TW289147B - - Google Patents

Info

Publication number
TW289147B
TW289147B TW084100388A TW84100388A TW289147B TW 289147 B TW289147 B TW 289147B TW 084100388 A TW084100388 A TW 084100388A TW 84100388 A TW84100388 A TW 84100388A TW 289147 B TW289147 B TW 289147B
Authority
TW
Taiwan
Application number
TW084100388A
Original Assignee
Shinetsu Chem Ind Co
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chem Ind Co, Tokyo Electron Co Ltd filed Critical Shinetsu Chem Ind Co
Application granted granted Critical
Publication of TW289147B publication Critical patent/TW289147B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
  • Ceramic Products (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Jigs For Machine Tools (AREA)
TW084100388A 1993-12-27 1995-01-17 TW289147B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33096293 1993-12-27
JP31641094A JPH07297268A (ja) 1993-12-27 1994-12-20 静電チャック付セラミックスヒーター

Publications (1)

Publication Number Publication Date
TW289147B true TW289147B (zh) 1996-10-21

Family

ID=26568647

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084100388A TW289147B (zh) 1993-12-27 1995-01-17

Country Status (4)

Country Link
US (1) US5566043A (zh)
JP (1) JPH07297268A (zh)
KR (1) KR950021342A (zh)
TW (1) TW289147B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5982986A (en) 1995-02-03 1999-11-09 Applied Materials, Inc. Apparatus and method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber
JPH08227933A (ja) * 1995-02-20 1996-09-03 Shin Etsu Chem Co Ltd 静電吸着機能を有するウエハ加熱装置
JPH09172055A (ja) * 1995-12-19 1997-06-30 Fujitsu Ltd 静電チャック及びウエハの吸着方法
JPH09213781A (ja) * 1996-02-01 1997-08-15 Tokyo Electron Ltd 載置台構造及びそれを用いた処理装置
JPH11260534A (ja) 1998-01-09 1999-09-24 Ngk Insulators Ltd 加熱装置およびその製造方法
JPH11343571A (ja) * 1998-05-29 1999-12-14 Ngk Insulators Ltd サセプター
US6410172B1 (en) * 1999-11-23 2002-06-25 Advanced Ceramics Corporation Articles coated with aluminum nitride by chemical vapor deposition
US6887316B2 (en) 2000-04-14 2005-05-03 Ibiden Co., Ltd. Ceramic heater
US6623563B2 (en) * 2001-01-02 2003-09-23 Applied Materials, Inc. Susceptor with bi-metal effect
US6554907B2 (en) 2001-01-02 2003-04-29 Applied Materials, Inc. Susceptor with internal support
US6986865B2 (en) * 2002-07-10 2006-01-17 Watlow Electric Manufacturing Company Method for manufacturing an electrostatic chuck
JP4278046B2 (ja) * 2003-11-10 2009-06-10 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 ヒータ機構付き静電チャック
KR100794960B1 (ko) * 2006-06-07 2008-01-16 (주)나노테크 하이브리드형 히터 제조방법
US7901509B2 (en) * 2006-09-19 2011-03-08 Momentive Performance Materials Inc. Heating apparatus with enhanced thermal uniformity and method for making thereof
JP2008085283A (ja) 2006-09-26 2008-04-10 Momentive Performance Materials Inc 熱均一性が強化された加熱装置及びその製造方法
WO2010090948A1 (en) * 2009-02-04 2010-08-12 Mattson Technology, Inc. Electrostatic chuck system and process for radially tuning the temperature profile across the surface of a substrate
JP5416570B2 (ja) * 2009-12-15 2014-02-12 住友電気工業株式会社 加熱冷却デバイスおよびそれを搭載した装置
US9644269B2 (en) 2014-01-30 2017-05-09 Varian Semiconductor Equipment Associates, Inc Diffusion resistant electrostatic clamp

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2680338B2 (ja) * 1988-03-31 1997-11-19 株式会社東芝 静電チャック装置
JPH0750736B2 (ja) * 1990-12-25 1995-05-31 日本碍子株式会社 ウエハー加熱装置及びその製造方法
US5280156A (en) * 1990-12-25 1994-01-18 Ngk Insulators, Ltd. Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means
US5155652A (en) * 1991-05-02 1992-10-13 International Business Machines Corporation Temperature cycling ceramic electrostatic chuck
JP3081279B2 (ja) * 1991-06-03 2000-08-28 電気化学工業株式会社 ホットプレート
JPH04371579A (ja) * 1991-06-19 1992-12-24 Ulvac Japan Ltd 静電吸着装置
JPH0513555A (ja) * 1991-07-01 1993-01-22 Toto Ltd 静電チヤツク及び静電チヤツクに対する電圧印加方法

Also Published As

Publication number Publication date
KR950021342A (ko) 1995-07-26
JPH07297268A (ja) 1995-11-10
US5566043A (en) 1996-10-15

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