JP3690519B2 - Circuit board with electrostatic protection pattern - Google Patents

Circuit board with electrostatic protection pattern Download PDF

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Publication number
JP3690519B2
JP3690519B2 JP2002294957A JP2002294957A JP3690519B2 JP 3690519 B2 JP3690519 B2 JP 3690519B2 JP 2002294957 A JP2002294957 A JP 2002294957A JP 2002294957 A JP2002294957 A JP 2002294957A JP 3690519 B2 JP3690519 B2 JP 3690519B2
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Prior art keywords
internal circuit
static electricity
pattern
board
electronic components
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JP2004134453A (en
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有泰 幸泉
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Funai Electric Co Ltd
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Funai Electric Co Ltd
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Description

【０００１】
【発明の属する技術分野】
本発明は、基板上における電子部品が配置された内部回路の周囲であって基板の縁部近傍に、外部からの静電気から前記内部回路の電子部品を保護するために、この静電気を放電させるための静電気保護パターンが前記内部回路を取り囲んで形成された回路基板に関する。
【０００２】
【従来の技術】
第１の従来技術を図４、図５に示す。プリント基板に印刷された電源／信号ライン１０１と一体に形成された鋸歯状ランド１０２と、アースライン１０４と一体に形成された鋸歯状ランド１０５とを、その鋭角な先端部をギャップｇをもって近接対向させることにより、外部からの静電気を金属筐体１０６へ落とし、基板内に取り付けた電子部品に静電気が流入するのを防止するものである。（例えば、特許文献１参照）。
ところが、これにおいては、基板上の回路全般を静電気から保護しているものではなくて、複数の電源／信号ライン１０１からの静電気をアースライン１０４を経て金属筐体１０６へ落とすようにしたものであった。
【０００３】
第２の従来技術を図６に示す。透明な基板２３２と；透明な基板２３２の表面の所定の領域に配置されたパターン化されたシールド層と；透明基板２３２の表面上に配置された静電荷（ＥＳＤ）保護層３３６とからなり、ＥＳＤ保護層３３６はシールド層を囲み、ＥＳＤ保護層３３６は複数の放電ピークからなり、放電ピークはフォトマスク２３０から電荷を除去するために空気中に静電気を放電するために用いられるものである。（例えば、特許文献２参照）。
ところが、これにおいては、外部から入ってきた静電気を静電気（ＥＳＤ）保護層３３６の全体で放電しているが、電位が低いものが放電しにくいという問題があった。
【０００４】
第３の従来技術を図７（ａ）（ｂ）（ｃ）に示す。配線基板３００の外周部に設けた電子部品３１４Ａより構成される導体部３１４を利用して、グランドラインへ放電させることで、内部回路の誤作動や破壊を防ぐようにする。筐体３２０の隙間に帯電した帯電棒３３０が近づいてきて、帯電棒３３０と電子部品３１４Ａとの距離が空気の放電耐力を破壊するだけの距離ｄ１に近づいた時、電子部品３１４Ａの電極に静電気放電が起こる。この静電気は、形状の鋭角な部位ほど電荷が集中するため、放電しやすいという性質があるので、電子部品３１４Ａとしてチップコンデンサを実装しておくと、電極の角部に電極が集中し、避雷針の役目を果たすことになる。この時、ＩＣ３４０の電極と帯電棒３３０との距離は、まだｄ１より離れているため、ＩＣ３４０の電極に静電気放電が起こることはないものである。（例えば、特許文献３参照）。
ところが、これは帯電棒３３０を使用しているものである。
【０００５】
【特許文献１】
特開２０００−３２３８００号公報
【特許文献２】
特開２００２−５５４３８号公報
【特許文献３】
特開２００１−３０８５８６号公報
【０００６】
【発明が解決しようとする課題】
本発明は、外部からの静電気を殆ど放電することができて、この静電気から基板上の回路に接続された電子部品への影響を少なくすることができ、しかも低い電位の静電気でも放電することができることを課題とする。
【０００７】
【課題を解決するための手段】
本発明は、上記課題を解決するために提案されたものであって、請求項１に記載の発明は、基板上における電子部品が配置された内部回路の周囲であって基板の縁部近傍に、外部からの静電気から前記内部回路の電子部品を保護するために、この静電気を放電させるための静電気保護パターンが前記内部回路を取り囲んで形成された回路基板において、前記パターンの複数箇所に、鋭角を形作る先端部同士が前記内部回路の外輪郭線に沿う方向で対峙して互いに点接触した一対の静電気放電部分が備わり、これらの静電気放電部分の形成箇所では、前記パターンが、その幅方向両側のそれぞれからその幅方向内側に向けてＶ字形に切り込んだ形に形作られていることを特徴としている。
【０００８】
請求項２に記載の発明は、基板上における電子部品が配置された内部回路の周囲であって基板の縁部近傍に、外部からの静電気から前記内部回路の電子部品を保護するために、この静電気を放電させるための静電気保護パターンが前記内部回路を取り囲んで形成された回路基板において、前記パターンの複数箇所に、そのパターンを、その幅方向両側のそれぞれからその幅方向内側に向けてＶ字形に切り込んだ形に形作ることによって形成された静電気放電部分が備わっていることを特徴としている。
【０００９】
請求項３に記載の発明は、基板上における電子部品が配置された内部回路の周囲であって基板の縁部近傍に、外部からの静電気から前記内部回路の電子部品を保護するために、この静電気を放電させるための静電気保護パターンが前記内部回路を取り囲んで形成された回路基板において、前記パターンの複数箇所に、鋭角を形作る先端部同士が前記内部回路の外輪郭線に沿う方向で対峙して互いに点接触した一対の静電気放電部分が備わり、これらの静電気放電部分の形成箇所では、前記パターンが、前記内部回路に近い幅方向片側から前記基板の縁部に近い幅方向他側に向けてＶ字形に切り込んだ形に形作られていることを特徴としている。
【００１０】
【発明の実施の形態】
以下、本発明に係る静電気保護パターンを有する回路基板の実施の形態について、図を参照しつつ説明する。
図１は本発明の第１実施形態の静電気保護パターンを有する回路基板の概略平面図である。
【００１１】
この第１実施形態の静電気保護パターンを有する回路基板は、図１に示すように、基板１上における電子部品（図示略）が配置された内部回路２の周囲であって基板１の縁部近傍に、外部からの静電気から内部回路２の電子部品を保護するために、この静電気を放電させるための静電気保護パターン３Ａが形成されている。そして、このパターン３の複数箇所に、鋭角を形作る先端部同士が前記内部回路２の外輪郭線に沿う方向で対峙して互いに点接触した一対の静電気放電部分３ａが備わり、これらの静電気放電部分３ａの形成箇所では、前記パターン３Ａが、その幅方向両側のそれぞれからその幅方向内側に向けてＶ字形に切り込んだ形に形作られている。
そして、このパターン３の静電気放電部分３ａから、外部からの静電気が放電されることによって、外部からの静電気から基板１上の内部回路の電子部品が保護されるようにしている。
【００１２】
即ち、この静電気は、形状の鋭角な部位ほど電荷が集中するため、放電しやすいという性質があるので、静電気保護パターン３Ａの鋭角な部分である静電気放電部分３ａから静電気が空気中に放電されるのである。
また、静電気保護パターン３Ａの一部に静電気が外部から入ると、その静電気保護パターン３Ａの他の部分の電位が低いので、その向きに静電気が流れ、途中の鋭角な部分の静電気放電部分３ａから静電気が放電されることとなる。
【００１３】
したがって、この第１実施形態の静電気保護パターンを有する回路基板によれば、静電気放電部分３ａから殆ど放電することができて、この静電気から基板１上の内部回路２に接続された電子部品への影響を少なくすることができ、しかも低い電位の静電気でも放電することができる。
【００１４】
図２は第２実施形態の静電気保護パターンを有する回路基板の概略平面図である。
この第２実施形態の静電気保護パターンを有する回路基板は、図２に示すように、基板１上における電子部品が配置された内部回路２の周囲であって基板１の縁部近傍に、外部からの静電気から前記内部回路２の電子部品を保護するために、この静電気を放電させるための静電気保護パターン３Ｂが前記内部回路２を取り囲んで形成されている。そして、前記パターン３Ｂの複数箇所に、そのパターン３Ｂを、その幅方向両側のそれぞれからその幅方向内側に向けてＶ字形に切り込んだ形に形作ることによって形成された静電気放電部分３ｂが備わっている。
したがって、この第２実施形態の静電気保護パターンを有する回路基板によれば、静電気放電部分３ｂから空気中に殆ど放電することができて、この静電気から基板１上の内部回路２に接続された電子部品への影響を少なくすることができ、しかも低い電位の静電気でも放電することができる。
【００１５】
図３は第３実施形態の静電気保護パターンを有する回路基板の概略平面図である。
この第３実施形態の静電気保護パターンを有する回路基板は、図３に示すように、基板１上における電子部品が配置された内部回路２の周囲であって基板１の縁部近傍に、外部からの静電気から前記内部回路２の電子部品を保護するために、この静電気を放電させるための静電気保護パターン３Ｃが前記内部回路２を取り囲んで形成されている。そして、 前記パターン３Ｃの複数箇所に、鋭角を形作る先端部同士が前記内部回路２の外輪郭線に沿う方向で対峙して互いに点接触した一対の静電気放電部分３ｃが備わり、これらの静電気放電部分３ｃの形成箇所では、前記パターン３Ｃが、前記内部回路２に近い幅方向片側から前記基板１の縁部に近い幅方向他側に向けてＶ字形に切り込んだ形に形作られている。
したがって、この第３実施形態の静電気保護パターンを有する回路基板によれば、静電気放電部分３ｃが内部回路２から隔てた箇所で静電気を空気中に放電できて、内部回路２の電子部品への静電気の影響をより一層少なくすることができる。
【００１６】
【発明の効果】
以上説明したように、請求項１に記載の発明は、基板上における電子部品が配置された内部回路の周囲であって基板の縁部近傍に、外部からの静電気から前記内部回路の電子部品を保護するために、この静電気を放電させるための静電気保護パターンが前記内部回路を取り囲んで形成された回路基板において、前記パターンの複数箇所に、鋭角を形作る先端部同士が前記内部回路の外輪郭線に沿う方向で対峙して互いに点接触した一対の静電気放電部分が備わり、これらの静電気放電部分の形成箇所では、前記パターンが、その幅方向両側のそれぞれからその幅方向内側に向けてＶ字形に切り込んだ形に形作られているので、以下に述べる効果を奏する。
【００１７】
即ち、外部からの静電気を静電気放電部分から殆ど放電することができて、この静電気から基板上の内部回路に接続された電子部品への影響を少なくすることができ、しかも低い電位の静電気でも放電することができる。
【００１８】
請求項２に記載の発明は、基板上における電子部品が配置された内部回路の周囲であって基板の縁部近傍に、外部からの静電気から前記内部回路の電子部品を保護するために、この静電気を放電させるための静電気保護パターンが前記内部回路を取り囲んで形成された回路基板において、前記パターンの複数箇所に、そのパターンを、その幅方向両側のそれぞれからその幅方向内側に向けてＶ字形に切り込んだ形に形作ることによって形成された静電気放電部分が備わっているので、以下に述べる効果を奏する。
即ち、外部からの静電気を静電気放電部分から殆ど放電することができて、この静電気から基板上の内部回路に接続された電子部品への影響を少なくすることができ、しかも低い電位の静電気でも放電することができる。
【００１９】
請求項３に記載の発明は、基板上における電子部品が配置された内部回路の周囲であって基板の縁部近傍に、外部からの静電気から前記内部回路の電子部品を保護するために、この静電気を放電させるための静電気保護パターンが前記内部回路を取り囲んで形成された回路基板において、前記パターンの複数箇所に、鋭角を形作る先端部同士が前記内部回路の外輪郭線に沿う方向で対峙して互いに点接触した一対の静電気放電部分が備わり、これらの静電気放電部分の形成箇所では、前記パターンが、前記内部回路に近い幅方向片側から前記基板の縁部に近い幅方向他側に向けてＶ字形に切り込んだ形に形作られているので、内部回路から隔てた箇所で静電気を放電することができ、内部回路の電子部品への静電気の影響をより一層少なくすることができる。
【図面の簡単な説明】
【図１】 第１実施形態の静電気保護パターンを有する回路基板の概略平面図である。
【図２】 第２実施形態の静電気保護パターンを有する回路基板の概略平面図である。
【図３】 第３実施形態の静電気保護パターンを有する回路基板の概略平面図である。
【図４】 従来のプリント配線基板の一部を示す平面図である。
【図５】 同プリント配線基板における静電気発生状態を示す平面図である。
【図６】 従来のＥＳＤの保護機能を有するフォトマスクの平面図である。
【図７】 従来の電気機器を示し、（ａ）はその配線基板の平面図、（ｂ）はその配線基板を筐体内に配置した状態を示す部分断面図、（ｃ）はその電気機器の別例の配線基板を筐体内に配置した状態を示す部分断面図である。
【符号の説明】
１ 基板
２ 内部回路
３Ａ 静電気保護パターン
３Ｂ 静電気保護パターン
３Ｃ 静電気保護パターン
３ａ 静電気放電部分
３ｂ 静電気放電部分
３ｃ 静電気放電部分[0001]
BACKGROUND OF THE INVENTION
The present invention is to discharge static electricity in order to protect the electronic components of the internal circuit from external static electricity around the internal circuit where the electronic components are arranged on the board and in the vicinity of the edge of the board. The electrostatic protection pattern of the circuit board is formed to surround the internal circuit .
[0002]
[Prior art]
The first prior art is shown in FIGS. The sawtooth land 102 formed integrally with the power / signal line 101 printed on the printed circuit board and the sawtooth land 105 formed integrally with the earth line 104 are closely opposed to each other with a gap g at an acute tip. By doing so, static electricity from the outside is dropped onto the metal casing 106, and static electricity is prevented from flowing into the electronic components attached in the substrate. (For example, refer to Patent Document 1).
However, in this case, the entire circuit on the board is not protected from static electricity, but static electricity from a plurality of power / signal lines 101 is dropped to the metal casing 106 via the ground line 104. there were.
[0003]
A second prior art is shown in FIG. A transparent substrate 232; a patterned shield layer disposed in a predetermined region of the surface of the transparent substrate 232; and an electrostatic charge (ESD) protective layer 336 disposed on the surface of the transparent substrate 232; The ESD protection layer 336 surrounds the shield layer, and the ESD protection layer 336 includes a plurality of discharge peaks, and the discharge peaks are used to discharge static electricity into the air in order to remove charges from the photomask 230. (For example, refer to Patent Document 2).
However, in this case, the static electricity that has entered from the outside is discharged by the whole of the electrostatic protection (ESD) protective layer 336 , but there is a problem that a low potential is difficult to discharge.
[0004]
The third prior art is shown in FIGS. 7 (a), (b) and (c). By using the conductor part 314 formed of the electronic component 314A provided on the outer peripheral part of the wiring board 300, the ground line is discharged, thereby preventing malfunction or destruction of the internal circuit. When the charged rod 330 approaches the gap of the housing 320 and the distance between the charging rod 330 and the electronic component 314A approaches a distance d1 that destroys the discharge resistance of air, the electrode of the electronic component 314A is electrostatically charged. Discharge occurs. This static electricity has the property of being more likely to discharge because the charge is concentrated at the sharper part of the shape. Therefore, if a chip capacitor is mounted as the electronic component 314A, the electrode concentrates on the corner of the electrode, and the lightning rod Will play a role. At this time, since the distance between the electrode of the IC 340 and the charging rod 330 is still larger than d1, the electrostatic discharge does not occur in the electrode of the IC 340. (For example, refer to Patent Document 3).
However, this uses the charging rod 330.
[0005]
[Patent Document 1]
JP 2000-323800 A [Patent Document 2]
JP 2002-55438 A [Patent Document 3]
Japanese Patent Laid-Open No. 2001-308586
[Problems to be solved by the invention]
The present invention can discharge most of the static electricity from the outside, can reduce the influence of this static electricity on the electronic components connected to the circuit on the substrate, and can discharge even at low potential static electricity. Let's make it a subject.
[0007]
[Means for Solving the Problems]
The present invention has been proposed in order to solve the above-mentioned problems, and the invention according to claim 1 is the periphery of an internal circuit in which electronic components are arranged on a substrate and in the vicinity of an edge of the substrate. In order to protect the electronic components of the internal circuit from external static electricity, an electrostatic protection pattern for discharging the static electricity is formed around the internal circuit. Are provided with a pair of electrostatic discharge portions that are point-contacted with each other in a direction along the outer contour line of the internal circuit, and the pattern is formed on both sides in the width direction at the locations where these electrostatic discharge portions are formed. It is characterized in that it is formed into a V-shape cut from each of them toward the inner side in the width direction .
[0008]
According to the second aspect of the present invention, in order to protect the electronic components of the internal circuit from static electricity from the outside around the internal circuit where the electronic components are arranged on the substrate and in the vicinity of the edge of the substrate. In a circuit board on which an electrostatic protection pattern for discharging static electricity is formed so as to surround the internal circuit, the pattern is formed in a V-shape at a plurality of positions of the pattern from both sides in the width direction toward the inside in the width direction. It is characterized in that it is provided with an electrostatic discharge portion formed by forming it into a shape cut into .
[0009]
According to a third aspect of the present invention, in order to protect the electronic components of the internal circuit from external static electricity around the internal circuit where the electronic components are arranged on the substrate and in the vicinity of the edge of the substrate. In a circuit board on which an electrostatic protection pattern for discharging static electricity is formed so as to surround the internal circuit, tip portions forming an acute angle face each other in a direction along the outer contour line of the internal circuit at a plurality of positions of the pattern. A pair of electrostatic discharge portions that are in point contact with each other, and at the locations where these electrostatic discharge portions are formed, the pattern extends from one side in the width direction close to the internal circuit to the other side in the width direction close to the edge of the substrate. It is characterized by being cut into a V shape .
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of a circuit board having an electrostatic protection pattern according to the present invention will be described with reference to the drawings.
FIG. 1 is a schematic plan view of a circuit board having an electrostatic protection pattern according to a first embodiment of the present invention.
[0011]
As shown in FIG. 1, the circuit board having the electrostatic protection pattern of the first embodiment is around the internal circuit 2 where electronic components (not shown) are arranged on the board 1 and in the vicinity of the edge of the board 1. In addition, in order to protect the electronic components of the internal circuit 2 from static electricity from the outside, a static electricity protection pattern 3A for discharging the static electricity is formed. A plurality of portions of the pattern 3 are provided with a pair of electrostatic discharge portions 3a in which the tip portions forming an acute angle face each other in the direction along the outer contour line of the internal circuit 2 and are in point contact with each other. At the place where 3a is formed, the pattern 3A is formed in a V-shape cut from the both sides in the width direction toward the inside in the width direction.
Then, static electricity from the outside is discharged from the static electricity discharge portion 3a of the pattern 3 so that the electronic components of the internal circuit on the substrate 1 are protected from the static electricity from the outside.
[0012]
That is, since the static electricity is more likely to be discharged because the charge is concentrated at a sharper portion of the shape, the static electricity is discharged into the air from the electrostatic discharge portion 3a which is a sharp portion of the static electricity protection pattern 3A. It is.
Further, when static electricity enters a part of the static electricity protection pattern 3A from the outside, the electric potential of other parts of the static electricity protection pattern 3A is low, so that static electricity flows in the direction and from the electrostatic discharge part 3a at a sharp angle part in the middle Static electricity will be discharged.
[0013]
Therefore, according to the circuit board having the electrostatic protection pattern of the first embodiment, the electrostatic discharge portion 3a can be almost discharged, and the static electricity can be transferred to the electronic components connected to the internal circuit 2 on the board 1. The influence can be reduced, and discharge can be performed even with static electricity at a low potential.
[0014]
FIG. 2 is a schematic plan view of a circuit board having the electrostatic protection pattern of the second embodiment.
As shown in FIG. 2, the circuit board having the electrostatic protection pattern of the second embodiment is arranged around the internal circuit 2 on which electronic components are arranged on the board 1 and in the vicinity of the edge of the board 1 from the outside. In order to protect the electronic components of the internal circuit 2 from static electricity, an electrostatic protection pattern 3B for discharging the static electricity is formed surrounding the internal circuit 2. Then, electrostatic discharge portions 3b formed by cutting the pattern 3B into V-shapes from the respective sides in the width direction toward the inside in the width direction are provided at a plurality of locations of the pattern 3B. .
Therefore, according to the circuit board having a static electricity protection pattern of the second embodiment, it can be hardly discharged into the air from the static electric discharge portion 3b, connected from the static electricity to the internal circuit 2 on the substrate 1 The influence on the electronic component can be reduced, and discharge can be performed even with static electricity at a low potential.
[0015]
FIG. 3 is a schematic plan view of a circuit board having the electrostatic protection pattern of the third embodiment.
As shown in FIG. 3, the circuit board having the electrostatic protection pattern of the third embodiment is arranged around the internal circuit 2 on which electronic components are arranged on the board 1 and in the vicinity of the edge of the board 1 from the outside. In order to protect the electronic components of the internal circuit 2 from static electricity, an electrostatic protection pattern 3C for discharging the static electricity is formed surrounding the internal circuit 2. Then, at a plurality of positions of the pattern 3C, features a pair of electrostatic discharge portion 3c of the tip portions are opposed to point contact with each other in the direction along the outer profile line of the internal circuit 2 that forms an acute angle, these electrostatic discharge portion The pattern 3 </ b> C is formed in a V-shaped cut from one side in the width direction close to the internal circuit 2 to the other side in the width direction near the edge of the substrate 1 at the formation location of 3 c.
Therefore, according to the circuit board having a static electricity protection pattern of the third embodiment, the electrostatic at points electrostatic discharge portion 3c is spaced from the internal circuit 2 can discharge into the air, the internal circuit 2 to the electronic component The influence of static electricity can be further reduced.
[0016]
【The invention's effect】
As described above, according to the first aspect of the present invention, the electronic components of the internal circuit are placed around the internal circuit where the electronic components are arranged on the board and near the edge of the board from static electricity from the outside. In order to protect, a circuit board in which an electrostatic protection pattern for discharging static electricity is formed so as to surround the internal circuit, and tip portions that form acute angles are formed at outer portions of the internal circuit at a plurality of positions of the pattern. A pair of electrostatic discharge portions facing each other in the direction along the line, and at the locations where these electrostatic discharge portions are formed, the pattern is V-shaped from both sides in the width direction toward the inside in the width direction. Since it is formed into a cut shape, it has the following effects.
[0017]
That is, it is possible to almost discharge static electricity from the outside from the static electric discharge portion, the influence of the static electricity to the electronic components connected to the internal circuit on the board can be reduced, moreover in electrostatic potential lower Can be discharged.
[0018]
According to the second aspect of the present invention, in order to protect the electronic components of the internal circuit from static electricity from the outside around the internal circuit where the electronic components are arranged on the substrate and in the vicinity of the edge of the substrate. In a circuit board on which an electrostatic protection pattern for discharging static electricity is formed so as to surround the internal circuit, the pattern is formed in a V-shape at a plurality of positions of the pattern from both sides in the width direction toward the inside in the width direction. Since an electrostatic discharge portion formed by cutting into a shape is provided, the following effects can be obtained.
That is, it is possible to almost discharge static electricity from the outside from the static electric discharge portion, the influence of the static electricity to the electronic components connected to the internal circuit on the board can be reduced, moreover in electrostatic potential lower Can be discharged.
[0019]
According to a third aspect of the present invention, in order to protect the electronic components of the internal circuit from external static electricity around the internal circuit where the electronic components are arranged on the substrate and in the vicinity of the edge of the substrate. In a circuit board on which an electrostatic protection pattern for discharging static electricity is formed so as to surround the internal circuit, tip portions forming acute angles face each other in a direction along the outer contour line of the internal circuit at a plurality of locations of the pattern. A pair of electrostatic discharge portions that are in point contact with each other, and at the locations where these electrostatic discharge portions are formed, the pattern extends from one side in the width direction close to the internal circuit to the other side in the width direction close to the edge of the substrate. because it is shaped in a form cut into V-shape, it is possible to discharge static electricity at a location spaced from the internal circuit, to further reduce more the influence of static electricity to the electronic components inside the circuit It is possible.
[Brief description of the drawings]
FIG. 1 is a schematic plan view of a circuit board having an electrostatic protection pattern according to a first embodiment.
FIG. 2 is a schematic plan view of a circuit board having an electrostatic protection pattern according to a second embodiment.
FIG. 3 is a schematic plan view of a circuit board having an electrostatic protection pattern according to a third embodiment.
FIG. 4 is a plan view showing a part of a conventional printed wiring board.
FIG. 5 is a plan view showing a static electricity generation state in the printed wiring board.
FIG. 6 is a plan view of a photomask having a conventional ESD protection function.
7A and 7B show a conventional electric device, wherein FIG. 7A is a plan view of the wiring board, FIG. 7B is a partial cross-sectional view showing a state in which the wiring board is disposed in the housing, and FIG. It is a fragmentary sectional view which shows the state which has arrange | positioned the wiring board of another example in the housing | casing.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Internal circuit 3A Static electricity protection pattern 3B Static electricity protection pattern 3C Static electricity protection pattern 3a Electrostatic discharge part 3b Electrostatic discharge part 3c Electrostatic discharge part

Claims (3)

基板上における電子部品が配置された内部回路の周囲であって基板の縁部近傍に、外部からの静電気から前記内部回路の電子部品を保護するために、この静電気を放電させるための静電気保護パターンが前記内部回路を取り囲んで形成された回路基板において、
前記パターンの複数箇所に、鋭角を形作る先端部同士が前記内部回路の外輪郭線に沿う方向で対峙して互いに点接触した一対の静電気放電部分が備わり、これらの静電気放電部分の形成箇所では、前記パターンが、その幅方向両側のそれぞれからその幅方向内側に向けてＶ字形に切り込んだ形に形作られていることを特徴とする静電気保護パターンを有する回路基板。An electrostatic protection pattern for discharging the static electricity in order to protect the electronic components of the internal circuit from external static electricity around the internal circuit where the electronic components are arranged on the board and in the vicinity of the edge of the board. In a circuit board formed surrounding the internal circuit ,
A plurality of locations of the pattern are provided with a pair of electrostatic discharge portions where the tip portions forming an acute angle face each other in a direction along the outer contour line of the internal circuit and are in point contact with each other. A circuit board having an electrostatic protection pattern, wherein the pattern is formed into a V-shape cut from both sides in the width direction toward the inside in the width direction . 基板上における電子部品が配置された内部回路の周囲であって基板の縁部近傍に、外部からの静電気から前記内部回路の電子部品を保護するために、この静電気を放電させるための静電気保護パターンが前記内部回路を取り囲んで形成された回路基板において、
前記パターンの複数箇所に、そのパターンを、その幅方向両側のそれぞれからその幅方向内側に向けてＶ字形に切り込んだ形に形作ることによって形成された静電気放電部分が備わっていることを特徴とする静電気保護パターンを有する回路基板。An electrostatic protection pattern for discharging the static electricity in order to protect the electronic components of the internal circuit from external static electricity around the internal circuit where the electronic components are arranged on the board and in the vicinity of the edge of the board. In a circuit board formed surrounding the internal circuit ,
Electrostatic discharge portions formed by forming the pattern into a V shape from each of the both sides in the width direction toward the inside in the width direction are provided at a plurality of locations of the pattern. A circuit board having an electrostatic protection pattern. 基板上における電子部品が配置された内部回路の周囲であって基板の縁部近傍に、外部からの静電気から前記内部回路の電子部品を保護するために、この静電気を放電させるための静電気保護パターンが前記内部回路を取り囲んで形成された回路基板において、
前記パターンの複数箇所に、鋭角を形作る先端部同士が前記内部回路の外輪郭線に沿う方向で対峙して互いに点接触した一対の静電気放電部分が備わり、これらの静電気放電部分の形成箇所では、前記パターンが、前記内部回路に近い幅方向片側から前記基板の縁部に近い幅方向他側に向けてＶ字形に切り込んだ形に形作られていることを特徴とする静電気保護パターンを有する回路基板。An electrostatic protection pattern for discharging the static electricity in order to protect the electronic components of the internal circuit from external static electricity around the internal circuit where the electronic components are arranged on the board and in the vicinity of the edge of the board. In a circuit board formed surrounding the internal circuit ,
A plurality of locations of the pattern are provided with a pair of electrostatic discharge portions where the tip portions forming an acute angle face each other in a direction along the outer contour line of the internal circuit and are in point contact with each other. A circuit board having an electrostatic protection pattern, wherein the pattern is formed in a V-shape cut from one side in the width direction close to the internal circuit toward the other side in the width direction near the edge of the substrate. .
JP2002294957A 2002-10-08 2002-10-08 Circuit board with electrostatic protection pattern Expired - Fee Related JP3690519B2 (en)

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JP4710496B2 (en) * 2004-10-26 2011-06-29 株式会社デンソー Circuit board and electronic circuit device
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KR100861294B1 (en) 2006-02-24 2008-10-01 주식회사 하이닉스반도체 Electrostatic protection device for semiconductor circuit
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