A7 B7 3〇4299 五、發明説明（1 ) 曼j〇r景 1 ·發明範圃 本發明與電子電路的靜電放電保護有關，特別是在半導 體晶片上由易受所儲存電能快速放電損壞的絕緣體及細線 導體组成的電路。 2 ·趣_關技術説明 積體電路技術上速度及功能的增加完成了更密集的電路 及更細的導線寬度。而積體電路的側面尺寸特性也需要更 薄的絕緣層，通常是因熱而生在矽基層上的矽氧化物。有 用的電路已能以75埃厚的電匣門氧化層生產。當這些氧化 物比較厚的氧化物有較低的不良密度，因而能在毁損前承 受較高的電場；然而，此氧化薄膜卻更易因偶然的靜電放 電（ESD)而損毁。傲存技術的再度進步提供了半導艘唯讀 ?己憶體（ROM)在大約一英吋平方的晶片上能有2〇百萬位元 組的容量。此記憶趙’加上界面電路，將被包含在低成本 ’大約2.5 X 1.125 X 0.25英吋的堅硬包裝中。此技術的引 進到大眾消費市場增加了保護敏感電路免於ESD破壞的需 求0 毁壞諸如記憶體等設備中的細線導體或薄氧化物電匣門 的一個電能來源是儲存在絕緣的人體上的靜電能量。眾所 周知人體可以充電到相對於地面2000伏特的電位，且人體 電容量範園由10微微法拉（pf)到1〇〇 pf。若儲存在人體上的 電量被使用到任何接地的半導體晶片的輸入電匣門的接頭 上時，所使用的電壓足以引起薄絕緣層的崩潰而且電能的 本紙張尺度適用中國國家標隼（C’NS ) Λ·4規格（210>〇97公餘.） ---------丨裝------訂-----1 ,線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央橾準局員工消費合作社印製 A7 A7 經濟部中央標準局消t合作枉印製 B7 五、發明説明（2 ) 快速放電常足以永久損壞絕緣體或將晶片上的細線導體蒸 發。 許多金屬氧化物半導體（MOS)裝置都裝有包含分流二極 體及強化電阻的輸入保護電路。此保護電路在一保護的環 境如電腦中運作的很好，但在音樂可能儲存在一記憶晶片 上重複被插入手提播放器的大眾市場上卻較不可信賴。此 保護電路也需要晶片上的空間而且可能降低其高速執行效 率。 因此，需要一靜電保護以確保記憶晶片以及主裝備可靠 的運作。目的是要保護在大眾市場上廣爲使用的敏感裝置 如ROM等避免儲存在人身上的電量並達成插入裝備及主裝 備間的電壓平衡而不破壞薄絕緣體或可能窄到〇5微米的 導體路徑。 發明概要 本發明與保護積體電路免於靜電放電所引起破壞的裝置 有關，其中可以在半導體晶片上組合形成有細導線或非常 薄的絕緣層的處理器或記憶體之敏感的電子電路由可移式 外罩蓋住該電子電路的外殼以避免被帶電的人艘無心的碰 觸。 在本發明的一實施例中，可移 ...,.* T j砂式外罩的一端連結在外殼 上而其終端被用來蓋住外殼的 1汁政的開口。可移式外罩的中間是 彈簧部份以使終端能蓋住外殼 蛊狂外忒的開口。包含電子電路的外 3 =插入到提供電源’接地，及-輸入訊號給該電 子電路並由它接收輸出訊號的插入處。在插入處的-個上 -5- --------; —裝------訂-----,線 (請先閱讀背兩之注意事項再填鳄本頁) 木紙張尺度適用中國國家標年（ CNS ) A7 B7 經濟部中央標準局負工消費合作社印製 五、發明説明（3 推壓條用來在外殼被插入到該插入處時舉起外殼上的可移 式外軍。這樣就露出用來與插入處的相對接點配對的外殼 上的外部接點。此上推壓條可改造成透過一與其結合在一 起的電阻或透過與接地線串在一起的分立電阻來放掉可移 式外軍上的電荷。當外殼由插入處移出時，上推壓條讓外 殼與可移式外罩順著彈簧部份的偏向而在開口處閉合起來 0 在本發明的另一實施例中，可移式外罩由一裝置在外殼 上的彈簧維持在外殼開口上方的位置。此外殼也可以再設 一導板在可移 < 外罩被第—冑實施财描述的插入處的上 推壓條推起時進一步幫助它。 而在本發明的另-實施”，可移式外罩由—彈簧旋轉 地連結到外殼上。在插入處的上推壓條將可移式外罩由外 殼上的開口旋轉開以露出電予電路的外部接點。 在所有的實施例中，可移式外罩可用電的絕緣禮，帶有 被控制的電阻的導電塑膠，或金屬製作。同樣地，上推壓 條可用同樣範圍的材質絮作，廿^ 貝表作並且可以經過分立串聯電阻 連接到接地端或在上推壓條是以控制住電阻的材質製作時 直接接到接地端。 本發明的#優點是在晶片上不需要額外空間來對積體 ^路提供另-層保護’其中積趙電路包裝密度及速度増加 時對細也越加敏感。這樣就提供了晶片上更多相關區域 給功能’而非保護，電路。 本發月的1^及其他特性與優點參考下面的較佳實施例 6- ί— ;丨裝------訂-----^ -線 (請先閱讀背面之注意事項再填寫本頁) A7 B7 s〇4299 五、發明説明（4 ) 的詳述配合附随的圖示將可瞭解的更清楚。 遇示説明 圖1是本發明一實施例的側面剖面囷； 圖2是本發明的另一實施例的侧面剖面圖； 圖3是本發明的再一實施例的側面剖面圖·及 圖4是圖2中描述的實施例的實體大小圖。 圖示並未標出比例刻度。 丝佳實施例詳诚 現在參考圖1，其中顯示了包含一電子電路的插入模組 裝置100,諸如可能是處理器，放大器，開關，記憶體電 路或光電設備的半導體電路。外殼110界定了空洞112，在 其中電子電路114架在支撑物116上。這些電路由眾所周知 的處理過程擴散，離子注入，氧化，遮罩，蝕刻所形成。 每一個電路會有一個接地墊，一個電源墊，—或多個訊號 輸入墊，及一或多個輸出訊號墊。基本上，這些墊是鋁質 的，一連串的金線連結130用熱壓焊接連接到這些塾上。 連結130的另一端被做成一連串的外部接點ι4〇以連接到貼 在支撑物166上的插入處接點〗42。還有其他方法可以將晶 片連接到接點上如使用衝擊技術，其中晶片的作用面被翻 轉過來’撞擊器上的烊接劑再流入最後將之連接到相同的 外部接點。 靜電電荷的來源之一是在乾燥天氣可以達到2〇〇伏特電 位，V’最大電容量，c，1〇〇微微法拉的人體。 相對的電荷，Q=CV，可能不小心被用到電路上。記憶 ---------—裝------訂-----^ -線 (請先閲讀背而之注意事項再填寫本頁) 經濟部中央標準局員工消費合作杜印製 衣紙張尺度適用中國國家標隼（ CNS )八4现格（210 乂!29~7公犛） 經濟部中央標辛局貝工消f合作社印f A7 —---- - B7 五、發明説明（5 ) 體電路的訊號輸入路徑有非常細的導禮線，〇5微米或更 上覆蓋在絕緣禮上，如可能只有75埃厚的電匠門氧化物 這些電路非常容易被靜電放電所損壞。 爲保護外部接點140避免人體接觸，可移式外罩15〇被放 到外部接點與外殼開口之間。可移式外軍15〇包含了堅硬 的外頭部份151，其終端爲152及另一端爲153，還有彈簧 部份154 ’其第一端155連接到153，而第二端連接到外 殼上。與外殼的連結可以用固定器，或最好是黏劑接合。 插入處160包含與外殼中的外部接點14〇配對的插入處接 點142。插入處接點142位於支撑物166之上。上推壓條17〇 有一在外殼插入到插入處時用來舉起外殼的可移式外罩的 斜切邊緣172。外殼繼續插入使得外部接點14〇與插入處接 點142配在一起以提供電路114電源，接地，及輸入訊號， 並由電路提供輸出訊號給插入處。 外放110包含了 一絕緣物質如塑膠或有大於9歐姆電阻 的陶资。此電阻將放電電流的電壓限制在微安培。可移式 外軍150可用絕緣趙，有每百平方吸電阻値由1〇4到1〇6歐姆 設計用來放掉儲存的電荷的導電塑膠製成，或者可以用金 屬製成。上推壓條170可用緣緣體，導電塑膠，同上，或 金屬製成。在用導電塑膠的情況下，上推壓條要連接到接 地端180，以便任何儲存在可移式外軍或上推壓條上的電 荷透過控制好的阻抗被導引到地線。當上推壓條是金屬時 ’它被電阻181連接到接地端18〇而電阻最好有1 〇5到1 〇7歐 姆的阻抗以慢慢驅散電荷。 -8 - 本纸張尺度過用中國國家標準.（CNS ) Λ4規格；2ΚΓχ；>97公楚） -------； —装 If 線 (請先閲讀背面之注意事項再填寫本頁) Α7 Β7 五、發明説明（6 ) 現在參考圖2，其中顯示了包含一電子電路的插入模組 裝置200，諸如可能是處理器，放大器，開關，記憶體電 路或光電設備的半導體電路。外殼110界定了空洞112，在 其中半導體電路114架在支撢物116上。這些電路由眾所周 知的處理過程擴散，離子注入，氧化，遮罩，蝕刻所形成 。每一個電路會有一個接地墊，一個電源墊，一或多個訊 號輸入整’及一或多個輸出訊號塾。基本上，這些塾是鋁 質的’一連串的金線連結13〇用熱壓焊接連接到這些墊上 。連結130的另一端被做成一連串的外部接點14〇以連接到 貼在支撑物166上的插入處接點丨42。還有其他方法可以將 晶片連接到接點上如使用衝擊技術，其中晶片的作用面被 翻轉過來’撞擊器上的焊接劑再流入最後將之連接到相同 的外部接點》 上面有關人體上的電荷毁損細導體及薄絕緣層的討論在 此重複。 經濟部中央標準局員工消費合作社印製 (請先閱讀背而之注意事項"填寫本頁 爲保護外部接點140避免人體接觸，可移式外罩25〇被放 到外部接點與外殼開口之間。可移式外罩25〇由接合在外 殼上的的彈簧252固定住。外殼也可以定義導板254使彈簧 及可移式外軍在其間滑動。彈簧與外殼的連結可以用固定 器’或最好是黏劑接合。 上面描述插入處160及其中元件操作的討論在此重複。 圖1與圖2中共同元件的材料選擇與阻抗値在此重複。可 移式外罩250可用絕緣體’有每百平方呎電阻値由1〇4到1〇6 歐姆設計用來放掉儲存的電荷導電塑膠製成，或者可以 ___ -9- 度賴 f 竣） 經濟部中央標隼局負工消費合作社印製 A7 B7 五、發明説明（7 ) 金屬製成。 現在參考圖3，其中顯示了包含一電子電路的插入模組 裝置3 00 ’諸如可能是處理器，放大器，開關，記憶體電 路或光電設備的半導體電路。 與圖1中有共同號碼的元件已在前描述，在此通用。可 移式外罩350由彈簧352爲樞軸地裝到外殼310上。彈簧端 與外殼及可移式外罩的連結可以用固定器，或最好是黏劑 接合。在圖3中上推壓條370在外殼插入到插入處時接觸到 可移式外罩350並將之順時針方向擺動以便再往前插入時 使外殼上的外部接點140與插入處接點142配在一起。 現在參考圖4，其中顯示了圖2中描述的彈簧裝著可移 式外罩實體圖。 可移式外罩的結構覆蓋了所保護的電子電路的外部接點 避免被帶電的人體碰觸以確保電子電路的可靠操作性，特 別是當電路爲有接近1 0 0埃厚的細線導體及絕緣體的半導 體處理器或記憶體時。配合的上推壓條只有在外殼插入到 適當的插入處時對電子電路露出接點。 在這些明確描述的實施例中的改變與修正都涵蓋在本發 明的範圍中。特別是，在圖2及圖3中的實施例使用各種 線圏彈簧或葉片彈簧。轉軸或鉸鏈也可以加到囷3的實施 例中。 -10- 本紙張疋度埼用中國國家標準（C:NS ) Λ4规格（2丨0/2(;7公韙） I—.—---:丨裝------訂--------^ -線 (請先閲讀背面之注意Ϋ項再填"本頁)A7 B7 3〇4299 V. Description of the invention (1) Manjor Jing 1 · Invention scope This invention is related to the protection of electrostatic discharge of electronic circuits, especially the insulators on semiconductor wafers that are easily damaged by rapid discharge of stored electrical energy And thin wire conductors. 2 · Fun_Guan technical description The increase in speed and function of integrated circuit technology has completed a denser circuit and a thinner wire width. The side dimensions of the integrated circuit also require a thinner insulating layer, usually silicon oxide that is generated on the silicon base layer due to heat. Useful circuits have been produced with 75 angstroms of oxide gate oxide. When these oxides are thicker than oxides, they have a lower defective density and can therefore withstand higher electric fields before they are damaged; however, this oxide film is more likely to be damaged by accidental electrostatic discharge (ESD). The further advancement of Aomun Technology has provided a semi-guided read-only memory (ROM) with a capacity of 20 million bytes on a chip about one inch square. This memory, Zhao ’plus the interface circuit, will be included in a low-cost hard package of about 2.5 X 1.125 X 0.25 inches. The introduction of this technology to the mass consumer market has increased the need to protect sensitive circuits from ESD damage energy. It is well known that the human body can be charged to a potential of 2000 volts relative to the ground, and the range of the human body capacitance ranges from 10 picofarads (pf) to 100 pf. If the electricity stored on the human body is used on the connector of the input box door of any grounded semiconductor chip, the voltage used is sufficient to cause the collapse of the thin insulating layer and the paper standard of electrical energy is applicable to the Chinese national standard falcon (C ' NS) Λ · 4 specification (210 > 〇97g.) --------- 丨 installed ------ order ----- 1, line (please read the notes on the back first (Fill in this page) A7 A7 printed by the Consumer Cooperative of the Central Bureau of Economic Affairs of the Ministry of Economic Affairs A7 A7 printed by the Central Bureau of Standards of the Ministry of Economic Affairs B7. Description of the invention (2) Fast discharge is often enough to permanently damage the insulator or the thin wire conductor on the chip evaporation. Many metal oxide semiconductor (MOS) devices are equipped with input protection circuits that include shunt diodes and reinforced resistors. This protection circuit works well in a protected environment such as a computer, but it is less reliable in the mass market where music may be stored on a memory chip and repeatedly inserted into a portable player. This protection circuit also requires space on the chip and may reduce its high-speed execution efficiency. Therefore, an electrostatic protection is required to ensure reliable operation of the memory chip and the main equipment. The purpose is to protect the sensitive devices widely used in the mass market, such as ROM, to avoid the storage of electricity on people and achieve a voltage balance between the inserted equipment and the main equipment without damaging the thin insulator or the conductor path that may be as narrow as 0.5 microns . SUMMARY OF THE INVENTION The present invention relates to a device for protecting integrated circuits from damage caused by electrostatic discharge, in which sensitive electronic circuits of processors or memories with thin wires or very thin insulating layers can be combined on semiconductor wafers. A removable cover covers the outer shell of the electronic circuit to avoid unintentional contact by a live ship. In an embodiment of the present invention, one end of the removable ..., T j sand cover is connected to the housing and its terminal is used to cover the opening of the housing. In the middle of the removable cover is a spring part to allow the terminal to cover the opening of the shell. Including the external circuit of the electronic circuit 3 = inserted into the power supply 'ground, and-the input signal to the electronic circuit where it receives the output signal insertion point. At the insertion place-a top -5- --------;-installed ----- ordered -----, line (please read the precautions on the back and then fill this page) The wood paper scale is applicable to China National Standard Year (CNS) A7 B7 Printed by the National Bureau of Standards, Ministry of Economic Affairs, Consumer Labor Cooperative V. Description of the invention (3 push bar is used to lift the removable shell on the shell when the shell is inserted into the insertion place) Type foreign army. This exposes the external contacts on the housing that are used to mate with the opposing contacts at the insertion point. This push-on bar can be transformed into a discrete through a resistor combined with it or through a string connected with a ground wire Resistor to discharge the charge on the removable outer army. When the casing is removed from the insertion place, the upper push bar allows the casing and the removable casing to close at the opening along the bias of the spring part. In one embodiment, the removable cover is maintained at a position above the opening of the housing by a spring mounted on the housing. The housing can also be provided with a guide plate at the insertion point where the removable cover is described by the first The upper push bar further helps it when pushed up. And in another implementation of the invention ", The removable housing is rotatably connected to the housing by a spring. The upper push bar at the insertion point rotates the removable housing from the opening in the housing to expose the external contacts of the electrical circuit. In all embodiments, The removable cover can be made of electrical insulation, conductive plastic with controlled resistance, or metal. Similarly, the push-up bar can be made of the same range of materials, 20 meters and can be connected through discrete series resistance It is directly connected to the ground terminal when it is made of a material that controls the resistance to the ground terminal or the upper push bar. The advantage of the present invention is that it does not require additional space on the chip to provide another layer of protection for the integrated circuit. The increase in packaging density and speed of the Zhao circuit is also more sensitive to fineness. This provides more relevant areas on the chip for functions rather than protection, circuits. For the 1 ^ and other features and advantages of this month, please refer to the following. Example 6-ί-; 丨 installed ----- ordered ----- ^-line (please read the precautions on the back before filling in this page) A7 B7 s〇4299 V. Description of the invention (4) It will be detailed with the accompanying icon The explanation is clearer. The description shows that FIG. 1 is a side sectional view of an embodiment of the present invention; FIG. 2 is a side sectional view of another embodiment of the present invention; FIG. 3 is a side sectional view of yet another embodiment of the present invention. · And FIG. 4 is a physical size diagram of the embodiment described in FIG. 2. The illustration does not show a scale scale. The embodiment of Sijia is now fully described with reference to FIG. 1, which shows an insertion module device 100 including an electronic circuit , Such as a semiconductor circuit that may be a processor, amplifier, switch, memory circuit, or optoelectronic device. The housing 110 defines a cavity 112 in which the electronic circuit 114 rests on a support 116. These circuits are diffused by well-known processes, ions It is formed by injection, oxidation, masking and etching. Each circuit will have a ground pad, a power pad,-or more signal input pads, and one or more output signal pads. Basically, these pads are made of aluminum, and a series of gold wire connections 130 are connected to these bases by hot compression welding. The other end of the link 130 is formed as a series of external contacts ι40 to connect to the insertion point contact 42 attached to the support 166. There are other ways to connect the wafer to the contacts, such as using an impact technique, where the active surface of the wafer is turned over 'and the adhesive on the impactor flows into the final connection to connect it to the same external contact. One of the sources of electrostatic charge is a human body that can reach 200 volt potential, V ’maximum capacitance, c, 100 picofarads in dry weather. The relative charge, Q = CV, may be accidentally applied to the circuit. Memory ---------— installed ------ ordered ----- ^-line (please read the notes before you fill in this page) Employee consumption cooperation Du The standard of printed paper is applicable to the Chinese National Standard Falcon (CNS) 84 or 4 (210 乂! 29 ~ 7 Gong Ya) The Ministry of Economic Affairs Central Standards Bureau Beigongxiao f cooperative printing f A7 —-----B7 V. Description of the invention (5) The signal input path of the body circuit has a very thin guide wire, which is covered with insulation of 5 microns or more, such as an electrician's gate oxide that may be only 75 angstroms thick. These circuits are very vulnerable to electrostatic discharge Damaged. To protect the external contact 140 from human contact, the removable housing 15 is placed between the external contact and the opening of the housing. The removable foreign army 15 includes a rigid outer head portion 151 with a terminal of 152 and the other end of 153, and a spring portion 154 'with a first end 155 connected to 153 and a second end connected to the housing . The connection to the housing can be made with a fastener, or preferably an adhesive. The insert 160 includes an insert contact 142 that mates with an external contact 14 in the housing. The insertion point contact 142 is located above the support 166. The upper push bar 17o has a beveled edge 172 that is used to lift the removable cover of the housing when the housing is inserted into the insertion position. The housing continues to be inserted so that the external contact 140 and the insertion point contact 142 are matched to provide power, ground, and input signals to the circuit 114, and the circuit provides output signals to the insertion point. The external speaker 110 contains an insulating material such as plastic or ceramic material with a resistance greater than 9 ohms. This resistor limits the voltage of the discharge current to microamperes. The removable foreign army 150 can be insulated with Zhao. It has a suction resistance per hundred squares made of 104 to 106 ohms of conductive plastic designed to discharge stored charges, or it can be made of metal. The upper pressing bar 170 may be made of a rim body, conductive plastic, the same as above, or metal. In the case of conductive plastic, the push-up bar must be connected to the ground terminal 180 so that any charge stored on the removable foreign army or the push-up bar is directed to the ground through the controlled impedance. When the upper push bar is metal, it is connected to the ground terminal 18 by a resistor 181 and the resistor preferably has an impedance of 105 to 107 Ohm to slowly dissipate the electric charge. -8-This paper scale is overused by Chinese National Standard. (CNS) Λ4 specification; 2ΚΓχ; > 97 Gongchu) -------; —If line installed (please read the precautions on the back before filling in this Page) Α7 Β7 5. Description of the invention (6) Reference is now made to FIG. 2, which shows a plug-in module device 200 containing an electronic circuit, such as a semiconductor circuit which may be a processor, amplifier, switch, memory circuit or optoelectronic device. The housing 110 defines a cavity 112 in which the semiconductor circuit 114 rests on the support 116. These circuits are formed by well-known processes such as diffusion, ion implantation, oxidation, masking, and etching. Each circuit will have a ground pad, a power pad, one or more signal input units and one or more output signal units. Basically, these rods are made of aluminum and a series of gold wire connections 13 are connected to these pads by hot-press welding. The other end of the link 130 is formed as a series of external contacts 140 to connect to the insertion point contacts 42 attached to the support 166. There are other ways to connect the wafer to the contact, such as using impact technology, where the active surface of the wafer is turned over, the solder on the striker then flows into the final connection to the same external contact The discussion of charge destruction of thin conductors and thin insulating layers is repeated here. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions " fill in this page to protect the external contact 140 from human contact, the removable cover 25 is placed between the external contact and the opening of the housing The removable housing 25 is secured by a spring 252 that is attached to the housing. The housing can also define a guide plate 254 to allow the spring and the removable foreign army to slide therebetween. The connection between the spring and the housing can use a fixture 'or Adhesive bonding is preferred. The above discussion of the insertion 160 and the operation of the components therein is repeated here. The material selection and impedance values of the common components in FIGS. 1 and 2 are repeated here. The removable housing 250 can be used with an insulator. The 100-square-foot resistor value is made of 104 to 106 ohms designed to discharge stored conductive plastic, or it can be completed ___ -9- Duraf) Printed by the Consumer Labor Cooperative of the Central Standard Falconry Bureau of the Ministry of Economic Affairs System A7 B7 5. Description of the invention (7) Made of metal. Referring now to Fig. 3, there is shown a plug-in module device 300 comprising an electronic circuit such as a semiconductor circuit which may be a processor, an amplifier, a switch, a memory circuit or an optoelectronic device. The elements with the same number as in FIG. 1 have been described previously and are used here in common. The removable housing 350 is pivotally attached to the housing 310 by a spring 352. The connection of the spring end to the housing and the removable housing can be fixed with a fastener or preferably adhesive. In FIG. 3, the upper push bar 370 contacts the movable housing 350 when the housing is inserted into the insertion place and swings it clockwise in order to match the external contact 140 on the housing with the insertion point contact 142 when inserting it further forward Together. Reference is now made to Fig. 4, which shows a solid view of the spring-loaded removable cover described in Fig. 2. The structure of the removable cover covers the external contacts of the protected electronic circuit to avoid being touched by the charged human body to ensure the reliable operation of the electronic circuit, especially when the circuit is a thin wire conductor and insulator with a thickness of nearly 100 angstroms Semiconductor processor or memory. The mating push-on strip only exposes the contacts to the electronic circuit when the housing is inserted into the proper insertion point. Changes and modifications in these explicitly described embodiments are all covered by the scope of the present invention. In particular, the embodiments in Figs. 2 and 3 use various coil springs or leaf springs. Rotating shafts or hinges can also be added to the embodiment of Fig. 3. -10- This paper uses the Chinese national standard (C: NS) Λ4 specification (2 丨 0/2 (; 7 male)) I —.—---: 丨 installed ------ order-- ------ ^ -line (please read the note Ϋ on the back and then fill in " this page>