TW288189B - - Google Patents

Info

Publication number
TW288189B
TW288189B TW083107971A TW83107971A TW288189B TW 288189 B TW288189 B TW 288189B TW 083107971 A TW083107971 A TW 083107971A TW 83107971 A TW83107971 A TW 83107971A TW 288189 B TW288189 B TW 288189B
Authority
TW
Taiwan
Application number
TW083107971A
Other languages
Chinese (zh)
Original Assignee
Tokyo Electron Co Ltd
Tel Kyushu Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd, Tel Kyushu Kk filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW288189B publication Critical patent/TW288189B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW083107971A 1993-08-05 1994-08-30 TW288189B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21487893 1993-08-05

Publications (1)

Publication Number Publication Date
TW288189B true TW288189B (OSRAM) 1996-10-11

Family

ID=16663069

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083107971A TW288189B (OSRAM) 1993-08-05 1994-08-30

Country Status (3)

Country Link
US (1) US5566076A (OSRAM)
KR (1) KR100241292B1 (OSRAM)
TW (1) TW288189B (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397355B (zh) * 2007-10-24 2013-05-21 Applied Materials Itlia S R L 用於對準電子電路板之對準裝置及方法，及用於處理基板之設備

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19544328B4 (de) * 1994-11-29 2014-03-20 Ebara Corp. Poliervorrichtung
US5740053A (en) * 1995-07-31 1998-04-14 Tokyo Electron Limited Method of controlling monitor used in cleaning machine and object processing machine and monitor apparatus
US5731678A (en) * 1996-07-15 1998-03-24 Semitool, Inc. Processing head for semiconductor processing machines
JPH10112493A (ja) * 1996-08-13 1998-04-28 Sony Corp 表面矯正薄板保持装置、面調整手段及び向き調整手段
US5893795A (en) * 1997-07-11 1999-04-13 Applied Materials, Inc. Apparatus for moving a cassette
US6106736A (en) * 1997-09-04 2000-08-22 International Business Machines Corporation Planarization process and apparatus for the etch definition of magnetic head air bearing surfaces
JP4696373B2 (ja) * 2001-02-20 2011-06-08 東京エレクトロン株式会社 処理システム及び被処理体の搬送方法
DE10122669A1 (de) * 2001-05-10 2002-12-12 Mattson Wet Products Gmbh Vorrichtung zum Nassreinigen von scheibenförmigen Substraten
JP5224744B2 (ja) * 2006-10-04 2013-07-03 株式会社日立国際電気 基板処理装置
KR100783072B1 (ko) * 2006-12-27 2007-12-07 세메스 주식회사 기판 처리 장치
KR101231182B1 (ko) 2007-09-12 2013-02-07 삼성전자주식회사 반도체 세정 설비의 웨이퍼 브로큰 방지용 웨이퍼 가이드
KR101708420B1 (ko) * 2010-09-15 2017-02-21 삼성디스플레이 주식회사 기판 증착 시스템 및 이를 이용한 증착 방법
NL2008007A (en) 2011-01-20 2012-07-23 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP6275155B2 (ja) * 2012-11-28 2018-02-07 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体ウェハ洗浄方法及び半導体ウェハ洗浄装置
JP7648306B2 (ja) * 2021-06-04 2025-03-18 東京エレクトロン株式会社 情報処理装置、移載位置補正方法及び基板処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5164905A (en) * 1987-08-12 1992-11-17 Hitachi, Ltd. Production system with order of processing determination
US5263504A (en) * 1990-12-28 1993-11-23 Carolina Equipment And Supply Company, Inc. Apparatus and method for cleaning with a focused fluid stream
US5220935A (en) * 1990-12-28 1993-06-22 Carolina Equipment & Supply Co., Inc. Apparatus and method for cleaning with a focused fluid stream
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397355B (zh) * 2007-10-24 2013-05-21 Applied Materials Itlia S R L 用於對準電子電路板之對準裝置及方法，及用於處理基板之設備
TWI511629B (zh) * 2007-10-24 2015-12-01 Applied Materials Itlia S R L 用於對準電子電路板之對準裝置及方法，及用於處理基板之設備

Also Published As

Publication number Publication date
US5566076A (en) 1996-10-15
KR950007012A (ko) 1995-03-21
KR100241292B1 (ko) 2000-02-01

Similar Documents

Publication Publication Date Title
FR10C0052I2 (OSRAM)
TW239844B (OSRAM)
FR04C0010I1 (OSRAM)
EP0690955A4 (OSRAM)
TW285788B (OSRAM)
FR2700330B1 (OSRAM)
TW259834B (OSRAM)
TW288189B (OSRAM)
FR2701701B1 (OSRAM)
FR2700841B1 (OSRAM)
EP0707697A4 (OSRAM)
FR2706824B1 (OSRAM)
FR2706908B1 (OSRAM)
FR2706797B1 (OSRAM)
IN185980B (OSRAM)
ECSDI930167S (OSRAM)
DK68393D0 (OSRAM)
ECSDI930105S (OSRAM)
ECSDI930110S (OSRAM)
ECSDI930112S (OSRAM)
ECSDI930139S (OSRAM)
ECSDI930115S (OSRAM)
IN179064B (OSRAM)
IN190020B (OSRAM)
CU22254A3 (OSRAM)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees