CN103140016A - Printed circuit bard (PCB) for preventing electrostatic discharge - Google Patents
Printed circuit bard (PCB) for preventing electrostatic discharge Download PDFInfo
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- CN103140016A CN103140016A CN201110376367XA CN201110376367A CN103140016A CN 103140016 A CN103140016 A CN 103140016A CN 201110376367X A CN201110376367X A CN 201110376367XA CN 201110376367 A CN201110376367 A CN 201110376367A CN 103140016 A CN103140016 A CN 103140016A
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- copper sheet
- discharging
- wedge angle
- pin
- substrate
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- Tests Of Electronic Circuits (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The invention discloses a printed circuit board (PCB) for preventing electrostatic discharge. The PCB comprises a substrate and circuit patterns, wherein the substrate is made of insulating materials. The PCB is characterized in that at least one discharging pin for connecting external electric signals is arranged on the substrate, at least one tip is arranged on the discharging pin, copper skin is overlaid on the periphery of the discharging pin on the substrate and provided with sharp tips with the same quantity of sharp tips on the discharging pin, the sharp tips on the copper skin correspond to the sharp tips on the discharging pin, discharging spaces are arranged between tip ends of the corresponding sharp tips on the copper skin and the discharging pins, and the copper skin is electrically connected with the ground. The PCB has the advantages that during testing, damage and punch-through on electrical elements in a scanning card caused by an external electro spark detector (ESD) can be avoided, well protection on the inner circuit can be achieved, and interference on channel signals (namely a testing point channel) caused by the ESD of the PCB can be reduced.
Description
[technical field]
The present invention relates to the PCB circuit board, particularly a kind of PCB circuit board that static discharges that prevents that is applied to the scanning card inside of pcb board in detecting.
[background technology]
At PCB Optical Line Board OL test machine, the ICT test machine, ATE testing equipment and semiconductor testing apparatus and other association areas, the test of core/measurement assembly all can be used various forms of scanning card (or being called switch card), scanning card is carried out the switching of (comprising all kinds of power supplys, signal source, instrument etc.) of the various signals of telecommunication according to cpu instruction, thereby these signals are applied on DUT (device under test), complete the measurement of the various signals of telecommunication.The below is introduced as an example of typical PCB optical link test machine example:
PCB Optical Line Board OL test machine is by scanning card, and the voltage and current that program is set is applied between any two points of PCB tabula rasa to be measured, by measuring the resistance between these 2, judges whether to exist open circuit, the defective of short circuit or electric leakage.Scanning card makes test point be connected with outside DUT by the special connector on card, and whole link circuit comprises:
Scanning card switch passage → connector (test point) → spring dials → tester probe → pcb board
The corresponding test point of each switch passage on scanning card (usually comprising two or more mechanical switchs or semiconducter simulation switch).And each test point is connected with PCB to be measured.Tend on PCB to be measured by front operation (hot air drying, transmission rub, laminate) a large amount of electrostatic charge of absorption, through in actual field to different clients, the PCB that produces under varying environment measures with the special-purpose electrostatic tester, finds the upper static value of PCB four or five hectovolts at least, at most up to volts up to ten thousand.And when in autumn and winter, under the inclined to one side drying regime of environment more very.At this moment, PCB static can pass through each probe, conducts to test point, and then is applied on the relevant IC pin of corresponding ON-OFF control circuit, and by VDD-to-VSS release electrostatic energy.Due to static rate of release very fast (nanosecond), voltage very high (several kilovolts), immediate current large (several amperes to tens amperes) causes very large threat to the circuit that is connected with test point on scanning card.Might produce directly and Latent destruction semiconductor device (being often cmos circuit), cause the scanning card reliability to reduce, failure rate increases.The client often complains in the use of electronic scanning card and damages, and impact is normally used.
Although at present at semicon industry, the device that is exclusively used in the ESD protection is arranged.But because the test point quantity on scanning card is huge, is array-like and distributes.And the specified test voltage that should bear 300V during the normal operation of each test point, if thereby each test point increase a special-purpose TVS device, can cause whole scanning card size to become large, cost and increase severely.Thereby unrealistic also unacceptable.
[summary of the invention]
The objective of the invention is to overcome above-mentioned deficiency, a kind of PCB circuit board that prevents that static from discharging is provided, this PCB circuit board can be released into the earth with the static of detection part, and the parts of PCB circuit board inside are played a very good protection.
The objective of the invention is to realize like this: it comprises substrate; Described substrate is that insulating material is made; The circuitous pattern that forms on described substrate; Its improvement is: be provided with at least one for the discharge pin that is connected with external electric signal on described substrate, be provided with at least one wedge angle on described discharge pin, the periphery of discharge pin is equipped with copper sheet on described substrate, described copper sheet has the wedge angle that equates with the wedge angle quantity of discharge pin, each wedge angle on described copper sheet is corresponding one by one with discharge each wedge angle on pin, be provided with discharging distance, described copper sheet and the earth electric connection between the tip of copper sheet and discharge corresponding wedge angle on pin;
In said structure, described discharge pin comprises discharging tray and the pin that is connected with discharging tray, and described discharging tray is attached on substrate, and the part of discharging tray surrounding stretches out and forms at least one wedge angle;
In said structure, described copper sheet comprises annular copper sheet and at least one wedge angle copper sheet integrated with it, described wedge angle copper sheet is arranged at the inside of annular copper sheet, and the wedge angle tip of the tip of wedge angle copper sheet and discharging tray is oppositely arranged, and annular copper sheet and the earth are electrically connected;
In said structure, the discharging distance on described copper sheet and discharging tray between corresponding wedge angle is 0.1524mm-0.254mm;
In said structure, be coated with solder mask on described copper sheet, wedge angle copper sheet position is set to solder mask and windows;
In said structure, the copper sheet of each discharging tray periphery is the integral type structure;
In said structure, each pin that discharges is array distribution on substrate;
In said structure, described discharging tray is square or rhombus;
In said structure, the wedge angle on described discharging tray is acute angle.
beneficial effect of the present invention is: the discharge pin of the present invention by being provided for being connected with external electric signal on the PCB circuit board, periphery in the discharge pin arranges copper sheet, copper sheet arranges relative wedge angle with discharge between pin, copper sheet and the earth are electrically connected, when utilizing scanning card to outside testing equipment, each discharge pin is corresponding to a test point, use test point test corresponding to probe, when the static on external equipment (ESD) is passed to described discharge pin by test point, owing to being provided with the point discharge spacing between discharging tray and copper sheet, electrostatic charge just is passed to the earth by point discharge via copper sheet, and can not flow to the internal circuit of scanning card, avoided destruction and the punch-through of ESD to the scanning card electric elements inside, its internal circuit is played a very good protection, reduced the interference of the outside ESD of scanning card PCB circuit board to channel signal (being the test point passage), secondly, the earth that the copper sheet that ESD discharges connects is independently, with components and parts power end on the PCB circuit board be electrically disjunct, when effectively cutting off ESD and carrying out tip release, produce power discharges and crosstalks by the earth, again, measuring accuracy, reliability, its use of having improved scanning card be safer, guaranteed the useful life of scanning card inner member and scanning card, saves cost.
[description of drawings]
Fig. 1 is the structural representation that in the present invention, single discharge pin and copper sheet form
Fig. 2 is the enlarged diagram at A place in Fig. 1
Fig. 3 is structural representation Fig. 1 that the present invention prevents the PCB circuit board that static discharges
Fig. 4 is structural representation Fig. 2 that the present invention prevents the PCB circuit board that static discharges
In figure: 1, substrate 2, discharge pin 21, pin 22, discharging tray 3, copper sheet 31, annular copper sheet 32, wedge angle copper sheet
[embodiment]
The invention will be further described below in conjunction with accompanying drawing and concrete execution mode:
referring to figs. 1 through shown in Figure 4, the present invention has disclosed a kind of PCB circuit board that prevents that static from discharging, and it comprises substrate 1, described substrate 1 is made for insulating material, the circuitous pattern that forms on described substrate 1, be provided with at least one for the discharge pin two that is connected with external electric signal on described substrate 1, its discharge pin two quantity is according to how many settings of concrete test point, each pin two that discharges is array distribution on substrate, be provided with at least one wedge angle on each discharge pin two, in the present embodiment, on each discharge pin two, four wedge angles are set, the periphery of discharge pin two is equipped with copper sheet 3 on described substrate 1, described copper sheet 3 has the wedge angle that equates with the wedge angle quantity of discharge pin two, each wedge angle on described copper sheet 3 is corresponding one by one with discharge each wedge angle on pin two, so that the wedge angle on realization discharge pin two and the point discharge between the wedge angle on copper sheet 3, be provided with discharging distance L between the tip of copper sheet 3 and discharge corresponding wedge angle on pin two, Consideration is wanted in the setting of this discharging distance L: the size of a. normal working voltage, b. with the size of signalling channel peripheral environment static, therefore, this discharging distance L is greater than safe spacing (ceiling voltage of signal loading and ground end discharge minimum spacing), and the spacing of the electrostatic charge that discharges less than needs, better, the discharging distance L on copper sheet 3 and discharge pin two between corresponding wedge angle is set to 0.1524mm-0.254mm, described copper sheet 3 is electrically connected with the earth, and when specifically using, copper sheet 3 can be set to part and expose, and the copper sheet that exposes is connected with the shell of PCB circuit board place equipment, by shell, it is accessed the earth.
Or with reference to shown in Figure 1, the discharge pin two comprises discharging tray 22 and the pin 21 that is connected with discharging tray 22, described discharging tray 22 is attached on substrate 1, the part of discharging tray 22 surroundings stretches out and forms at least one wedge angle, in this fact Example, its wedge angle is set to four, discharging tray 22 can be square or rhombus, can be set to also that other are irregularly shaped, and making its each wedge angle is that acute angle is good; Described copper sheet 3 comprises annular copper sheet 31 and (equates with wedge angle number in discharging tray 22 with its integrated at least one wedge angle copper sheet 32, in embodiment, namely also be made as four), described wedge angle copper sheet 32 is arranged at the inside of annular copper sheet 31, the wedge angle tip of the tip of wedge angle copper sheet 32 and discharging tray 22 is oppositely arranged, and annular copper sheet 31 is electrically connected with the earth.Further, be coated with solder mask on described copper sheet 3, wedge angle copper sheet 32 positions are set to solder mask and window, and namely wedge angle copper sheet 32 is revealed in solder mask; With reference to shown in Figure 4, the copper sheet 3 of each discharging tray 22 peripheries can be designed to integral structure, but namely lays the large copper sheet of a covered substrate 1 on substrate 1, then window and form each wedge angle copper sheet 32 and get final product in the position corresponding with the discharge pin two on this copper sheet.
the discharge pin two of the present invention by being provided for being connected with external electric signal on the PCB circuit board, periphery in the discharge pin two arranges copper sheet 3, copper sheet 3 arranges relative wedge angle with discharge between pin two, copper sheet 3 is electrically connected with the earth, when utilizing scanning card to outside testing equipment, each discharge pin two is corresponding to a test point, use probe to the test point test of correspondence, when the static on external equipment (ESD) is passed to described discharge pin two by test point, owing to being provided with point discharge spacing L between discharging tray 2 and copper sheet 3, electrostatic charge just is passed to the earth by point discharge via copper sheet 3, and can not flow to the internal circuit of scanning card, avoided destruction and the punch-through of ESD to the scanning card electric elements inside, its internal circuit is played a very good protection, reduced the interference of the outside ESD of surface sweeping card PCB circuit board to channel signal (being the test point passage), secondly, the earth that the copper sheet 3 that ESD discharges connects is independently, with components and parts power end on the PCB circuit board be electrically disjunct, when effectively cutting off ESD and carrying out tip release, produce power discharges and crosstalks by the earth, again, measuring accuracy, reliability, its use of having improved scanning card be safer, guaranteed the useful life of scanning card inner member and scanning card, saves cost.
The announcement of book and instruction according to the above description, those skilled in the art in the invention can also carry out suitable change and modification to above-mentioned execution mode.Therefore, the embodiment that discloses and describe above the present invention is not limited to also should fall in the protection range of claim of the present invention modifications and changes more of the present invention.In addition, although used some specific terms in this specification, these terms do not consist of any restriction to the present invention just for convenience of description.
Claims (9)
1. PCB circuit board that prevents that static from discharging, it comprises
Substrate; Described substrate is that insulating material is made;
The circuitous pattern that forms on described substrate;
It is characterized in that: be provided with at least one for the discharge pin that is connected with external electric signal on described substrate, be provided with at least one wedge angle on described discharge pin, the periphery of discharge pin is equipped with copper sheet on described substrate, described copper sheet has the wedge angle that equates with the wedge angle quantity of discharge pin, each wedge angle on described copper sheet is corresponding one by one with discharge each wedge angle on pin, be provided with discharging distance, described copper sheet and the earth electric connection between the tip of copper sheet and discharge corresponding wedge angle on pin.
2. the PCB circuit board that prevents that static from discharging according to claim 1, it is characterized in that: described discharge pin comprises discharging tray and the pin that is connected with discharging tray, described discharging tray is attached on substrate, and the part of discharging tray surrounding stretches out and forms at least one wedge angle.
3. the PCB circuit board that prevents that static from discharging according to claim 1, it is characterized in that: described copper sheet comprises annular copper sheet and at least one wedge angle copper sheet integrated with it, described wedge angle copper sheet is arranged at the inside of annular copper sheet, the wedge angle tip of the tip of wedge angle copper sheet and discharging tray is oppositely arranged, and annular copper sheet and the earth are electrically connected.
4. according to claim 1 and 2 or 3 described PCB circuit boards that prevent that static from discharging is characterized in that: the discharging distance on described copper sheet and discharging tray between corresponding wedge angle is 0.1524mm-0.254mm.
5. according to claim 2 or 3 described PCB circuit boards that prevent that static from discharging is characterized in that: be coated with solder mask on described copper sheet, wedge angle copper sheet position is set to solder mask and windows.
6. the PCB circuit board that prevents that static from discharging according to claim 1 is characterized in that: the copper sheet of each discharging tray periphery is the integral type structure.
7. the PCB circuit board that prevents that static from discharging according to claim 2, it is characterized in that: each pin that discharges is array distribution on substrate.
8. the PCB circuit board that prevents that static from discharging according to claim 4, it is characterized in that: described discharging tray is square or rhombus.
9. the PCB circuit board that prevents that static from discharging according to claim 4, it is characterized in that: the wedge angle on described discharging tray is acute angle.
Priority Applications (1)
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CN201110376367XA CN103140016A (en) | 2011-11-23 | 2011-11-23 | Printed circuit bard (PCB) for preventing electrostatic discharge |
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CN201110376367XA CN103140016A (en) | 2011-11-23 | 2011-11-23 | Printed circuit bard (PCB) for preventing electrostatic discharge |
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CN103140016A true CN103140016A (en) | 2013-06-05 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104754847A (en) * | 2013-12-26 | 2015-07-01 | Tdk株式会社 | Esd protection component |
CN107731791A (en) * | 2017-11-20 | 2018-02-23 | 深圳市华星光电技术有限公司 | A kind of structure for improving cross-line area damage by static electricity and repairing yield |
TWI684007B (en) * | 2016-05-18 | 2020-02-01 | 佳思科技有限公司 | Static dissipation structure of semiconductor test fixture |
US10849212B2 (en) | 2018-05-15 | 2020-11-24 | Panasonic Avionics Corporation | Devices and systems for controlling electrostatic discharge on electronic devices |
WO2023225790A1 (en) * | 2022-05-23 | 2023-11-30 | 京东方科技集团股份有限公司 | Flexible circuit board and display module |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10252584A1 (en) * | 2002-11-12 | 2004-06-09 | Siemens Ag | Electrical and/or electronic circuit with overvoltage protection provided by arc path between points of conductor ring between coupling element terminal pin and conductor path structure |
CN101998754A (en) * | 2009-08-26 | 2011-03-30 | 金宝电子工业股份有限公司 | Electrostatic discharge protective structure and electronic device using same |
-
2011
- 2011-11-23 CN CN201110376367XA patent/CN103140016A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10252584A1 (en) * | 2002-11-12 | 2004-06-09 | Siemens Ag | Electrical and/or electronic circuit with overvoltage protection provided by arc path between points of conductor ring between coupling element terminal pin and conductor path structure |
CN101998754A (en) * | 2009-08-26 | 2011-03-30 | 金宝电子工业股份有限公司 | Electrostatic discharge protective structure and electronic device using same |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104754847A (en) * | 2013-12-26 | 2015-07-01 | Tdk株式会社 | Esd protection component |
CN104754847B (en) * | 2013-12-26 | 2017-04-12 | Tdk株式会社 | Esd protection component |
TWI684007B (en) * | 2016-05-18 | 2020-02-01 | 佳思科技有限公司 | Static dissipation structure of semiconductor test fixture |
CN107731791A (en) * | 2017-11-20 | 2018-02-23 | 深圳市华星光电技术有限公司 | A kind of structure for improving cross-line area damage by static electricity and repairing yield |
US10849212B2 (en) | 2018-05-15 | 2020-11-24 | Panasonic Avionics Corporation | Devices and systems for controlling electrostatic discharge on electronic devices |
WO2023225790A1 (en) * | 2022-05-23 | 2023-11-30 | 京东方科技集团股份有限公司 | Flexible circuit board and display module |
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Application publication date: 20130605 |