CN110012595A - A kind of board structure of circuit and electronic equipment - Google Patents

Abstract

The invention provides a circuit board structure and electronic equipment. The circuit board structure includes a dielectric layer, an electrostatic protection layer and electronic components. The dielectric layer is provided with a signal line connecting pad and a grounding pad. The signal line A gap is set between the connection pad and the ground pad, the electrostatic protection layer is arranged on the side of the dielectric layer facing the ground pad, and is in contact with the ground pad, and the electronic The component is connected to the signal line connection pad; wherein, the dielectric layer and the electrostatic protection layer have through holes, and the hole wall of the through hole is provided with a conductive layer, and the conductive layer is connected to the connection place. The signal line connection pads of the electronic components are connected. The technical solutions provided by the embodiments of the present invention solve the problems of many grounding wires and complicated wiring existing in the existing circuit board.

Description

A circuit board structure and electronic equipment

technical field

The present invention relates to the technical field of communications, and in particular, to a circuit board structure and electronic equipment.

Background technique

As we all know, static electricity is everywhere, and the static voltage carried by the human body can range from hundreds of volts to tens of thousands of volts. The circuit board is slightly improperly handled during the SMT (Surface Mount Technology, surface mount technology) placement, handling and transportation process. , static electricity will directly cause breakdown and burn of electronic devices. At the same time, as the carrier of electronic components, the circuit board usually integrates electronic components (such as chips, inductors, capacitors, etc.) on the circuit board for data processing. When the human body touches or the system circuit is just powered off, due to electrostatic discharge, it is easy to Causes electronic oscillation inside the system circuit. When the voltage of the electronic oscillation is too large, it may exceed the withstand voltage of some components, resulting in the discharge of the system circuit and eventually damage to the components.

At present, a ground wire is usually set on the circuit board, and a special ESD (Electro-Static discharge, electrostatic discharge) device is added on the protection path through which static electricity passes or beside the device that needs to be protected, so that the electrostatic charge can reach the protected electronic device. It was previously introduced to the ground layer through these ESD-proof devices. However, such a design will use more grounding wires and add special anti-ESD devices, resulting in the existing circuit board having problems of many grounding wires and complicated wiring.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide a circuit board structure and an electronic device, so as to solve the problems of the existing circuit boards that have many ground wires and complicated wiring.

In a first aspect, an embodiment of the present invention provides a circuit board structure, including:

a dielectric layer, a signal line connecting pad and a grounding pad are arranged on the medium layer, and a gap is arranged between the signal line connecting pad and the grounding pad;

an electrostatic protection layer, the electrostatic protection layer is arranged on the side of the dielectric layer facing the grounding pad, and abuts with the grounding pad;

electronic components, connected with the signal wire connection pads;

Wherein, the dielectric layer and the electrostatic protection layer have through holes penetrating through, and a conductive layer is provided on the hole wall of the through hole, and the conductive layer is connected to the connection pads of the signal lines connecting the electronic components.

In a second aspect, an embodiment of the present invention further provides an electronic device, including the circuit board structure described in the first aspect.

In the technical solution provided by the embodiment of the present invention, an electrostatic protection layer is arranged in the circuit board structure, the electrostatic protection layer has anti-instantaneous electrical overload performance, the electrostatic protection layer is connected with the grounding pad, and the electrostatic protection layer and the dielectric layer pass through The conductive layer on the wall of the through hole is also in contact with the electrostatic protection layer, and the conductive layer is connected to the connection pad of the signal line connecting the electronic components. When the electronic components are subjected to static electricity and generate a high voltage, the electrostatic protection layer It can be changed from an insulator to a conductor to conduct static electricity to the ground, effectively protecting electronic components from static electricity damage. Compared with the existing need to set a grounding layer on each dielectric layer, the design of the embodiment of the present invention only needs to set a grounding pad on one side of the electrostatic protection layer to realize grounding, which reduces the need for a circuit board structure. The design of the ground plane is more conducive to the layout of the signal lines on the circuit board structure.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments of the present invention. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

1 is a cross-sectional view of a circuit board structure provided by an embodiment of the present invention;

2 is a schematic diagram of a preset distance between a first signal line connection pad and a ground pad in the circuit board structure provided in FIG. 1;

FIG. 3 is a schematic diagram of the direction of static electricity when the electronic components on the circuit board structure provided in FIG. 1 are subjected to static electricity.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

An embodiment of the present invention provides a circuit board structure, please refer to FIG. 1 , the circuit board structure includes a dielectric layer 105 , an electrostatic protection layer 106 and an electronic component 101 , and the dielectric layer 105 is provided with signal line connection pads 102 and The ground pad 107 has a gap between the signal line connection pad 102 and the ground pad 107 , the electrostatic protection layer 106 is arranged on the side of the dielectric layer 105 facing the ground pad 107 , and the electrostatic protection layer 106 Abutting with the grounding pad 107, the electronic component 101 is connected to the signal line connecting pad 102; wherein, the dielectric layer 105 and the electrostatic protection layer 106 have through holes 104, and the hole walls of the through holes 104 are provided with conductive Layer 1041, the conductive layer 1041 is connected to the connection pad 102 of the signal line connecting the electronic component 101. In the embodiment of the present invention, there is a gap between the signal line connection pad 102 and the ground pad 107 , so that the signal line connection pad 102 will not be in contact with the ground pad 107 , and the signal line connection pad 102 is ensured normal operation of electronic components 101 . The conductive layer 1041 is preferably a conductive metal, such as copper, which may be formed by coating copper on the hole wall of the through hole 104 to form a copper layer. Since the through hole 104 penetrates through the dielectric layer 105 and the electrostatic protection layer 106 , the copper layer on the hole wall of the through hole 104 will also contact the electrostatic protection layer 106 ; in addition, the copper layer is also connected to the signal line connecting the electronic component 101 . The connection pads 102 are connected. The electrostatic protection layer 106 has anti-instantaneous electrical overload performance. For example, when subjected to a high voltage (>250V) generated by static electricity, the electrostatic protection layer 106 can change from an insulator to a conductor to realize electrostatic conduction. Specifically, when the electronic component 101 is subjected to static electricity and generates a high voltage, the generated static electricity is transmitted to the electrostatic protection layer 106 along the signal line connecting pad 102 and the copper layer. Since the electrostatic protection layer 106 is in contact with the ground pad 107, The static electricity can also be conducted from the static electricity protection layer 106 to the grounding pad 107 to realize the grounding and play the function of static electricity protection, so as to protect the electronic component 101 .

Preferably, the material of the electrostatic protection layer 106 is a pressure-sensitive material, and the pressure-sensitive material may be inorganic silicon, a metal oxide pressure-sensitive material, a polymer voltage-mutagenic material, or the like. The varistor material has nonlinear conductive characteristics. In the low voltage state, the resistivity of the varistor material is very high, and it is an insulator; when the voltage rises and reaches the preset voltage value, the resistivity of the varistor material will decrease sharply and become into a conductor. In the embodiment of the present invention, when the electronic component 101 is subjected to static electricity to generate a high voltage, the pressure-sensitive material changes from an insulator to a conductor, which can also conduct the static electricity conducted to the static electricity protection layer 106 to the grounding pad 107, thereby acting as static electricity. protective function.

Optionally, as shown in FIG. 1, the circuit board structure includes multiple dielectric layers 105, and at least one side of each dielectric layer 105 is provided with signal line connection pads 102, so as to realize the electronic components 101 and 102 on the circuit board structure. the layout of its signal lines. The electrostatic protection layer 106 is arranged between any two dielectric layers 105 , and the ground pad 107 is sandwiched between the electrostatic protection layer 106 and the dielectric layer 105 , and the ground pad 107 is connected to the signal line on the dielectric layer 105 by soldering There are gaps between the disks 102 . Wherein, the material of the ground pad 107 can be copper, and the ground pad 107 can be a small piece of copper sheet disposed on the electrostatic protection layer 106, and further, the ground pad 107 will not occupy too much space in the circuit board structure. The size space allows more signal line connection pads 102 to be arranged on the circuit board structure, which is more beneficial to the arrangement of signal lines on the circuit board structure.

It should be noted that, in addition to the through holes 104 penetrating the dielectric layer 105 and the electrostatic protection layer 106, the circuit board structure also includes blind vias 103 disposed in the dielectric layer 105. The blind vias 103 may be filled with conductive materials, such as copper, etc. .

In an implementation manner of the embodiment of the present invention, the electrostatic protection layer 106 may be bonded to the dielectric layer 105 . For example, an adhesive film made of a pressure-sensitive material can be added between the dielectric layer 105 and the grounding pad 107, and the adhesive film made of the pressure-sensitive material is the electrostatic protection layer 106, thus realizing the electrostatic protection layer. 106 is firmly connected to the dielectric layer 105 and to the ground pad 107 .

In another implementation of the embodiment of the present invention, the electrostatic protection layer 106 may be coated on the dielectric layer 105 . For example, a thin pressure-sensitive material is coated on the dielectric layer 105 to form the electrostatic protection layer 106 , and then the grounding pad 107 and the dielectric layer 105 are arranged on the electrostatic protection layer 106 to realize the electrostatic protection layer 106 and the grounding pad 107 is connected to ensure that after the electrostatic protection layer 106 is changed from an insulator to a conductive layer 1041, the static electricity conducted to the electrostatic protection layer 106 can be conducted to the grounding pad 107 to achieve grounding, so as to ensure the protection of the electronic components 101 on the circuit board structure. Safety.

Optionally, the thickness of the electrostatic protection layer 106 is 1-25 μm, preferably a smaller value, so that the overall thickness of the circuit board structure will not increase too much.

In the embodiment of the present invention, the number of the dielectric layers 105 is at least one layer. Please refer to FIG. 1 and FIG. 2 for details. On the side facing away from the electrostatic protection layer 106 , the signal line connection pad 102 includes a first signal line connection pad 1021 disposed between the first dielectric layer 1051 and the electrostatic protection layer 106 , and the gap H is located at the first signal line connection pad 1021 . The wire connects between the pad 1021 and the ground pad 107 . That is, the ground pads 107 and the first signal line connection pads 1021 are not in contact to prevent the first signal line connection pads 1021 from being grounded.

Optionally, please refer to FIG. 2 , the distance of the gap H between the first signal line connecting pad 1021 and the grounding pad 107 is 15-200 μm, preferably a smaller value, which can also avoid the first signal line connecting and soldering. Due to the excessively wide distance between the pad 1021 and the ground pad 107 , the layout quantity of the signal line connection pads 102 on the dielectric layer 105 is limited.

In addition, the first signal line connection pad 1021 is connected to the conductive layer 1041 . Usually, the electronic component 101 is disposed on the surface layer of the dielectric layer 105. Please refer to FIG. 3 in detail. When the electronic component 101 is subjected to static electricity to generate a high voltage, the electrostatic protection layer 106 can be changed from an insulator to a conductor to connect the electronic components. The signal line connection pad 102 of 101 is connected to the conductive layer 1041 on the hole wall of the through hole 104, the conductive layer 1041 is connected to the first signal line connection pad 1021, and further, the static electricity generated on the electronic component 101 is connected along the signal line Pad 102→conductive layer 1041→first signal line connection pad 1021→electrostatic protection layer 106→grounding pad 107 is transferred, and finally grounded and exported, which effectively protects the electronic components 101 and prevents the electronic components 101 from electrostatic breakdown , which also ensures the safety of the circuit board structure.

In the embodiment of the present invention, an electrostatic protection layer 106 is provided in the dielectric layer 105 of the circuit board structure, and the electrostatic protection layer 106 is connected to the grounding pad 107 . The electrostatic protection layer 106 and the dielectric layer 105 have through holes 104 penetrating through them. The conductive layer 1041 on the hole wall of the hole 104 is also in contact with the electrostatic protection layer 106, and the conductive layer 1041 is connected to the signal line connecting pad 102 connecting the electronic component 101, and then when the electronic component 101 is subjected to static electricity, a high voltage is generated At this time, the electrostatic protection layer 106 is changed from an insulator to a conductor, so as to realize the grounding of static electricity on the electronic components 101 and protect the electronic components 101 from being damaged by static electricity. In this way, the circuit board structure does not need to add additional anti-static devices, which simplifies the The hardware design of the circuit board structure. In addition, compared with the existing need to set a ground layer on each dielectric layer 105, the design of the embodiment of the present invention only needs to set the ground pad 107 on one side of the electrostatic protection layer 106 to achieve grounding, reducing the need for The design of the ground layer in the circuit board structure is more favorable for the layout of the signal lines on the circuit board structure.

Embodiments of the present invention also provide an electronic device, including the circuit board structure described in the above embodiments. The electronic device provided by the embodiment of the present invention includes all the technical features of the circuit board structure in the above-mentioned embodiment, and can achieve the same technical effect. To avoid repetition, details are not repeated here.

Wherein, the electronic devices may include: mobile phones, tablet computers, e-book readers, MP3 players, MP4 players, digital cameras, laptop computers, in-vehicle computers, desktop computers, set-top boxes, smart TVs, wearable devices at least one of.

The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited to this. Any person skilled in the art who is familiar with the technical scope disclosed by the present invention can easily think of changes or replacements, which should cover within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims (8)

1. a circuit board structure, is characterized in that, comprises: a dielectric layer, a signal line connecting pad and a grounding pad are arranged on the medium layer, and a gap is arranged between the signal line connecting pad and the grounding pad; an electrostatic protection layer, the electrostatic protection layer is arranged on the side of the dielectric layer facing the grounding pad, and abuts with the grounding pad; electronic components, connected with the signal wire connection pads; Wherein, the dielectric layer and the electrostatic protection layer have through holes penetrating through, and a conductive layer is provided on the hole wall of the through hole, and the conductive layer is connected to the connection pads of the signal lines connecting the electronic components. 2 . The circuit board structure according to claim 1 , wherein the material of the electrostatic protection layer is a pressure-sensitive material. 3 . 3 . The circuit board structure according to claim 1 , wherein the electrostatic protection layer is bonded to the dielectric layer. 4 . 4 . The circuit board structure according to claim 1 , wherein the electrostatic protection layer is coated on the dielectric layer. 5 . 5 . The circuit board structure according to claim 1 , wherein the electrostatic protection layer has a thickness of 1-25 μm. 6 . 6 . The circuit board structure according to claim 1 , wherein the number of the dielectric layers is at least one layer, and the at least one dielectric layer includes a first dielectric layer, and the first dielectric layer is located on the grounding layer. 7 . the side of the pad facing away from the electrostatic protection layer, the signal wire connection pad includes a first signal wire connection pad disposed between the first dielectric layer and the electrostatic protection layer, the signal wire connection pad A gap is located between the first signal line connecting pad and the ground pad. 7 . The circuit board structure according to claim 6 , wherein the distance of the gap is 15-200 μm. 8 . 8. An electronic device, comprising the circuit board structure according to any one of claims 1-7.