CN101998754A - Electrostatic discharge protective structure and electronic device using same - Google Patents
Electrostatic discharge protective structure and electronic device using same Download PDFInfo
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- CN101998754A CN101998754A CN2009101710435A CN200910171043A CN101998754A CN 101998754 A CN101998754 A CN 101998754A CN 2009101710435 A CN2009101710435 A CN 2009101710435A CN 200910171043 A CN200910171043 A CN 200910171043A CN 101998754 A CN101998754 A CN 101998754A
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Abstract
The invention provides an electrostatic discharge protective structure and an electronic device using the same. The electrostatic discharge protective structure comprises a discharge structure and a conductive structure, wherein the discharge structure and the conductive structure are respectively provided with a tip and the tips are adjacent; and the discharge structure and the conductive structure are both arranged on the lower side surface of a printed circuit substrate, wherein the conductive structure is connected with a ground wire, and the discharge structure is connected with a signal wire on the upper side surface of the printed circuit substrate through an interlayer window. Thus, a layout space does not need to be reserved on the upper side surface of the substrate for the electrostatic discharge protective structure, and simultaneously the original electrostatic discharge protective effect is kept.
Description
Technical field
The invention relates to a kind of electrostatic protection structure, and particularly relevant for a kind of suitable printed circuit board (PCB) (Printed Circuit Board, PCB) electrostatic protection structure on.
Background technology
No matter integrated circuit (integrated circuit, be called for short IC or be called chip (chip)) in the process of making or after chip finishes, (Electrostatic Discharge, ESD) incident often is the main cause that causes integrated circuit to damage to static discharge.Especially in the assembling process of printed circuit board (PCB), human body or machinery may cause electrostatic discharge event with contacting all of printed circuit board (PCB), and then cause chip or assembly damage on the printed circuit board (PCB).Therefore, integrated circuit needs the function of electrostatic defending usually, to avoid external electrostatic current integrated circuit is caused damage.
Printed circuit board (PCB) is mainly with integrating electronic component, circuit and integrated circuit to form electronic component.Because in the production and its assembling process of printed circuit board (PCB), can touch operating personnel's hand and other printed circuit board (PCB), or relevant assembly mechanical, Measurer etc., the phenomenon of static discharge (static electricity) therefore takes place easily, and then damages the integrated circuit on the printed circuit board (PCB).
Printed circuit board (PCB) and flexible flat cable (Flexible Flat Cable, junction FFC) is the place that static discharge takes place easily, electrostatic induced current may be scurried into the chip component in the printed circuit-board assembly and damages via the holding wire of junction.At present, the importance of electrostatic defending in electronic product, assembly and equipment is unquestionable, but the needed price of electrostatic defending countermeasure, structure and space requirement, electronic product for simple cheap is unattainable requirement, so in limited cost, design cheap efficient electrostatic defending countermeasure, be the problem that many engineers faced always.
Common winding displacement electrostatic defending mode has following several at present:
(1) the electrostatic defending assembly is set on printed circuit board (PCB), as passive components such as ESD diode, resistance, electric capacity, inductance, increase these assemblies and can change or dredge the esd discharge path, but must on each signal pin, overall protected effect just be arranged placing modules, if the pin count of winding displacement seldom then feasible, difficult as winding displacement quantity up to causing arrangement space to furnish more than 30～40PIN, the problem that cost is too high.
(2) length of lengthening winding displacement, the effect of this mode and printed circuit board (PCB) seller resistance is similar, and long winding displacement can have higher impedance, can lure that ESD changes intrusion path into, but winding displacement is long more, and its unit price is high more, and the long chance that also can increase the ESD invasion of winding displacement.
(3) use short winding displacement to come the source that takes place away from ESD, reduce the chance of ESD invasion, but for the trend of present electronic product microminiaturization, the effect that winding displacement shortens is not as expection, and may also can cause the difficulty in the plant produced operation.
(4) winding displacement coats anti-static material, though such practice can reach comprehensive electric protection effect, but it is very important to protect selecting for use of material, and price is decided according to usable floor area and material, can increase manufacturing cost equally.
No matter use above-mentioned which kind of electrostatic defending mode, all can increase manufacturing cost, for the engineer, never have better mode for a long time and can prevent static by winding displacement end invasion, only can stop static to enter by the protection of shell to prevent that static from being invaded by the winding displacement end.
Summary of the invention
The invention provides a kind of electrostatic protection structure and the electronic installation that uses it, cutting-edge structure of its discharge usefulness is arranged on the different retes with holding wire, see through interlayer hole (via) then and connect, the another side that electrostatic current is guided to printed circuit board (PCB) is to carry out static discharge.Be arranged on the different retes (or being called different conductive layers or metal level) of printed circuit board (PCB) owing to cutting-edge structure and holding wire, therefore the earth connection that can avoid cutting-edge structure to connect contacts with flexible flat cable, can reduce required layout area of electrostatic protection structure and design difficulty simultaneously.
The present invention proposes a kind of electrostatic discharge protection structure, be applicable to a tellite, this tellite has one first conductive layer and one second conductive layer, this tellite has many signal line to be connected to a flexible flat cable, wherein those holding wires are made of one first conductive layer of this tellite, and electrostatic protection structure comprises one first discharging structure, one first interlayer hole and one first conducting structure.First discharging structure is made of second conductive layer of tellite, and first discharging structure has first tip.First interlayer hole is in order to connect one first holding wire in this first discharging structure and those holding wires; First conducting structure is made of second conductive layer of tellite, and wherein first conducting structure is connected to earth connection and has one second tip.Wherein, first conductive layer adheres to different retes separately with second conductive layer, and first tip of first discharging structure is adjacent to second tip of first conducting structure.
In one embodiment of this invention, between above-mentioned first discharging structure and first holding wire a plurality of interlayer holes can be set and reduce impedance.
In one embodiment of this invention, above-mentioned electrostatic discharge protection structure more comprises one second discharging structure, one the 3rd interlayer hole and one second conducting structure.Second discharging structure is made of second conductive layer of tellite, and second discharging structure has a tri-point, and the 3rd interlayer hole is in order to connect the secondary signal line in second discharging structure and the holding wire.Second conducting structure is made of second conductive layer of tellite, and wherein second conducting structure is connected to earth connection and has one the 4th tip.Wherein, the tri-point of second discharging structure is adjacent to the 4th tip of second conducting structure.
In one embodiment of this invention, wherein and first conductive layer be positioned at the upper side of tellite, this second conductive layer is positioned at the downside of tellite.In addition, tellite also can be a multilayer printed board.
In one embodiment of this invention, above-mentioned flexible flat cable for example be a flexible printed wiring board (FlexiblePrinted Board, FPB), a hot pressing conducting film (Heat seal) or a flexible flat cable ((FlexibleFlat Cable, FFC).
In one embodiment of this invention, wherein the shape of this first discharging structure and this first conducting structure is all triangle, and those holding wires are golden finger.
From another viewpoint, the present invention proposes a kind of electronic installation, comprises a printed circuit-board assembly, a flexible flat cable and an electrostatic discharge protection structure.Printed circuit-board assembly comprises a tellite, tellite has first conductive layer and second conductive layer, first conductive layer adheres to different retes separately with second conductive layer, and tellite has many signal line, and wherein holding wire is made of first conductive layer of tellite.Flexible flat cable is connected to those holding wires on the tellite.Electrostatic protection structure comprises one first discharging structure, one first interlayer hole and one first conducting structure.First discharging structure is made of second conductive layer of tellite, and first discharging structure has first tip.First interlayer hole is in order to connect one first holding wire in this first discharging structure and those holding wires; First conducting structure is made of second conductive layer of tellite, and wherein first conducting structure is connected to earth connection and has one second tip.Wherein, first conductive layer adheres to different retes separately with second conductive layer, and first tip of first discharging structure is adjacent to second tip of first conducting structure.All the other implementation details of electrostatic protection structure in this electronic installation please refer to above-mentioned explanation, do not add at this and give unnecessary details.
Based on above-mentioned, the invention provides a kind of electrostatic discharge protection structure, the cutting-edge structure of preventing electro-static discharge is arranged on the conductive layer different with holding wire, the earth connection of avoiding cutting-edge structure to connect contacts with flexible flat cable and produces signal error.Simultaneously, because electrostatic discharge protection structure is positioned at different conductive layers with holding wire, can avoid the too crowded problem of layout to produce the difficulty of simplified topology like this.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and conjunction with figs. is described in detail below.
Description of drawings
Fig. 1 is electronic installation schematic diagram according to an embodiment of the invention.
Fig. 2 A is the electrostatic protection structure schematic diagram of holding wire 111 according to an embodiment of the invention.
Fig. 2 B is electrostatic discharge protection structure schematic diagram according to another embodiment of the present invention.
Fig. 3 is electrostatic protection structure schematic diagram according to an embodiment of the invention.
Fig. 4 illustrates several discharging structure schematic diagrames according to another embodiment of the present invention.
Embodiment
Please refer to Fig. 1, Fig. 1 is electronic installation schematic diagram according to an embodiment of the invention, electronic installation 100 comprises printed circuit-board assembly (Printed Circuit Board Assembly, PCBA) 101 with flexible flat cable 130, wherein flexible flat cable 130 is used for connecting circuit board component 101 and back-end device, for example display panels (LiquidCrystal Display Panel) 120.Printed circuit-board assembly 101 comprises tellite 110 and the electronic component (not illustrating) that is provided with on it.130 of flexible flat cables for example be flexible printed wiring board (Flexible Printed Board, FPB), hot pressing conducting film (Heat seal) or flexible flat cable ((Flexible Flat Cable, FFC).
Have many signal line 111～119 on the tellite 110, an end of flexible flat cable 130 then is connected in holding wire 111～119, and holding wire 111～119 is formed by first conductive layer (or being called the first metal layer) of tellite 110 upper sides.Generally speaking, the holding wire 111～119 of connection flexible flat cable 130 also can be described as golden finger.Each holding wire 111～119 can be connected to the electrostatic protection structure (not illustrating) of tellite 110 downsides respectively via interlayer hole 141～149.Electrostatic protection structure is made of the structure of preaching with pointed shape, it utilizes the principle of point discharge to guide electrostatic current, electrostatic current is guided on the earth connection of another side and discharge, avoid electrostatic current to enter printed circuit-board assembly 101 and destroy chip component on it along holding wire 111～119.
Please refer to Fig. 2 A, Fig. 2 A is the electrostatic protection structure schematic diagram according to the holding wire 111 of present embodiment.Electrostatic protection structure 200 mainly comprises interlayer hole 141, discharging structure 210 and conducting structure 220.Holding wire 111 is connected to discharging structure 210 via interlayer hole 141, and conducting structure 220 then is connected to earth connection 230.Discharging structure 210 has tip 211, and 220 of conducting structures have tip 221, wherein most advanced and sophisticated 211 is adjacent to most advanced and sophisticated 221.It should be noted that in the present embodiment discharging structure 210 and conducting structure 220 are provided with the downside of tellite 110, utilize second conductive layer (or being called second metal level) of downside to constitute.
Discharging structure 210 then for example is a triangle with the shape of conducting structure 220, as long as its shape has a most advanced and sophisticated place, and its adjacent getting final product in most advanced and sophisticated place, the designer can slightly revise according to design requirement, and present embodiment is not limited.Next, please refer to Fig. 2 B, Fig. 2 B is electrostatic discharge protection structure schematic diagram according to another embodiment of the present invention.For adding the transmission speed of heavy current, the impedance that a plurality of interlayer holes 141,142 reduce its conducting path can be set between discharging structure 210 and the holding wire 111, increase the transferable magnitude of current.As for the number that is provided with of interlayer hole, require as long as meet layout, present embodiment is not limited.
By above-mentioned Fig. 2 A, Fig. 2 B as can be known, by the point discharge principle, static discharge takes place in the place, tip that electrostatic current can be directed to discharging structure 210, dissipates to earth connection 230 by the tip 221 of conducting structure 220 then, reaches the effect of electrostatic discharge protective by this.The electrostatic discharge protection structure of the holding wire 112～119 on the tellite 110 is identical with above-mentioned Fig. 2 A or Fig. 2 B, the discharging structure and the conducting structure that all can be provided with corresponding to each holding wire 112～119 at the downside of tellite 110 carry out electrostatic discharge protective, and its discharging structure and conducting structure all are arranged on the downside of tellite 110.It should be noted that the discharging structure that holding wire 111～119 is connected separates individually, but its corresponding conducting structure then can be connected to identical earth connection.
Please refer to Fig. 3, Fig. 3 is the electrostatic protection structure schematic diagram according to present embodiment.Fig. 3 illustrates the electrostatic discharge protection structure figure of the downside of tellite 110.Electrostatic discharge protection structure comprises a plurality of discharging structures 311～319 and conducting structure 321～329, and wherein discharging structure 311～319 is connected to the holding wire 111～119 of tellite 110 upper sides respectively via interlayer hole 341～349.Conducting structure 321～329 is relative in twos and adjacent with the tip of discharging structure 311～319, and the other end of conducting structure 321～329 then is coupled to earth connection 330.
Be arranged on the downside of tellite 110 though it should be noted that electrostatic discharge protection structure that Fig. 3 illustrates, present embodiment is not limited.When tellite 110 was multi-layer sheet, electrostatic discharge protection structure can be arranged on the arbitrary conductive layer in the tellite 110, as long as and the conductive layer of holding wire 111～119 use different layers.In other words, the present invention is arranged on different retes with electrostatic discharge protection structure and holding wire, and the pin of avoiding flexible flat cable 130 contacts with electrostatic discharge protection structure and influences the signal transmission.Generally speaking, tellite 110 conductive layer that uses is Copper Foil, but present embodiment is not limited.
Discharging structure 210 among above-mentioned Fig. 2 A only is an one exemplary embodiment of the present invention, but discharging structure of the present invention is not as limit.Please refer to Fig. 4, Fig. 4 illustrates several discharging structure schematic diagrames according to another embodiment of the present invention.As shown in Figure 4, discharging structure for example is triangle (Fig. 4 (a)), triangle cone shape (Fig. 4 (b)) or pentagon (Fig. 4 (c)).Wherein, the figure that is illustrated among Fig. 4 (b) is the shape of integrating interlayer hole and triangle and produces.As shown in Figure 4, the discharging structure of present embodiment mainly need have cutting-edge structure carrying out point discharge, and its layout figure there is no restriction.
In sum, the present invention is arranged on different retes with electrostatic discharge protection structure and holding wire, and the problem of avoiding electrostatic discharge protection structure to contact with flexible flat cable takes place.Simultaneously, when pin count more for a long time, this layout type also can be avoided the too crowded problem of layout, allow the designer when carrying out allocation plan than tool elasticity.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when doing a little change and retouching, so protection scope of the present invention is worked as with being as the criterion that claim was defined.
Claims (22)
1. electrostatic discharge protection structure, be applicable to a tellite, this tellite has one first conductive layer and one second conductive layer, this tellite has many signal line to be connected to a flexible flat cable, wherein those holding wires are made of one first conductive layer of this tellite, and this electrostatic protection structure comprises:
One first discharging structure is made of this second conductive layer of this tellite, and this first discharging structure has one first tip;
One first interlayer hole is in order to connect one first holding wire in this first discharging structure and those holding wires; And
One first conducting structure is made of this second conductive layer of this tellite, and wherein this first conducting structure is connected to an earth connection and has one second tip;
Wherein, this first conductive layer adheres to different retes separately with this second conductive layer, and this first tip of this first discharging structure is adjacent to this second tip of this first conducting structure.
2. electrostatic discharge protection structure as claimed in claim 1 is characterized in that, more comprises one second interlayer hole, in order to connect this first discharging structure and this first holding wire.
3. electrostatic discharge protection structure as claimed in claim 1 is characterized in that, more comprises:
One second discharging structure be made of this second conductive layer of this tellite, and this second discharging structure has a tri-point;
One the 3rd interlayer hole is in order to connect the secondary signal line in this second discharging structure and those holding wires; And
One second conducting structure is made of this second conductive layer of this tellite, and wherein this second conducting structure is connected to this earth connection and has one the 4th tip;
Wherein, this tri-point of this second discharging structure is adjacent to the 4th tip of this second conducting structure.
4. electrostatic discharge protection structure as claimed in claim 1 is characterized in that, this tellite is a multilayer printed board.
5. electrostatic discharge protection structure as claimed in claim 1 is characterized in that this first conductive layer is positioned at the upper side of this tellite, and this second conductive layer is positioned at the downside of this tellite.
6. electrostatic discharge protection structure as claimed in claim 1 is characterized in that, this flexible flat cable is a flexible printed wiring board.
7. electrostatic discharge protection structure as claimed in claim 1 is characterized in that, this flexible flat cable is a hot pressing conducting film.
8. electrostatic discharge protection structure as claimed in claim 1 is characterized in that, this flexible flat cable is a flexible flat cable.
9. electrostatic discharge protection structure as claimed in claim 1 is characterized in that, the material of this first conductive layer and one second conductive layer is a Copper Foil.
10. electrostatic protection structure as claimed in claim 1 is characterized in that, the shape of this first discharging structure and this first conducting structure is all triangle.
11. electrostatic discharge protection structure as claimed in claim 1 is characterized in that, those holding wires are golden finger.
12. an electronic installation comprises:
One printed circuit-board assembly, comprise a tellite, this tellite has one first conductive layer and one second conductive layer, this first conductive layer adheres to different retes separately with this second conductive layer, this tellite has many signal line, and wherein those holding wires are made of one first conductive layer of this tellite;
One flexible flat cable is connected to those holding wires on this tellite; And
One electrostatic discharge protection structure comprises:
One first discharging structure is made of this second conductive layer of this tellite, and this first discharging structure has one first tip;
One first interlayer hole is in order to connect one first holding wire in this first discharging structure and those holding wires; And
One first conducting structure is made of this second conductive layer of this tellite, and wherein this first conducting structure is connected to an earth connection and has one second tip;
Wherein, this first conductive layer adheres to different retes separately with this second conductive layer, and this first tip of this first discharging structure is adjacent to this second tip of this first conducting structure.
13. electronic installation as claimed in claim 12 is characterized in that, this electrostatic discharge protection structure more comprises one second interlayer hole, in order to connect this first discharging structure and this first holding wire.
14. electronic installation as claimed in claim 12 is characterized in that, this electrostatic discharge protection structure more comprises:
One second discharging structure is made of this second conductive layer of this tellite, and this second discharging structure has a tri-point;
One the 3rd interlayer hole is in order to connect the secondary signal line in this second discharging structure and those holding wires; And
One second conducting structure is made of this second conductive layer of this tellite, and wherein this second conducting structure is connected to this earth connection and has one the 4th tip;
Wherein, this tri-point of this second discharging structure is adjacent to the 4th tip of this second conducting structure.
15. electronic installation as claimed in claim 12 is characterized in that, this tellite is a multilayer printed board.
16. electronic installation as claimed in claim 12 is characterized in that, this first conductive layer is positioned at the upper side of this tellite, and this second conductive layer is positioned at the downside of this tellite.
17. electronic installation as claimed in claim 12 is characterized in that, this flexible flat cable is a flexible printed wiring board.
18. electronic installation as claimed in claim 12 is characterized in that, this flexible flat cable is a hot pressing conducting film.
19. electronic installation as claimed in claim 12 is characterized in that, this flexible flat cable is a flexible flat cable.
20. electronic installation as claimed in claim 12 is characterized in that, the material of this first conductive layer and one second conductive layer is a Copper Foil.
21. electronic installation as claimed in claim 12 is characterized in that, this first discharging structure be shaped as triangle.
22. electronic installation as claimed in claim 12 is characterized in that, this first conducting structure be shaped as triangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101710435A CN101998754A (en) | 2009-08-26 | 2009-08-26 | Electrostatic discharge protective structure and electronic device using same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101710435A CN101998754A (en) | 2009-08-26 | 2009-08-26 | Electrostatic discharge protective structure and electronic device using same |
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| CN101998754A true CN101998754A (en) | 2011-03-30 |
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| CN2009101710435A Pending CN101998754A (en) | 2009-08-26 | 2009-08-26 | Electrostatic discharge protective structure and electronic device using same |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103140016A (en) * | 2011-11-23 | 2013-06-05 | 深圳麦逊电子有限公司 | Printed circuit bard (PCB) for preventing electrostatic discharge |
| CN103813604A (en) * | 2012-11-12 | 2014-05-21 | 纬创资通股份有限公司 | Electronic device and conductive plate thereof |
| CN106016639A (en) * | 2016-06-30 | 2016-10-12 | 珠海格力电器股份有限公司 | Antistatic structure, controller and air conditioner |
| CN106413234A (en) * | 2015-08-10 | 2017-02-15 | 纬创资通股份有限公司 | Electrostatic discharge protection structure and electronic device |
| CN107728351A (en) * | 2017-10-30 | 2018-02-23 | 武汉华星光电技术有限公司 | A kind of integrated circuit and liquid crystal panel |
| CN107833883A (en) * | 2017-10-18 | 2018-03-23 | 深圳市华星光电半导体显示技术有限公司 | A kind of electrostatic discharge protection circuit structure, display panel and display device |
| CN108024490A (en) * | 2016-10-28 | 2018-05-11 | 研华股份有限公司 | The circuit layout structure and miniaturized electronic device of electrostatic discharge protective |
| CN108513523A (en) * | 2018-03-30 | 2018-09-07 | 信利半导体有限公司 | A kind of antistatic disabling device for display device |
| CN109195295A (en) * | 2018-08-27 | 2019-01-11 | 出门问问信息科技有限公司 | Electronic equipment |
| WO2019015316A1 (en) * | 2017-07-19 | 2019-01-24 | 京东方科技集团股份有限公司 | Backlight strip, backlight module, and display device |
| CN109585422A (en) * | 2017-09-29 | 2019-04-05 | 昆山国显光电有限公司 | Array substrate and its manufacturing method |
| CN113015319A (en) * | 2021-03-04 | 2021-06-22 | 重庆惠科金渝光电科技有限公司 | Anti-static structure and connecting structure |
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2009
- 2009-08-26 CN CN2009101710435A patent/CN101998754A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103140016A (en) * | 2011-11-23 | 2013-06-05 | 深圳麦逊电子有限公司 | Printed circuit bard (PCB) for preventing electrostatic discharge |
| CN103813604A (en) * | 2012-11-12 | 2014-05-21 | 纬创资通股份有限公司 | Electronic device and conductive plate thereof |
| CN103813604B (en) * | 2012-11-12 | 2017-03-01 | 纬创资通股份有限公司 | Electronic device and conductive plate thereof |
| CN106413234A (en) * | 2015-08-10 | 2017-02-15 | 纬创资通股份有限公司 | Electrostatic discharge protection structure and electronic device |
| CN106016639A (en) * | 2016-06-30 | 2016-10-12 | 珠海格力电器股份有限公司 | Antistatic structure, controller and air conditioner |
| CN108024490A (en) * | 2016-10-28 | 2018-05-11 | 研华股份有限公司 | The circuit layout structure and miniaturized electronic device of electrostatic discharge protective |
| US10674600B2 (en) | 2017-07-19 | 2020-06-02 | Boe Technology Group Co., Ltd. | Backlight bar, backlight module and display device |
| WO2019015316A1 (en) * | 2017-07-19 | 2019-01-24 | 京东方科技集团股份有限公司 | Backlight strip, backlight module, and display device |
| CN109585422A (en) * | 2017-09-29 | 2019-04-05 | 昆山国显光电有限公司 | Array substrate and its manufacturing method |
| CN109585422B (en) * | 2017-09-29 | 2021-06-11 | 昆山国显光电有限公司 | Array substrate and manufacturing method thereof |
| US11462491B2 (en) | 2017-09-29 | 2022-10-04 | Kunshan Go-Visionox Opto-Electronics Co., Ltd. | Array substrate and manufacturing method thereof |
| CN107833883A (en) * | 2017-10-18 | 2018-03-23 | 深圳市华星光电半导体显示技术有限公司 | A kind of electrostatic discharge protection circuit structure, display panel and display device |
| CN107728351A (en) * | 2017-10-30 | 2018-02-23 | 武汉华星光电技术有限公司 | A kind of integrated circuit and liquid crystal panel |
| CN107728351B (en) * | 2017-10-30 | 2020-07-31 | 武汉华星光电技术有限公司 | Integrated circuit and liquid crystal panel |
| CN108513523A (en) * | 2018-03-30 | 2018-09-07 | 信利半导体有限公司 | A kind of antistatic disabling device for display device |
| CN109195295A (en) * | 2018-08-27 | 2019-01-11 | 出门问问信息科技有限公司 | Electronic equipment |
| CN113015319A (en) * | 2021-03-04 | 2021-06-22 | 重庆惠科金渝光电科技有限公司 | Anti-static structure and connecting structure |
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Application publication date: 20110330 |