TW308357U - Tape attaching apparatus for semiconductor lead frame - Google Patents

Tape attaching apparatus for semiconductor lead frame

Info

Publication number
TW308357U
TW308357U TW084205447U TW84205447U TW308357U TW 308357 U TW308357 U TW 308357U TW 084205447 U TW084205447 U TW 084205447U TW 84205447 U TW84205447 U TW 84205447U TW 308357 U TW308357 U TW 308357U
Authority
TW
Taiwan
Prior art keywords
lead frame
bonding tape
tape
semiconductor lead
tape attaching
Prior art date
Application number
TW084205447U
Other languages
English (en)
Chinese (zh)
Inventor
Kyu Sung Sun
Original Assignee
Samsung Techwin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Techwin Co Ltd filed Critical Samsung Techwin Co Ltd
Publication of TW308357U publication Critical patent/TW308357U/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B13/00—Machines and apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement
    • F26B13/10—Arrangements for feeding, heating or supporting materials; Controlling movement, tension or position of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/06—Controlling, e.g. regulating, parameters of gas supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW084205447U 1994-04-30 1995-04-25 Tape attaching apparatus for semiconductor lead frame TW308357U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR19940009600 1994-04-30
KR2019950003022U KR200174655Y1 (ko) 1994-04-30 1995-02-23 반도체 일반 및 LOC(Lead On Chip) 리드프레임의 테이핑장치

Publications (1)

Publication Number Publication Date
TW308357U true TW308357U (en) 1997-06-11

Family

ID=26630336

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084205447U TW308357U (en) 1994-04-30 1995-04-25 Tape attaching apparatus for semiconductor lead frame

Country Status (5)

Country Link
JP (1) JP3628755B2 (ja)
KR (1) KR200174655Y1 (ja)
CN (1) CN1059289C (ja)
GB (1) GB2288909B (ja)
TW (1) TW308357U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8693172B2 (en) 2008-01-04 2014-04-08 Milestone Av Technologies Llc Flat panel display mount

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW315491B (en) * 1995-07-31 1997-09-11 Micron Technology Inc Apparatus for applying adhesive tape for semiconductor packages
US6281044B1 (en) 1995-07-31 2001-08-28 Micron Technology, Inc. Method and system for fabricating semiconductor components
AU7606496A (en) * 1996-11-06 1998-05-29 Micron Technology, Inc. Apparatus for applying adhesive tape for semiconductor packages
EP1376658B1 (en) * 2002-06-25 2011-07-06 Kabushiki Kaisha Toshiba Method and apparatus for manufacturing semiconductor device
KR100929387B1 (ko) * 2003-02-18 2009-12-02 삼성테크윈 주식회사 리드 프레임의 테이핑 방법 및 그 장치
CN1315153C (zh) * 2003-12-16 2007-05-09 广东工业大学 粘片机引线框架供送空间凸轮机构组合装置
KR101073698B1 (ko) * 2009-09-07 2011-10-14 도레이첨단소재 주식회사 점착테이프와 리드프레임의 라미네이션 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IE55238B1 (en) * 1983-08-03 1990-07-04 Nat Starch Chem Corp Carrier film with conductive adhesive for dicing of semiconductor wafers
JP2515267B2 (ja) * 1989-01-21 1996-07-10 新光電気工業株式会社 リ―ドフレ―ム用テ―ピング装置
JPH06283573A (ja) * 1992-05-08 1994-10-07 Nec Corp バンプ加熱機構付シングルポイントｔａｂボンダー

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8693172B2 (en) 2008-01-04 2014-04-08 Milestone Av Technologies Llc Flat panel display mount

Also Published As

Publication number Publication date
KR200174655Y1 (ko) 2000-03-02
GB2288909B (en) 1998-09-16
CN1112290A (zh) 1995-11-22
CN1059289C (zh) 2000-12-06
JP3628755B2 (ja) 2005-03-16
JPH07302875A (ja) 1995-11-14
KR950031481U (ko) 1995-11-22
GB9508509D0 (en) 1995-06-14
GB2288909A (en) 1995-11-01

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