TW299535B - - Google Patents

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Publication number
TW299535B
TW299535B TW084105544A TW84105544A TW299535B TW 299535 B TW299535 B TW 299535B TW 084105544 A TW084105544 A TW 084105544A TW 84105544 A TW84105544 A TW 84105544A TW 299535 B TW299535 B TW 299535B
Authority
TW
Taiwan
Prior art keywords
light
lens
receiving device
curvature
signal
Prior art date
Application number
TW084105544A
Other languages
English (en)
Chinese (zh)
Original Assignee
Sony Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Co Ltd filed Critical Sony Co Ltd
Application granted granted Critical
Publication of TW299535B publication Critical patent/TW299535B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/413—Optical elements or arrangements directly associated or integrated with the devices, e.g. back reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Light Receiving Elements (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Optical Communication System (AREA)
  • Geophysics And Detection Of Objects (AREA)
TW084105544A 1994-06-14 1995-06-01 TW299535B (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15667394A JP3601076B2 (ja) 1994-06-14 1994-06-14 受光装置

Publications (1)

Publication Number Publication Date
TW299535B true TW299535B (2) 1997-03-01

Family

ID=15632816

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084105544A TW299535B (2) 1994-06-14 1995-06-01

Country Status (5)

Country Link
US (1) US5623143A (2)
JP (1) JP3601076B2 (2)
KR (1) KR100381677B1 (2)
CN (1) CN1082253C (2)
TW (1) TW299535B (2)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09297054A (ja) * 1996-05-07 1997-11-18 Matsushita Electric Ind Co Ltd 光検出器
JP2000082829A (ja) * 1998-09-04 2000-03-21 Dowa Mining Co Ltd 受光方法及び受光装置並びに受発光装置
US7034999B1 (en) * 1998-09-29 2006-04-25 Casler Christopher L Hemispheric lens for a remote-controlled retail electronic entertainment device
US6679608B2 (en) * 1999-01-25 2004-01-20 Gentex Corporation Sensor device having an integral anamorphic lens
CN100550430C (zh) * 2002-09-09 2009-10-14 皇家飞利浦电子股份有限公司 半导体器件及其制造方法
PL1594167T3 (pl) * 2004-05-03 2007-06-29 Vishay Semiconductor Gmbh Odbiornik optoelektroniczny
JP5148810B2 (ja) * 2004-06-14 2013-02-20 ローム株式会社 受光モジュール及びそれを備えた電気機器
JP4796287B2 (ja) * 2004-08-06 2011-10-19 パナソニック株式会社 固体撮像装置
JP5100013B2 (ja) * 2006-01-26 2012-12-19 新日本無線株式会社 半導体光センサ
JP2007258297A (ja) * 2006-03-22 2007-10-04 Kaitokui Denshi Kogyo Kofun Yugenkoshi 太陽電池のパッケージ構造
JP2009139190A (ja) * 2007-12-05 2009-06-25 Nippon Ceramic Co Ltd 樹脂成型光学レンズ
TW201008268A (en) * 2008-08-15 2010-02-16 Wistron Corp Signal receiving device
JP5578834B2 (ja) * 2009-11-13 2014-08-27 トヨタホーム株式会社 建物
CN105321496A (zh) * 2014-07-30 2016-02-10 冠捷投资有限公司 环境光侦测装置与使用其的显示装置
KR101573490B1 (ko) * 2014-10-02 2015-12-11 레이트론(주) 광 도파로를 이용한 광신호 송수신 장치
DE102023111846A1 (de) 2023-05-05 2024-11-07 Carl Zeiss Ag Optisches System für eine Kamera und Kamera mit einem optischen System

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4024397A (en) * 1970-09-28 1977-05-17 Barnes Engineering Company Shock resistant encapsulated infrared detector
JPS6188213A (ja) * 1984-10-05 1986-05-06 Canon Inc 結像光学系
US4864137A (en) * 1985-12-11 1989-09-05 Hughes Aircraft Company Optical sensing system
JPH0716017B2 (ja) * 1989-06-28 1995-02-22 シャープ株式会社 光半導体装置
JP2636048B2 (ja) * 1989-08-08 1997-07-30 シャープ株式会社 光半導体装置

Also Published As

Publication number Publication date
JPH07335917A (ja) 1995-12-22
JP3601076B2 (ja) 2004-12-15
CN1082253C (zh) 2002-04-03
US5623143A (en) 1997-04-22
KR100381677B1 (ko) 2003-07-18
CN1126375A (zh) 1996-07-10

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