

Family Applications (1)

Application Number Title Priority Date Filing Date
TW85104564A TW313744B (2) 1995-04-28 1996-04-17

Country Status (3)

Country Link
US (1) US5741579A (2)
KR (1) KR100242138B1 (2)
TW (1) TW313744B (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103379762A (zh) * 2012-04-12 2013-10-30 应宏国际股份有限公司 机壳结构

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5940358A (en) * 1996-06-13 1999-08-17 Cirrus Logic, Inc. CD-R recording circuit with formatter to increase rate of generating control signals
JP2941801B1 (ja) * 1998-09-17 1999-08-30 北川工業株式会社 熱伝導材
US6162663A (en) * 1999-04-20 2000-12-19 Schoenstein; Paul G. Dissipation of heat from a circuit board having bare silicon chips mounted thereon
US6531771B1 (en) * 1999-04-20 2003-03-11 Tyco Electronics Corporation Dissipation of heat from a circuit board having bare silicon chips mounted thereon
JP2001168246A (ja) * 1999-11-30 2001-06-22 Three M Innovative Properties Co 熱伝導性シート及びその製造方法
US6794030B1 (en) 1999-11-30 2004-09-21 3M Innovative Properties Company Heat conductive sheet and method of producing the sheet
JP3609697B2 (ja) * 2000-08-10 2005-01-12 北川工業株式会社 電気・電子装置用の導電性箔付き熱伝導シート
JP4459470B2 (ja) 2001-04-06 2010-04-28 信越化学工業株式会社 電子部品の放熱構造体及びそれに用いる放熱シート
US7018701B2 (en) * 2002-06-06 2006-03-28 Fuji Polymer Industries Co., Ltd. Thermally conductive sheet and method for manufacturing the same
JP4572056B2 (ja) * 2002-10-04 2010-10-27 信越化学工業株式会社 熱伝導性シリコーンゴム複合シート
JP4686274B2 (ja) * 2005-06-30 2011-05-25 ポリマテック株式会社 放熱部品及びその製造方法
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
US9795059B2 (en) * 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
US8545987B2 (en) * 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8445102B2 (en) * 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US20100100090A1 (en) * 2008-10-17 2010-04-22 Medicold Limited Thermotherapy application and control system
US20100321897A1 (en) * 2009-06-17 2010-12-23 Laird Technologies, Inc. Compliant multilayered thermally-conductive interface assemblies
US8081468B2 (en) * 2009-06-17 2011-12-20 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
US9333454B2 (en) 2011-01-21 2016-05-10 International Business Machines Corporation Silicone-based chemical filter and silicone-based chemical bath for removing sulfur contaminants
US8900491B2 (en) 2011-05-06 2014-12-02 International Business Machines Corporation Flame retardant filler
US9186641B2 (en) 2011-08-05 2015-11-17 International Business Machines Corporation Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability
CN202281972U (zh) * 2011-10-13 2012-06-20 鸿富锦精密工业（深圳）有限公司 电子装置及其散热装置
US8741804B2 (en) 2011-10-28 2014-06-03 International Business Machines Corporation Microcapsules adapted to rupture in a magnetic field
US9716055B2 (en) 2012-06-13 2017-07-25 International Business Machines Corporation Thermal interface material (TIM) with thermally conductive integrated release layer
EP3096351B1 (en) * 2015-05-22 2017-12-13 ABB Technology Oy Thermal interface foil
US10371623B2 (en) 2016-02-05 2019-08-06 Nelson Rojo Corrosion test chamber
EP3429044B1 (en) * 2017-07-14 2023-10-18 Tyco Electronics Raychem GmbH Heat shrink component and method of assembling a heat shrink component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0721308Y2 (ja) * 1990-10-30 1995-05-17 信越化学工業株式会社 熱伝導性シート

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103379762A (zh) * 2012-04-12 2013-10-30 应宏国际股份有限公司 机壳结构

Also Published As

Publication number Publication date
KR100242138B1 (ko) 2000-02-01
US5741579A (en) 1998-04-21

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