TW288251B - - Google Patents

Info

Publication number
TW288251B
TW288251B TW083100389A TW83100389A TW288251B TW 288251 B TW288251 B TW 288251B TW 083100389 A TW083100389 A TW 083100389A TW 83100389 A TW83100389 A TW 83100389A TW 288251 B TW288251 B TW 288251B
Authority
TW
Taiwan
Application number
TW083100389A
Original Assignee
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP05092511A external-priority patent/JP3077009B2/ja
Application filed by Tokyo Electron Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW288251B publication Critical patent/TW288251B/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/321Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
TW083100389A 1993-01-12 1994-01-18 TW288251B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1919393 1993-01-12
JP1921793 1993-01-12
JP05092511A JP3077009B2 (ja) 1993-03-27 1993-03-27 プラズマ処理装置

Publications (1)

Publication Number Publication Date
TW288251B true TW288251B (zh) 1996-10-11

Family

ID=27282531

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083100389A TW288251B (zh) 1993-01-12 1994-01-18

Country Status (3)

Country Link
US (5) US5795429A (zh)
KR (1) KR100238627B1 (zh)
TW (1) TW288251B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417931B (zh) * 2005-10-28 2013-12-01 Edwards Ltd 電漿清除設備
TWI581673B (zh) * 2011-09-13 2017-05-01
TWI618455B (zh) * 2010-12-17 2018-03-11 瑪森科技公司 用於電漿處理之感應耦合電漿源
TWI655882B (zh) * 2016-12-30 2019-04-01 中微半導體設備(上海)有限公司 Inductively coupled plasma processing device
TWI742208B (zh) * 2016-12-15 2021-10-11 台灣積體電路製造股份有限公司 離子植入機以及將離子植入半導體基板中的方法

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6165311A (en) * 1991-06-27 2000-12-26 Applied Materials, Inc. Inductively coupled RF plasma reactor having an overhead solenoidal antenna
JP3365067B2 (ja) * 1994-02-10 2003-01-08 ソニー株式会社 プラズマ装置およびこれを用いたプラズマ処理方法
US5874704A (en) * 1995-06-30 1999-02-23 Lam Research Corporation Low inductance large area coil for an inductively coupled plasma source
US5653811A (en) * 1995-07-19 1997-08-05 Chan; Chung System for the plasma treatment of large area substrates
US5759280A (en) * 1996-06-10 1998-06-02 Lam Research Corporation Inductively coupled source for deriving substantially uniform plasma flux
US6000360A (en) * 1996-07-03 1999-12-14 Tokyo Electron Limited Plasma processing apparatus
TW349234B (en) * 1996-07-15 1999-01-01 Applied Materials Inc RF plasma reactor with hybrid conductor and multi-radius dome ceiling
KR100505176B1 (ko) * 1996-09-27 2005-10-10 서페이스 테크놀로지 시스템스 피엘씨 플라즈마가공장치
US6534922B2 (en) 1996-09-27 2003-03-18 Surface Technology Systems, Plc Plasma processing apparatus
US5800621A (en) * 1997-02-10 1998-09-01 Applied Materials, Inc. Plasma source for HDP-CVD chamber
TW376547B (en) * 1997-03-27 1999-12-11 Matsushita Electric Ind Co Ltd Method and apparatus for plasma processing
US6210539B1 (en) 1997-05-14 2001-04-03 Applied Materials, Inc. Method and apparatus for producing a uniform density plasma above a substrate
US6361661B2 (en) 1997-05-16 2002-03-26 Applies Materials, Inc. Hybrid coil design for ionized deposition
US6652717B1 (en) 1997-05-16 2003-11-25 Applied Materials, Inc. Use of variable impedance to control coil sputter distribution
US6077402A (en) * 1997-05-16 2000-06-20 Applied Materials, Inc. Central coil design for ionized metal plasma deposition
US6579426B1 (en) 1997-05-16 2003-06-17 Applied Materials, Inc. Use of variable impedance to control coil sputter distribution
US6345588B1 (en) 1997-08-07 2002-02-12 Applied Materials, Inc. Use of variable RF generator to control coil voltage distribution
US6216632B1 (en) * 1998-01-29 2001-04-17 Anelva Corporation Plasma processing system
US5944942A (en) * 1998-03-04 1999-08-31 Ogle; John Seldon Varying multipole plasma source
US6254738B1 (en) * 1998-03-31 2001-07-03 Applied Materials, Inc. Use of variable impedance having rotating core to control coil sputter distribution
US6146508A (en) * 1998-04-22 2000-11-14 Applied Materials, Inc. Sputtering method and apparatus with small diameter RF coil
US6204607B1 (en) * 1998-05-28 2001-03-20 Applied Komatsu Technology, Inc. Plasma source with multiple magnetic flux sources each having a ferromagnetic core
TW434636B (en) 1998-07-13 2001-05-16 Applied Komatsu Technology Inc RF matching network with distributed outputs
US6132575A (en) * 1998-09-28 2000-10-17 Alcatel Magnetron reactor for providing a high density, inductively coupled plasma source for sputtering metal and dielectric films
US6319355B1 (en) 1999-06-30 2001-11-20 Lam Research Corporation Plasma processor with coil responsive to variable amplitude rf envelope
JP2001023959A (ja) * 1999-07-05 2001-01-26 Mitsubishi Electric Corp プラズマ処理装置
US6244210B1 (en) * 1999-10-29 2001-06-12 Advanced Micro Devices, Inc. Strength coil for ionized copper plasma deposition
KR100751740B1 (ko) * 1999-11-15 2007-08-24 램 리써치 코포레이션 공정 시스템들을 위한 재료들과 기체 화학성분들
US6518190B1 (en) * 1999-12-23 2003-02-11 Applied Materials Inc. Plasma reactor with dry clean apparatus and method
JP3567855B2 (ja) * 2000-01-20 2004-09-22 住友電気工業株式会社 半導体製造装置用ウェハ保持体
KR100635975B1 (ko) * 2000-02-14 2006-10-20 동경 엘렉트론 주식회사 플라즈마 처리 장치 및 방법과, 플라즈마 처리 장치용 링 부재
US6441555B1 (en) 2000-03-31 2002-08-27 Lam Research Corporation Plasma excitation coil
JP4677654B2 (ja) * 2000-04-19 2011-04-27 日本電気株式会社 透過型液晶表示装置及びその製造方法
TW454429B (en) * 2000-05-31 2001-09-11 Nanya Technology Corp Plasma generator
JP2002008996A (ja) * 2000-06-23 2002-01-11 Mitsubishi Heavy Ind Ltd 給電アンテナ及び給電方法
US6632322B1 (en) * 2000-06-30 2003-10-14 Lam Research Corporation Switched uniformity control
US6471830B1 (en) 2000-10-03 2002-10-29 Veeco/Cvc, Inc. Inductively-coupled-plasma ionized physical-vapor deposition apparatus, method and system
FR2815176B1 (fr) * 2000-10-11 2003-01-10 A S K Antenne spirale d'emission et/ou reception a coupures
US6716303B1 (en) * 2000-10-13 2004-04-06 Lam Research Corporation Vacuum plasma processor having a chamber with electrodes and a coil for plasma excitation and method of operating same
DE10104613A1 (de) 2001-02-02 2002-08-22 Bosch Gmbh Robert Plasmaanlage und Verfahren zur Erzeugung einer Funktionsbeschichtung
DE10104614A1 (de) * 2001-02-02 2002-08-22 Bosch Gmbh Robert Plasmaanlage und Verfahren zur Erzeugung einer Funktionsbeschichtung
JP3591642B2 (ja) * 2001-02-07 2004-11-24 株式会社日立製作所 プラズマ処理装置
JP2002237486A (ja) * 2001-02-08 2002-08-23 Tokyo Electron Ltd プラズマ処理装置およびプラズマ処理方法
TW466595B (en) * 2001-02-20 2001-12-01 Macronix Int Co Ltd Reaction chamber of high density plasma chemical vapor deposition
US6583572B2 (en) 2001-03-30 2003-06-24 Lam Research Corporation Inductive plasma processor including current sensor for plasma excitation coil
US6527912B2 (en) 2001-03-30 2003-03-04 Lam Research Corporation Stacked RF excitation coil for inductive plasma processor
US7096819B2 (en) * 2001-03-30 2006-08-29 Lam Research Corporation Inductive plasma processor having coil with plural windings and method of controlling plasma density
KR200253559Y1 (ko) * 2001-07-30 2001-11-22 주식회사 플라즈마트 회전방향으로 균일한 플라즈마 밀도를 발생시키는유도결합형 플라즈마 발생장치의 안테나구조
US7033514B2 (en) * 2001-08-27 2006-04-25 Micron Technology, Inc. Method and apparatus for micromachining using a magnetic field and plasma etching
KR100685947B1 (ko) * 2001-09-08 2007-02-23 엘지.필립스 엘시디 주식회사 액정표시소자의 제조방법
WO2003030239A1 (fr) * 2001-09-28 2003-04-10 Sumitomo Precision Products Co., Ltd. Procede de gravure de substrat de silicium et appareil de gravure
US20030082920A1 (en) * 2001-11-01 2003-05-01 Taiwan Semiconductor Manufacturing Co., Ltd. Chamber-reversed dry etching
US6597117B2 (en) * 2001-11-30 2003-07-22 Samsung Austin Semiconductor, L.P. Plasma coil
US20030168012A1 (en) * 2002-03-07 2003-09-11 Hitoshi Tamura Plasma processing device and plasma processing method
FR2839242B1 (fr) * 2002-04-25 2004-10-15 Rasar Holding N V Procede pour generer un plasma froid destine a la sterilisation de milieu gazeux et dispositif pour mettre en oeuvre ce procede
JP3820188B2 (ja) * 2002-06-19 2006-09-13 三菱重工業株式会社 プラズマ処理装置及びプラズマ処理方法
KR100486724B1 (ko) * 2002-10-15 2005-05-03 삼성전자주식회사 사행 코일 안테나를 구비한 유도결합 플라즈마 발생장치
TWI391035B (zh) * 2002-12-16 2013-03-21 Japan Science & Tech Agency Plasma generation device, plasma control method and substrate manufacturing method (1)
US6876155B2 (en) * 2002-12-31 2005-04-05 Lam Research Corporation Plasma processor apparatus and method, and antenna
KR100964398B1 (ko) * 2003-01-03 2010-06-17 삼성전자주식회사 유도결합형 안테나 및 이를 채용한 플라즈마 처리장치
US20040163595A1 (en) * 2003-02-26 2004-08-26 Manabu Edamura Plasma processing apparatus
KR100513163B1 (ko) * 2003-06-18 2005-09-08 삼성전자주식회사 Icp 안테나 및 이를 사용하는 플라즈마 발생장치
US20050205210A1 (en) * 2004-01-06 2005-09-22 Devine Daniel J Advanced multi-pressure workpiece processing
US20050205211A1 (en) * 2004-03-22 2005-09-22 Vikram Singh Plasma immersion ion implantion apparatus and method
US7400096B1 (en) 2004-07-19 2008-07-15 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Large area plasma source
US7962918B2 (en) * 2004-08-03 2011-06-14 Microsoft Corporation System and method for controlling inter-application association through contextual policy control
US7305935B1 (en) 2004-08-25 2007-12-11 The United States Of America As Represented By The Administration Of Nasa Slotted antenna waveguide plasma source
EP1860680A1 (en) * 2006-05-22 2007-11-28 New Power Plasma Co., Ltd. Inductively coupled plasma reactor
US20080078506A1 (en) * 2006-09-29 2008-04-03 Zyvex Corporation RF Coil Plasma Generation
US9137884B2 (en) * 2006-11-29 2015-09-15 Lam Research Corporation Apparatus and method for plasma processing
CN101640091B (zh) * 2008-07-28 2011-06-15 北京北方微电子基地设备工艺研究中心有限责任公司 电感耦合线圈及采用该电感耦合线圈的等离子体处理装置
KR101143742B1 (ko) 2008-10-27 2012-05-11 도쿄엘렉트론가부시키가이샤 유도 결합 플라즈마 처리 장치, 플라즈마 처리 방법 및 기억 매체
KR101037917B1 (ko) 2008-11-03 2011-05-31 주식회사 유진테크 플라즈마 처리장치 및 플라즈마 안테나
JP5479867B2 (ja) * 2009-01-14 2014-04-23 東京エレクトロン株式会社 誘導結合プラズマ処理装置
US7994724B2 (en) * 2009-03-27 2011-08-09 Ecole Polytechnique Inductive plasma applicator
WO2011041087A2 (en) * 2009-09-29 2011-04-07 Applied Materials, Inc. Inductively-coupled plasma (icp) resonant source element
JP5554047B2 (ja) * 2009-10-27 2014-07-23 東京エレクトロン株式会社 プラズマ処理装置
JP2011258622A (ja) * 2010-06-07 2011-12-22 Tokyo Electron Ltd プラズマ処理装置及びその誘電体窓構造
JP5800532B2 (ja) * 2011-03-03 2015-10-28 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP5727281B2 (ja) 2011-04-21 2015-06-03 東京エレクトロン株式会社 誘導結合プラズマ処理装置
US20130015766A1 (en) * 2011-05-12 2013-01-17 The George Washington University Apparatus for generating mini and micro plasmas and methods of use
US20120291955A1 (en) * 2011-05-17 2012-11-22 Cho Young Kyu Large area icp source for plasma application
KR101969077B1 (ko) 2011-08-18 2019-04-15 세메스 주식회사 플라즈마 안테나 및 이를 이용한 기판 처리 장치
US9034143B2 (en) 2011-10-05 2015-05-19 Intevac, Inc. Inductive/capacitive hybrid plasma source and system with such chamber
CN105340063A (zh) * 2013-05-31 2016-02-17 应用材料公司 用于等离子体处理系统的天线阵列配置
US20160049279A1 (en) * 2014-08-14 2016-02-18 Allied Techfinders Co., Ltd. Plasma device
US10300551B2 (en) * 2016-11-14 2019-05-28 Matthew Fagan Metal analyzing plasma CNC cutting machine and associated methods
US10854448B2 (en) 2017-01-31 2020-12-01 Tohoku University Plasma generating device, plasma sputtering device, and plasma sputtering method
KR102015381B1 (ko) * 2017-03-29 2019-08-29 세메스 주식회사 플라즈마 발생 유닛 및 이를 포함하는 기판 처리 장치
CN108017123A (zh) * 2017-12-20 2018-05-11 广西加加汇软件技术有限公司 多变螺旋涡旋电场系统装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2236963B1 (zh) * 1973-07-13 1977-02-18 Cit Alcatel
JPS5846057B2 (ja) * 1979-03-19 1983-10-14 富士通株式会社 プラズマ処理方法
JPS5930130B2 (ja) * 1979-09-20 1984-07-25 富士通株式会社 気相成長方法
FR2514033B1 (fr) * 1981-10-02 1985-09-27 Henaff Louis Installation pour le depot de couches minces en grande surface en phase vapeur reactive par plasma
JPS6424094A (en) * 1987-07-21 1989-01-26 Nat Inst Res Inorganic Mat Synthesizing apparatus for diamond
US5180435A (en) * 1987-09-24 1993-01-19 Research Triangle Institute, Inc. Remote plasma enhanced CVD method and apparatus for growing an epitaxial semiconductor layer
EP0379828B1 (en) * 1989-01-25 1995-09-27 International Business Machines Corporation Radio frequency induction/multipole plasma processing tool
JP2993675B2 (ja) * 1989-02-08 1999-12-20 株式会社日立製作所 プラズマ処理方法及びその装置
US5091049A (en) * 1989-06-13 1992-02-25 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US4990229A (en) * 1989-06-13 1991-02-05 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US4948458A (en) * 1989-08-14 1990-08-14 Lam Research Corporation Method and apparatus for producing magnetically-coupled planar plasma
US5556501A (en) * 1989-10-03 1996-09-17 Applied Materials, Inc. Silicon scavenger in an inductively coupled RF plasma reactor
US5304279A (en) * 1990-08-10 1994-04-19 International Business Machines Corporation Radio frequency induction/multipole plasma processing tool
JP2519364B2 (ja) * 1990-12-03 1996-07-31 アプライド マテリアルズ インコーポレイテッド Uhf/vhf共振アンテナ供給源を用いたプラズマリアクタ
US5241245A (en) * 1992-05-06 1993-08-31 International Business Machines Corporation Optimized helical resonator for plasma processing
US5277751A (en) * 1992-06-18 1994-01-11 Ogle John S Method and apparatus for producing low pressure planar plasma using a coil with its axis parallel to the surface of a coupling window
US5346578A (en) * 1992-11-04 1994-09-13 Novellus Systems, Inc. Induction plasma source
US5433812A (en) * 1993-01-19 1995-07-18 International Business Machines Corporation Apparatus for enhanced inductive coupling to plasmas with reduced sputter contamination
US5401350A (en) * 1993-03-08 1995-03-28 Lsi Logic Corporation Coil configurations for improved uniformity in inductively coupled plasma systems
JP3290777B2 (ja) * 1993-09-10 2002-06-10 株式会社東芝 誘導結合型高周波放電方法および誘導結合型高周波放電装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417931B (zh) * 2005-10-28 2013-12-01 Edwards Ltd 電漿清除設備
US9333460B2 (en) 2005-10-28 2016-05-10 Edwards Limited Plasma treatment device
TWI618455B (zh) * 2010-12-17 2018-03-11 瑪森科技公司 用於電漿處理之感應耦合電漿源
TWI581673B (zh) * 2011-09-13 2017-05-01
TWI742208B (zh) * 2016-12-15 2021-10-11 台灣積體電路製造股份有限公司 離子植入機以及將離子植入半導體基板中的方法
TWI655882B (zh) * 2016-12-30 2019-04-01 中微半導體設備(上海)有限公司 Inductively coupled plasma processing device

Also Published As

Publication number Publication date
US5938883A (en) 1999-08-17
US5795429A (en) 1998-08-18
US6136139A (en) 2000-10-24
US6350347B1 (en) 2002-02-26
KR100238627B1 (ko) 2000-01-15
US6265031B1 (en) 2001-07-24

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