200840006 九、發明說明： 【發明所屬之技術領域】 士發明係關於-種積體電路晶片之封裝結構；特別是且 有插槽、可供與電路板模組之接腳導電接合之封裝結構。，、 【先前技術】 •隨著科技發展，應用於各種電子裝置之積體電路（i :巧ic)的運作速度越來越快、容量也越來越大。在追 :與局容量積體電_同時，由於其製程技術日益進步，内元 件的體積雜細小，生奴寸小且效能高讀體t路產品 市場上當然具有較佳之競爭力。 ^ ^隨著積體電路晶片之體積日漸縮小，可想見地，内部元件之 ，氧化層亦逐漸變薄，而具有較小之崩潰電壓。換言之，一旦 C差而‘致電何;^動，靜電放電（EiectrostauCDischarge，ESD)現 象便有可能發生，容易導致雜氧化層贿，進而傷害積體電路 f造成其失效。以目前常見之具有複數個導電接腳的積體電路而 吕，可能的靜電放電現象大致可區分為三種模式：人體放電 (HUmanB〇dyM〇dd，HBM)、機器放電（MachineModd MM)、 以及元件充電放電（Charged-DeviceModel，CDM)等。 其中，人體放電（HBM)屬於接觸式放電，在人體觸碰積體 ，路至少二接腳之瞬間，電流經由人體傳到積體電路後流出；、機 器放電（MM)與人體放電類似，亦屬接觸式放電，在機器觸碰積 體電路至少二接腳之瞬間，電流經由機器傳到積體電路後流出； 而元件充，放電（CDM)則屬於另一種形式，當積體電路受感應 而儲存電荷於基材時，只要其中一接腳接觸可放電之路徑，電流 便會從積體電路流出。以上電流放電過程，皆可能導致積體電路 之失效，因此，積體電路之靜電放電防護便成為目前積體電路設 計之重要課題之一。 、 5 200840006 習知的靜電放電防護機制，通常是在 ^保護電路；當積體電路尚未開始IS路 運作狀態下，保護電路電路之外’·當積體電路在 操作。 1电路則呈現關閉狀悲，以避免影響積體電路之 的電路必點’舉例而言:此額外設計 ►路仍存在寄生電容，若欲才•知；保護電 體電路本身之操作;；，則可能會影響積 超過其防護能力，積體電路仍可差或= 二習知保護電路的防護能力，在實=== ，結此電傷害積體電路象封 【發明内容】 構，體電路晶片之封裝結 封裝結構上…十^古^^片通常具有外露接腳’本發明係將 °°直接接觸’故可防止靜電放電對於積體電路之直接傷害。 則設計為可相配入夕从$衣、、、口構"又计為具有插槽之同時，電路板 接腳導腳，例如—般針狀接腳、或球狀陣列 違到ν電連接亦可避免靜電放電之發生。 本七月之再-目的在於提供_種防止元件充電放電⑴讀） 6 200840006 傷害之電路板模組，相對於積體電路晶片接地端之電路板模組接 腳具有先觸設計，使積體電路裝設於電路板模組之過程，積體電 路晶片之接地端會先接觸電路板模組之接腳，俾將累積之電荷導 出。 為達上述目的，本發明揭露一種用於積體電路晶片之封裝結 冓、以及應用此封裝結構之電路板模、组，該積體電路晶片係設置 ，封裝結構之殼體内，而殼體上設有至少—插槽，與積體電路晶 =之至少-襯塾（_)對應，使襯墊可經由該 接腳電性連接。 為讓本發明之上述目的、技術特徵、和伽能更明顯易懂， 下文係以較佳實施例配合所附圖式進行詳細說明。 【實施方式】 10夕百ίΐ參閱第1圖’所示為本發明較佳實施例之電路板模组 路ίΐί，。ΐϊ明之電路板模、组10包含一封裝結構20及」電 其封裝結構2G具有—殼體21，俾將一積體ί 路曰曰片30封裝於殼體21内，而積體 、電 J31， 有m功2ίί以延伸。本發明之舰在於，㈣21上設置 而電二太<^41’¥電兀件33即是將婦31對應連接至插槽23, 而電路板本體41上則對應設有至少一 = 23 43 ^ 墊31電性連接。 工田俯僧23及導電兀件33，與襯 構2^應= 有複數個概㈣，而封装結 件33，外邱夕賴曰猎由該等插槽23及該等導電元 之後數個接腳43可分別與該等概塾31電性連^凡 體冤路曰曰片30之結構相當微小且精密，於結構上 7 200840006 =接連接較為_ ’故設計積體 伸至對應之插槽23,以利與電。^ j說明及圖式中，接腳43僅以針狀接腳為例，但 上較佳實施例為，若封裝結構20採用球栅陣歹ί n: Α)結構，此時接腳便為球狀接腳45，如 肉Ϊί上f之實施例’積體電路晶片30被包覆於封裝結構20 Ξ不外部接腳連接，相較於習知技術，人體錢 觸文到靜電放電傷害之可能。 ”、 接 咸庫二卜二ϊΐ述之ϊΐ充電放電（CDM)而言，由於積體電路 感應儲存之電只要其中—接腳翻可放電之雜 备 造成傷害，故仍可能存在風險；本發明之又一較佳實施乃^ 解決此問題，如第4圖所示。首先，複數個襯墊31中可包含二 地端311，而對應之接腳係為一接地接腳431 :其中，接地接腳幻^ 相較於其他接腳43係具有一高度h，俾當封裝結構2〇裝設至電路 板本體41時，接地接腳431會先與對應之導電元件接觸，亦即襯 墊31之接地端311會先與接地接腳431導電接觸；藉此，累積之 電荷可先行導出，避免受到靜電放電之傷害。 μ、 更明確而言，該接地接腳431本身係具有一彈性，例如以一 彈性物質所製成，使得封裝結構2〇整體裝設至電路板本體41的 過程中，接地接腳431先接觸接地端311，受到擠壓徭才盥立夕接 43 互導電接觸。另一種實施態樣為，接地接腳431於底部設置一彈 性7G件（圖未示，例如一彈片結構），再配合一止擋結構（圖未示）， ，得接地接腳431被下壓時具有彈性，較佳係接地接腳431可受 壓而產生位移距離與高度h實質上相等；當移除封裝結構2〇時， 8 200840006 接地接腳431可回復並受止檔結構阻擋，以避免脫落。 或者，如第5圖所示，電路板本體41相對於接地接腳431之 ^設置有一容置空間，提供接地接腳431上下移動之裕度及卡 莩功能，此時’藉由電路板本體41與接地接腳431本體間的摩擦 力加以固持，使得接地接腳431具有距離h之上下移動空間。 私狀t ’若電路板本體41上之導電接點亦為插槽，則本發明之 相對㈣為外凸接腳之連接件，分別與封 ΐίίί。插槽及電路板本體41之插槽配合，亦可達到本發 =電心與人體錢II直接細之齡，轴避免靜電放電 ，置53之?Ϊ，本發日㈣裝結構及電路板模組不需額外 電路i精由封裝結構上之設計即可大幅降低積體電路， 之發生 明之例舉本發明之實施態樣，以及闡釋本發 術者可來限制本發明之保護範嘴。任何熟悉此技 同，易凡，之改變或均等性之安排均屬於本發明所主張之範 ’兔明之權利保護翻應以申請專利範圍為準。 【圖式簡單說明】 Ϊ1圖係本發明較佳實施例之側視圖； 日·佳實施例巾，縣結構之上視圖； 第4 較佳實施例中，球狀接腳之示意圖； 笛ς二7餐明又一較佳實施例示意圖；以及 圖係本發日収—較佳實關巾，接地接敗示意圖。 【主要元件符號說明】 id 電路板模組 20 封裝結構 200840006 21 殼體 23 插槽 30 積體電路晶片 31 襯墊 311 接地端 33 導電元件 41 電路板本體 43 接腳 431 接地接腳 45 球狀接腳200840006 IX. Description of the Invention: [Technical Fields of the Invention] The invention relates to a package structure of an integrated circuit chip; in particular, a package having a socket for electrically engaging a pin of a circuit board module. , [Prior Art] • With the development of technology, the integrated circuit (i: ic) applied to various electronic devices is operating faster and with larger capacity. At the same time, due to the increasing progress of the process technology, the internal components are small in size, and the size of the slaves is small and the performance is high. ^ ^ As the volume of the integrated circuit chip shrinks, it is conceivable that the internal component, the oxide layer is gradually thinner, and has a smaller breakdown voltage. In other words, once C is poor and ‘calling; ^, the electrostatic discharge (Eiectrostau CDischarge, ESD) phenomenon may occur, easily lead to brittle layer of brittle, and thus damage the integrated circuit f caused its failure. With the current integrated circuit with a plurality of conductive pins, the possible electrostatic discharge phenomenon can be roughly divided into three modes: human body discharge (HUmanB〇dyM〇dd, HBM), machine discharge (MachineModd MM), and components. Charged-Device Model (CDM), etc. Among them, human body discharge (HBM) belongs to contact discharge. When the human body touches the integrated body, the current flows through the human body to the integrated circuit at the moment when the road is at least two feet. The machine discharge (MM) is similar to the human body discharge. It is a contact discharge. When the machine touches at least two pins of the integrated circuit, the current flows through the machine to the integrated circuit and flows out; while the component charge and discharge (CDM) belongs to another form, when the integrated circuit is induced. When the charge is stored on the substrate, as long as one of the pins contacts the path that can be discharged, current flows out of the integrated circuit. The above current discharge process may cause the failure of the integrated circuit. Therefore, the electrostatic discharge protection of the integrated circuit has become one of the important topics in the current integrated circuit design. 5 200840006 The conventional electrostatic discharge protection mechanism is usually in the ^ protection circuit; when the integrated circuit has not started the IS circuit, the protection circuit is outside the circuit. 1 circuit is closed and sad, to avoid affecting the circuit of the integrated circuit must be 'for example: this additional design ► the road still has parasitic capacitance, if you want to know; protect the operation of the electric circuit itself;; It may affect the product beyond its protective capacity, the integrated circuit can still be poor or = 2 the protection function of the conventional protection circuit, in the real ===, the electric damage integrated circuit circuit seal [invention content] structure, body circuit The package package structure of the chip... The film usually has an exposed pin. The present invention directly contacts the lens to prevent direct damage of the electrostatic discharge to the integrated circuit. It is designed to match the time from the "cloth,", and mouth structure "also counted as having a slot, the board pins, such as the needle-like pins, or the ball array violates the ν electrical connection It can also avoid the occurrence of electrostatic discharge. This July again - the purpose is to provide _ kinds of protection components charging and discharging (1) read) 6 200840006 Damage circuit board module, relative to the integrated circuit chip ground terminal circuit board module pin has a first touch design, so that the integrated body When the circuit is installed in the circuit board module, the ground end of the integrated circuit chip first contacts the pin of the circuit board module, and the accumulated electric charge is derived. In order to achieve the above object, the present invention discloses a package structure for an integrated circuit chip, and a circuit board module and a group for applying the package structure, the integrated circuit chip is disposed in a housing of the package structure, and the housing At least a slot is provided, corresponding to at least the lining (_) of the integrated circuit crystal, so that the pad can be electrically connected via the pin. The above objects, technical features, and gamma energy of the present invention will be more apparent from the following description. [Embodiment] FIG. 1 is a circuit board module according to a preferred embodiment of the present invention. The circuit board module and group 10 of the present invention comprises a package structure 20 and an electrical package structure 2G having a housing 21, and a package body 30 is encapsulated in the housing 21, and the integrated body and the electric J31 are assembled. , has m work 2 ίί to extend. The ship of the present invention is provided on (4) 21, and the electric two too < ^41 '¥ electric pick 33 is connected to the slot 23 correspondingly, and the circuit board body 41 is correspondingly provided with at least one = 23 43 ^ Pad 31 is electrically connected. Gongtian protuberance 23 and conductive element 33, and the lining 2^ should be = there are a plurality of general (four), and the package is 33, the outer Qiu Xi Lai hun hunts the slots 23 and the conductive elements after several The pin 43 can be electrically connected to the general structure 31, and the structure of the body block 30 is relatively small and precise, and the structure is 7 200840006 = the connection is relatively _ 'the design integrated body extends to the corresponding plug Slot 23 for benefit and electricity. In the description and drawings, the pin 43 is only taken as an example of a pin-shaped pin. However, in the preferred embodiment, if the package structure 20 is a ball grid array, the pin is The ball-shaped pin 45, such as the embodiment of the meat piece 上f, is covered in the package structure 20, and is not connected to the external pin. Compared with the prior art, the human body touches the text to electrostatic discharge damage. may. In the case of the charge and discharge (CDM) of the salt storage system, the risk of the inductive storage of the integrated circuit may be at risk as long as the damage is caused by the miscellaneous charge that can be discharged; A further preferred embodiment solves this problem, as shown in Fig. 4. First, a plurality of pads 31 may include two ground ends 311, and the corresponding pins are a ground pin 431: wherein, grounding The pin phantom has a height h compared to the other pins 43. When the package structure 2 is mounted to the circuit board body 41, the ground pin 431 first contacts the corresponding conductive element, that is, the pad 31. The ground terminal 311 is first in conductive contact with the ground pin 431; thereby, the accumulated charge can be derived first to avoid damage from electrostatic discharge. μ, more specifically, the ground pin 431 itself has an elasticity, for example When the package structure 2 is integrally mounted to the circuit board body 41, the grounding pin 431 first contacts the grounding end 311, and is pressed and erected to make a mutual conductive contact. An implementation aspect is that the ground pin 431 An elastic 7G piece (not shown, for example, a shrapnel structure) is disposed at the bottom, and a stop structure (not shown) is used to ensure that the grounding pin 431 is elastic when pressed, preferably the grounding pin 431 is The displacement distance generated by the pressure is substantially equal to the height h; when the package structure 2 is removed, the 8 200840006 grounding pin 431 can be restored and blocked by the stop structure to avoid falling off. Or, as shown in Fig. 5, The circuit board body 41 is provided with an accommodating space relative to the grounding pin 431, and provides a margin and a latching function for the grounding pin 431 to move up and down. At this time, the space between the circuit board body 41 and the grounding pin 431 body is The frictional force is held such that the grounding pin 431 has a moving space above and below the distance h. Private t' If the conductive contact on the circuit board body 41 is also a slot, the opposite (4) of the present invention is the connection of the protruding pin. The package is matched with the slot of the slot and the board body 41, and can also reach the age of the hair=electric core and the human body money II, the shaft avoids electrostatic discharge, set 53? (4) Installation structure and circuit board module are not required The design of the circuit i can be greatly reduced by the design of the package structure, and the embodiment of the present invention can be exemplified, and the protection of the present invention can be limited by the present invention. Any familiar with this technology , Yi Fan, the change or the equality of the arrangements are all claimed in the present invention. The rights of the rabbits are protected by the patent application. [Simplified illustration] Ϊ 1 is the side of the preferred embodiment of the present invention View; day of the embodiment, top view of the county structure; fourth preferred embodiment, schematic view of the ball-shaped pin; schematic view of another preferred embodiment of the flute 2; Received - better solid off towel, ground connection diagram. [Main component symbol description] id circuit board module 20 package structure 200840006 21 housing 23 slot 30 integrated circuit chip 31 pad 311 ground terminal 33 conductive component 41 circuit Board body 43 pin 431 ground pin 45 ball pin