A7 _B7_ 五、發明説明（1 ) 本發明偽有關於一半導體製造裝置，待別是有關於一 可以減少晶圓損壞的晶圓座。 因為半導體工業之部份精確度的要求，製造半導體裝 置的過程是要在極度清潔的環境，即被稱為一清潔室中進 行，其中每一個可能的污染源均已被清除。同時，因為裝 置結合性增加，在形成於該晶圓上的圖案之間的間距也變 得更窄，到逹次微米之大小。不論如何小•任何在形成這 種精細圖案之製程中被加入的污染粒子都將會對整個製造 過程造成極度負面之影響。因此，目前的半導體裝置製造 方法大多數是自動化的•以便儘可能地減少在該清潔室中 産生污染物。 在製造該等半導體之製程中* 一晶圓座被用來防止晶 圓被所産生之污染物所破壞，該晶圓座是被用於安裝與傳 送該等晶圓。第1圖是習知技藝中之一晶圓座的平面圖。 請參閲第1圖，兩槽14偽對稱地形成在該晶圓座之本 體10的外周緣上，這些槽14對應於該晶圓座與其他設備結 合的位置。八個銷12形成在該晶圓座之内周緣上•向内凸 出而與該被固持的晶圓直接接觸。八個銷12的每一個大小 都相同並且等距地琛繞在該晶圓座四週•因而形成在45° 角度上。在第1圖中之標號A係對應於該晶圓之平坦區域 0 具有此種結構之習知晶圓座使用八個銷12來支持該晶 圓，因此，在與這八個銷12直接接觸的區域上，該晶圓受 到集中之力量，如果一薄膜形成在該晶圓上•該薄膜可能 -4 - 本紙張尺度適用中國國家揉準（CNS ) A4規格（210X297公釐） όν>ϋ3^ 8 經濟部中央標準局貝工消費合作社印製 A7 B7__五、發明説明（2 ) 會在與這八値銷12接觸的區域上被刮傷。由刮傷該薄膜所 産生之細小粒子會成為下一製程中的污染物，並且一附著 有這種污染物的半導體裝置無法正常地操作。因此，使用 習知之晶圓座降低了被製造出來之半導體裝置的産率。 因此，為了解決在習知技藝中所産生出來的上述間題 •本發明之一目的為提供一種晶圖座，其偽可以增加一半 導體裝置之産率。 . 為達上述目的*在此提供一種晶圓座，其具有一類似 於一晶圓之周緣的内周緣，以及一延伸出多數腿的外周緣 ，其中在該内與外周緣之間的寬度傜足以支持該晶圓的整 値周緣。 在本發明中•一圖案並未形成在被該晶圓座所支持之 晶圓的周緣部份上，同時，四値腿偽形成在該晶圓座的外 周緣上。 因為本發明包括對該晶圓之整痼邊緣部份施加一均勻 支持力的裝置，所以不必擔心會産生污染粒子*因此•該 等半導體裝置之産率可以大大地增加。 本發明之之上述目的與優點可藉由詳細説明一較佳實 施例並且配合附圖而更加清楚，其中： 第1圖是^習知技藝之晶圓座的平面圖；並且 第2圖是一本發明一實施例之晶圓座的平面圖；並且 第3圖是一本發明之晶圓座的立體圖。 請參閲第2圖•一晶圓座40具有多數腿，如四條腿· 其係由該晶圓座40之外周緣延伸出來並且相互以一預定之 (請先閱讀#面之注意事項再填寫本頁) -裝- -訂 線 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） A7 B7 經濟部中央標準局負工消費合作社印製 五、發明説明（3 ) 間隔角度被固定。此時’該晶圓座之内周緣係類似於一晶 圓之周緣，同時’在該晶圓座之内與外周緣之間的寬度足 以支持該晶圓的整個周緣。即’該晶圓之周緣被放在本發 明之晶圓座40之内與外周緣之間。此時’該晶圓座40之一 平坦區域44配合該晶圓的一平坦區域。 該晶圓座40之外周緣形狀並沒有限制’因此*雖然本 發明提出在第2圖中之形狀，其他形狀（如’四邊形）也 可以使用。同時，除了該平坦區域之外，該晶圓座形成 一固定的圓周緣。 該晶圓座40支持該晶圓的整値周緣，因此’可以避免 在該晶圓之某些待定點上的集中應力。所以，一均勻力被 施加在該晶圓上，使得該晶圓座對於在該晶圓上一薄膜的 破壞得以避免。 該等腿42之立體形狀可以在第3圖中看到•在此處’ 該晶圓座40具有四條腿42，各具有一向下彎曲的部份。 如上所述，本發明之晶圓座對該晶圓之—大表面施加 一均勻支持力，因此，可以避免對形成在該晶圓上的薄膜 造成破壞，藉此增加該半導體裝置之産率。 元件標號對照 10____本體 40____晶圓座 12____銷 42----腿 14____槽 44____平坦區域 (請先閱讀、背面之注意事項再填寫本育) 裝· 訂 線 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）A7 _B7_ V. Description of the invention (1) The present invention is about a semiconductor manufacturing device, but it is about a wafer holder that can reduce wafer damage. Because of the accuracy requirements of the semiconductor industry, the process of manufacturing semiconductor devices is carried out in an extremely clean environment, known as a clean room, where every possible source of contamination has been removed. At the same time, as the device bonding increases, the spacing between the patterns formed on the wafer also becomes narrower, down to the submicron size. No matter how small, any contamination particles added in the process of forming such fine patterns will have extremely negative effects on the entire manufacturing process. Therefore, most current semiconductor device manufacturing methods are automated in order to minimize the generation of contaminants in the clean room. In the manufacturing process of these semiconductors * a wafer holder is used to prevent the wafer from being damaged by the generated contaminants, and the wafer holder is used to mount and transfer the wafers. Figure 1 is a plan view of one wafer holder in the conventional art. Referring to FIG. 1, two grooves 14 are formed on the outer periphery of the body 10 of the wafer base symmetrically, and these grooves 14 correspond to the positions where the wafer base is combined with other equipment. Eight pins 12 are formed on the inner periphery of the wafer holder • protruding inward to directly contact the held wafer. Each of the eight pins 12 is the same size and is equidistantly wrapped around the wafer holder • thus formed at an angle of 45 °. The reference symbol A in FIG. 1 corresponds to the flat area of the wafer. The conventional wafer base with this structure uses eight pins 12 to support the wafer. Therefore, in the area directly in contact with the eight pins 12 On the wafer, the wafer is subject to concentrated force, if a thin film is formed on the wafer • The thin film may be -4-This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) όν > ϋ3 ^ 8 Economy A7 B7__ printed by the Beigong Consumer Cooperative of the Central Standards Bureau of the Ministry of Education. 5. The description of the invention (2) will be scratched on the area in contact with the eight sales pins 12. The fine particles generated by scratching the film become contaminants in the next process, and a semiconductor device attached with such contaminants cannot operate normally. Therefore, the use of conventional wafer holders reduces the yield of manufactured semiconductor devices. Therefore, in order to solve the above-mentioned problems arising in the conventional art, one object of the present invention is to provide a crystal figure holder, which can increase the yield of the conductor device by half. To achieve the above purpose *, a wafer holder is provided here, which has an inner peripheral edge similar to the peripheral edge of a wafer, and an outer peripheral edge extending out of a plurality of legs, wherein the width between the inner and outer peripheral edges is large It is sufficient to support the entire circumference of the wafer. In the present invention, a pattern is not formed on the peripheral portion of the wafer supported by the wafer holder, and at the same time, four legs are pseudo-formed on the outer peripheral edge of the wafer holder. Since the present invention includes a device that applies a uniform supporting force to the rimmed portion of the wafer, there is no need to worry about the generation of contaminating particles * so the yield of such semiconductor devices can be greatly increased. The above objects and advantages of the present invention can be made clearer by describing a preferred embodiment in detail and accompanying drawings, in which: FIG. 1 is a plan view of a wafer holder of conventional technology; and FIG. 2 is a copy A plan view of a wafer holder according to an embodiment of the invention; and FIG. 3 is a perspective view of a wafer holder of the present invention. Please refer to Figure 2. A wafer holder 40 has a plurality of legs, such as four legs. It extends from the outer periphery of the wafer holder 40 and is mutually predetermined (please read the notes on # 面 before filling in This page) -Installation- -The paper size of the binding book is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) A7 B7 Printed by the Central Bureau of Standards of the Ministry of Economic Affairs of the Negative Labor Consumer Cooperative 5. Invention description (3) The spacing angle is fixed . At this time, the inner periphery of the wafer holder is similar to the periphery of a wafer, and the width between the inner and outer periphery of the wafer holder is sufficient to support the entire periphery of the wafer. That is, the periphery of the wafer is placed between the inside and the periphery of the wafer holder 40 of the present invention. At this time, a flat area 44 of the wafer holder 40 fits a flat area of the wafer. The outer peripheral shape of the wafer holder 40 is not limited. Therefore, although the present invention proposes the shape shown in FIG. 2, other shapes (such as a quadrilateral) can also be used. At the same time, in addition to the flat area, the wafer holder forms a fixed circumferential edge. The wafer holder 40 supports the entire perimeter of the wafer, so 'concentrated stress on certain undetermined points of the wafer can be avoided. Therefore, a uniform force is applied to the wafer, so that the wafer holder avoids damage to a thin film on the wafer. The three-dimensional shape of the legs 42 can be seen in FIG. 3 • Here, the wafer holder 40 has four legs 42 each having a downwardly curved portion. As described above, the wafer holder of the present invention applies a uniform supporting force to the large surface of the wafer, so that it is possible to avoid damage to the thin film formed on the wafer, thereby increasing the yield of the semiconductor device. Component label comparison 10____body 40____wafer holder 12____pin 42 ---- leg 14____slot 44____flat area (please read first, note on the back before filling in this education) National Standard (CNS) A4 specification (210X297mm)