TWI446662B - Electronic device and conductive board thereof - Google Patents

Description

Electronic device and its conductive plate

The present invention relates to a conductive plate, and more particularly to a conductive plate for eliminating static electricity.

Electrostatic discharge (ESD) is the main cause of most electronic components or electronic systems being damaged by excessive electrical stress (EOS). Such damage can cause permanent damage to semiconductor components and computer systems, thereby affecting the circuit functions of integrated circuits (ICs), and making electronic products work abnormally.

In the prior art, a simple design of a conductive plate is added to the electronic device to provide a function of electrostatic protection. However, due to its limited effectiveness, it does not provide complete ESD protection. In addition, when the electronic device is connected to an external current, the leakage current may be distributed on the metal casing of the electronic device, thereby increasing the risk of electric shock to the user.

The present invention provides a conductive plate for solving the problems of the prior art, comprising a first conducting unit, a second conducting unit, a tip discharge unit, a discharge area amplifying unit and a contact area amplifying unit. The tip discharge unit, the discharge area amplifying unit and the contact area amplifying unit are electrically connected to the first conducting unit and the second conducting unit, and are interposed between the first conducting unit and the second conducting unit.

An embodiment of the present invention also provides an electronic device including the foregoing conductive plate, a first metal case, and a second metal case. The first of the conductive plates A conductive unit is electrically connected to the first metal housing, and the second conductive unit of the conductive plate is electrically connected to the second metal housing.

The conductive plate of the embodiment of the present invention can effectively remove static electricity and provide complete electrostatic protection function by improving discharge performance by means of a tip discharge unit, a discharge area amplifying unit and a contact area amplifying unit. In addition, since the conductive plate of the embodiment of the present invention provides good discharge performance, when the electronic device is connected to an external current, the leakage current can be reliably eliminated by the conductive plate without remaining on the metal casing, thereby reducing the electric shock of the user. risks of.

Embodiments of the present invention provide a conductive plate that has a complete discharge function and provides a good discharge effect. Referring to Figures 1 and 2A to 2E, there is shown a conductive plate of the embodiment of the present invention and its respective layer structures. The conductive plate 100 of the embodiment of the present invention includes a first conducting unit 10 (Fig. 2A), a second conducting unit 20 (Fig. 2E), a tip discharge unit 30 (Fig. 2B), and a discharge area amplifying unit 40 ( 2C), a contact area amplifying unit 50 (FIG. 2D), a plurality of first via conductive structures 61, and a plurality of second via conductive structures 62.

Referring to FIGS. 1 and 2A , the first conductive unit 10 includes a first conductive sheet 11 , and the first conductive sheet 11 is electrically connected to the first via conductive structures 61 and the second via conductive structures 62 . A first conductive bump 12 may be formed on the first conductive sheet 11 to help conduct electricity. The form of the first conductive sheet 11 may be moderately changed. In an embodiment, the first conductive bump may also be omitted or other forms of conductive structures.

Referring to FIGS. 1 and 2E, the second conductive unit 20 includes a second conductive sheet. The second conductive sheet 21 is electrically connected to the first via conductive structures 61 and the second via conductive structures 62. A second conductive bump 22 may be formed on the second conductive sheet 21 to help conduct electricity. The form of the second conductive sheet 21 may be moderately changed. In an embodiment, the second conductive bump may also be omitted or other forms of conductive structures.

Referring to FIGS. 1 and 2B, the tip discharge unit 30 is electrically connected to the first conductive unit 10 and the second conductive unit 20 through the first via conductive structures 61 and the second via conductive structures 62, and is sandwiched Provided between the first conductive unit 10 and the second conductive unit 20. The tip discharge unit 30 includes a first tip discharge element 31 and a second tip discharge element 32. The first tip discharge element 31 includes a plurality of first mountain shaped teeth 33. The second tip discharge element 32 includes a plurality of second mountain shaped teeth 34. The tips of the first mountain-shaped teeth 33 and the tips of the second mountain-shaped teeth 34 correspond to each other. In this embodiment, the first tip discharge element 31 includes a first L-shaped edge 35, and the second tip discharge element 32 includes a second L-shaped edge 36 that corresponds to the second L. Shaped edges 36, the first mountain-shaped teeth 33 are formed in the first L-shaped edge 35, and the second mountain-shaped teeth 34 are formed on the second L-shaped edge 36.

The function of the tip discharge unit 30 is to provide a rapid discharge effect by the principle of tip discharge.

Referring to the first and second embodiments, the first and second conductive structures 61 and The tip discharge unit 30 is interposed between the first conductive unit 10 and the second conductive unit 20 element. The discharge area amplifying unit 40 package A first discharge area amplifying element 41 and a second discharge area amplifying element 42 are included. The first discharge area amplifying element 41 includes a plurality of first finger structures 43. The second discharge area amplifying element 42 includes a plurality of second finger structures 44, wherein the first finger structures 43 are staggered with the second finger structures 44.

In one embodiment, the first finger structures 43 and the second finger structures 44 have a line width of between about 2 mm and about 3 mm. The function of the discharge area amplifying unit 40 is to achieve a large discharge current with a large discharge area.

Referring to FIGS. 1 and 2D, the contact area amplifying unit 50 is electrically connected to the first conductive unit 10 and the second conductive unit 20 through the first via conductive structures 61 and the second via conductive structures 62. The tip discharge unit 30 and the discharge area amplifying unit 40 are interposed between the first conductive unit 10 and the second conductive unit 20. The contact area amplifying unit 50 includes a first contact area amplifying element 51 and a second contact area amplifying element 52. The first contact area amplifying element 51 includes a plurality of 蜿蜒 microstrip lines 53. A plurality of slotted holes 54 are formed in the second contact area amplifying element 52, each of the turns of the microstrip line 53 extending in the slotted holes 54.

In this embodiment, the tantalum microstrip lines have a line width of less than about 1 mm. The function of the contact area amplifying unit 50 is to increase the discharge speed by increasing the contact area of the two independent surfaces.

In this embodiment, the first via conductive structures 61 are electrically connected to the first conductive unit 10, the first tip discharge element 31, the first discharge area amplifying element 41, and the first contact area amplifying element 51. And the second Conduction unit 20. The second via conductive structure 62 is electrically connected to the first conductive unit 10, the second tip discharge element 32, the second discharge area amplifying element 42, the second contact area amplifying element 52, and the second conducting unit 20.

The conductive plate of the embodiment of the present invention can effectively remove static electricity and provide complete electrostatic protection function by improving discharge performance by means of a tip discharge unit, a discharge area amplifying unit and a contact area amplifying unit.

Referring to FIG. 3, there is shown an electronic device 1 to which a conductive plate according to an embodiment of the present invention is applied, including a first metal case 2 and a second metal case 3. The first conductive unit of the conductive plate 100 is electrically connected to the first metal housing 2, and the second conductive unit of the conductive plate 100 is electrically connected to the second metal housing 3.

The conductive plate of the embodiment of the present invention provides a good discharge performance. When the electronic device is connected to an external current, the leakage current can be reliably eliminated by the conductive plate without remaining on the metal casing, thereby reducing the electric shock of the user. risks of.

Although the elements are arranged in the order of the first conductive unit 10 - the tip discharge unit 30 - the discharge area amplifying unit 40 - the contact area amplifying unit 50 - the second conducting unit 20 in the above embodiment. However, the above disclosure does not limit the present invention, and the order of the tip discharge unit 30, the discharge area amplifying unit 40, and the contact area amplifying unit 50 may be moderately changed, and still provide a good discharge effect, for example, "the first conductive unit 10 - the discharge area Amplifying unit 40 - tip discharge unit 30 - contact area amplifying unit 50 - second conducting unit 20". In addition, the tip discharge unit 30 and the discharge area amplifying unit 40 And the contact area amplifying units 50 each provide a considerable degree of discharge function, and thus can be independently implemented. For example, in one embodiment, the elements of the conductive plate may be "first conductive unit 10 - tip discharge unit 30 - second conductive unit 20". In another embodiment, the component of the conductive plate may be "first conductive unit 10 - discharge area amplifying unit 40 - second conductive unit 20". In still another embodiment, the component of the conductive plate may be "first conductive unit 10 - contact area amplifying unit 50 - second conductive unit 20". Or, in an embodiment, the component of the conductive plate may be "the first conductive unit 10 - the tip discharge unit 30 - the discharge area amplifying unit 40 - the second conductive unit 20". In another embodiment, the component of the conductive plate may be "first conductive unit 10 - discharge area amplifying unit 40 - contact area amplifying unit 50 - second conducting unit 20". In still another embodiment, the component of the conductive plate may be "the first conductive unit 10 - the tip discharge unit 30 - the contact area amplifying unit 50 - the second conductive unit 20".

Although the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

1‧‧‧Electronic device

2‧‧‧First metal shell

3‧‧‧Second metal casing

10‧‧‧First Conduction Unit

11‧‧‧First conductive sheet

12‧‧‧First conductive bump

20‧‧‧Second conduction unit

21‧‧‧Second conductive sheet

22‧‧‧Second conductive bump

30‧‧‧ tip discharge unit

31‧‧‧First tip discharge element

32‧‧‧Second tip discharge element

33‧‧‧First Yamagata

34‧‧‧Second Yamagata

35‧‧‧First L-shaped edge

36‧‧‧Second L-shaped edge

40‧‧‧Discharge area amplification unit

41‧‧‧First discharge area amplification component

42‧‧‧Second discharge area amplification component

43‧‧‧First finger structure

44‧‧‧second finger structure

50‧‧‧Contact area amplification unit

51‧‧‧First contact area amplification component

52‧‧‧Second contact area amplifying element

53‧‧‧蜿蜒 microstrip line

54‧‧‧蜿蜒 slot

61‧‧‧First dielectric conductive structure

62‧‧‧Second interlayer conductive structure

100‧‧‧conductive plate

1 is a conductive plate according to an embodiment of the present invention; FIG. 2A shows a first conductive unit of an embodiment of the present invention; FIG. 2B shows a tip discharge unit of an embodiment of the present invention; and FIG. 2C shows an embodiment of the present invention. Example of a discharge area amplifying unit; FIG. 2D shows a contact area amplifying unit of the embodiment of the present invention; FIG. 2E shows a second conducting unit of the embodiment of the present invention; and FIG. 3 shows a conductive application to which the embodiment of the present invention is applied Board electronic equipment Set.

10‧‧‧First Conduction Unit

12‧‧‧First conductive bump

20‧‧‧Second conduction unit

22‧‧‧Second conductive bump

30‧‧‧ tip discharge unit

40‧‧‧Discharge area amplification unit

50‧‧‧Contact area amplification unit

100‧‧‧conductive plate

Claims (18)

A conductive plate comprising: a first conducting unit; a second conducting unit; and a tip discharge unit electrically connected to the first conducting unit and the second conducting unit, and sandwiching the first conducting unit and the The second conductive unit, wherein the tip discharge unit comprises: a first tip discharge element comprising a plurality of first mountain shaped teeth; and a second tip discharge element, the second tip discharge element comprising a plurality of second mountain shaped teeth, wherein the tips of the first mountain shaped teeth and the tips of the second mountain shaped teeth correspond to each other. The conductive plate of claim 1, wherein the first tip discharge element comprises a first L-shaped edge, and the second tip discharge element comprises a second L-shaped edge, the first L-shaped edge pair A second L-shaped edge should be formed, the first mountain-shaped teeth being formed on the first L-shaped edge, and the second mountain-shaped teeth being formed on the second L-shaped edge. The conductive plate of claim 1, further comprising a discharge area amplifying unit electrically connected to the first conducting unit, the second conducting unit and the tip discharge unit, wherein the discharge area amplifying unit is interposed Between the first conducting unit and the second conducting unit, the discharge area amplifying unit comprises: a first discharge area amplifying element comprising a plurality of first finger structures; and a second discharge area amplifying element comprising a plurality of Two-finger knot The first finger structures are staggered with the second finger structures. The conductive plate of claim 3, wherein the first finger structures and the second finger structures have a line width of between about 2 mm and 3 mm. The conductive plate of claim 3, further comprising a contact area amplifying unit electrically connected to the first conducting unit, the second conducting unit, the tip discharge unit and the discharge area amplifying unit, the contact The area amplifying unit is interposed between the first conducting unit and the second conducting unit, and the contact area amplifying unit comprises: a first contact area amplifying element comprising a plurality of 蜿蜒 microstrip lines; and a second contact area enlargement And an element, wherein a plurality of grooved holes are formed in the second contact area amplifying element, and each of the 蜿蜒 microstrip lines extends in the sipe holes. The conductive plate of claim 5, wherein the 蜿蜒 microstrip line has a line width of less than about 1 mm. The conductive plate of claim 5, further comprising a plurality of first interlayer conductive structures electrically connected to the first conductive unit, the first tip discharge element, a first discharge area amplifying element, the first contact area amplifying element, and the second conducting unit. The conductive plate of claim 7, further comprising a plurality of second interlayer conductive structures electrically connected to the first conductive unit, the second tip discharge element, a second discharge area amplifying element, the second contact area amplifying element, and the second conducting unit. An electronic device comprising: a first metal casing; a second metal casing; and the electrically conductive plate of claim 1, wherein the first conducting unit is electrically connected to the first metal casing, The second conductive unit is electrically connected to the second metal housing. A conductive plate comprising: a first conducting unit; a second conducting unit; and a discharge area amplifying unit electrically connected to the first conducting unit and the second conducting unit and sandwiched between the first conducting unit and The second conductive unit includes: a first discharge area amplifying element including a plurality of first finger structures; and a second discharge area amplifying element including a plurality of second finger structures Wherein the first finger structures are staggered with the second finger structures. The conductive plate of claim 10, wherein the first finger structures and the second finger structures have a line width of between about 2 mm and about 3 mm. The conductive plate of claim 10, further comprising a contact area amplifying unit electrically connected to the first conducting unit, the second conducting unit, the tip discharge unit and the discharge area amplifying unit, the contact The area amplifying unit is interposed between the first conducting unit and the second conducting unit, and the contact area amplifying unit comprises: a first contact area amplifying element comprising a plurality of 蜿蜒 microstrip lines; and a second contact area amplifying element, wherein a plurality of sipe holes are formed in the second contact area amplifying element, the 蜿蜒 microstrip The wires each extend in the slotted holes. The conductive plate of claim 12, wherein the 蜿蜒 microstrip line has a line width of less than about 1 mm. An electronic device comprising: a first metal housing; a second metal housing; and the conductive plate of claim 10, wherein the first conductive unit is electrically connected to the first metal housing, The second conductive unit is electrically connected to the second metal housing. A conductive plate comprising: a first conducting unit; a second conducting unit; and a contact area amplifying unit electrically connected to the first conducting unit and the second conducting unit and sandwiched between the first conducting unit and Between the second conductive units, wherein the contact area amplifying unit comprises: a first contact area amplifying element comprising a plurality of 蜿蜒 microstrip lines; and a second contact area amplifying element, wherein the plurality of 蜿蜒 slots Formed on the second contact area amplifying element, each of the 蜿蜒 microstrip lines extending in the sipe holes. The conductive plate according to claim 15, wherein the The line width of the isosceles microstrip line is less than about 1 mm. The conductive plate of claim 3, further comprising a tip discharge unit electrically connected to the first conductive unit, the second conductive unit, and the contact area amplifying unit, wherein the tip discharge unit is disposed Between the first conducting unit and the second conducting unit, the tip discharge unit unit includes: a first tip discharge element including a plurality of first mountain shaped teeth; and a second tip discharge element, the first The two tip discharge elements include a plurality of second mountain shaped teeth, wherein the tips of the first mountain shaped teeth and the tips of the second mountain shaped teeth correspond to each other. An electronic device comprising: a first metal casing; a second metal casing; and the electrically conductive plate of claim 15 wherein the first conducting unit is electrically connected to the first metal casing, The second conductive unit is electrically connected to the second metal housing.