TW299454B - - Google Patents

Info

Publication number

TW299454B

TW299454B TW85103833A TW85103833A TW299454B TW 299454 B TW299454 B TW 299454B TW 85103833 A TW85103833 A TW 85103833A TW 85103833 A TW85103833 A TW 85103833A TW 299454 B TW299454 B TW 299454B

Authority

TW

Taiwan

Prior art keywords

substrate

thickness

processing

polishing

support substrate

Prior art date

1995-03-29

Links

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• Global Dossier
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• 239000000758 substrate Substances 0.000 claims description 94
• 235000012431 wafers Nutrition 0.000 claims description 41
• 238000000034 method Methods 0.000 claims description 36
• 239000004065 semiconductor Substances 0.000 claims description 34
• 238000005498 polishing Methods 0.000 claims description 30
• 238000000227 grinding Methods 0.000 claims description 17
• 230000002093 peripheral effect Effects 0.000 claims description 17
• 238000004519 manufacturing process Methods 0.000 claims description 12
• 238000003672 processing method Methods 0.000 claims description 8
• 239000012212 insulator Substances 0.000 claims description 4
• 230000002079 cooperative effect Effects 0.000 claims description 3
• 230000000694 effects Effects 0.000 claims description 3
• 238000007517 polishing process Methods 0.000 claims description 3
• 238000003475 lamination Methods 0.000 claims 2
• PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
• 230000003796 beauty Effects 0.000 claims 1
• 239000004744 fabric Substances 0.000 description 6
• 238000010586 diagram Methods 0.000 description 3
• 238000005530 etching Methods 0.000 description 3
• 238000005516 engineering process Methods 0.000 description 2
• 230000015572 biosynthetic process Effects 0.000 description 1
• 238000010276 construction Methods 0.000 description 1
• 230000000875 corresponding effect Effects 0.000 description 1
• 239000013078 crystal Substances 0.000 description 1
• 238000007689 inspection Methods 0.000 description 1
• 238000009434 installation Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 238000005406 washing Methods 0.000 description 1
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1