TW288178B - - Google Patents

Info

Publication number
TW288178B
TW288178B TW083111430A TW83111430A TW288178B TW 288178 B TW288178 B TW 288178B TW 083111430 A TW083111430 A TW 083111430A TW 83111430 A TW83111430 A TW 83111430A TW 288178 B TW288178 B TW 288178B
Authority
TW
Taiwan
Application number
TW083111430A
Other languages
Chinese (zh)
Original Assignee
Tokyo Electron Co Ltd
Tel Yamanishi Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd, Tel Yamanishi Kk filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW288178B publication Critical patent/TW288178B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Measuring Leads Or Probes (AREA)
TW083111430A 1993-12-10 1994-12-08 TW288178B (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05341383A JP3094052B2 (ja) 1993-12-10 1993-12-10 クリーニング装置及びこの装置を用いたプローブ装置

Publications (1)

Publication Number Publication Date
TW288178B true TW288178B (ja) 1996-10-11

Family

ID=18345640

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083111430A TW288178B (ja) 1993-12-10 1994-12-08

Country Status (3)

Country Link
JP (1) JP3094052B2 (ja)
KR (1) KR0146273B1 (ja)
TW (1) TW288178B (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI467182B (zh) * 2008-07-18 2015-01-01 Nidec Read Corp And a substrate inspection apparatus having a cleaning mechanism for the front end portion of the probe
TWI572863B (zh) * 2014-12-23 2017-03-01 Imt有限公司 包含雷射清理功能的晶圓測試機
TWI770344B (zh) * 2018-07-27 2022-07-11 日商鎧俠股份有限公司 試驗裝置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6118290A (en) * 1997-06-07 2000-09-12 Tokyo Electron Limited Prober and method for cleaning probes provided therein
KR100850692B1 (ko) * 2008-01-11 2008-08-07 뉴센트 주식회사 프로브카드의 세척 및 검사 시스템
JP5094554B2 (ja) * 2008-05-23 2012-12-12 株式会社東京精密 搬送パッドのクリーニング機構
JP5615572B2 (ja) * 2009-12-22 2014-10-29 株式会社日本マイクロニクス プローブ清掃ユニット及びそれを備えたパネル検査装置並びにプローブ清掃方法
KR101115988B1 (ko) * 2011-11-07 2012-02-13 전형민 칩 패드의 먼지제거시스템
CN111318070B (zh) * 2018-12-13 2022-10-04 夏泰鑫半导体(青岛)有限公司 过滤装置及过滤设备

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI467182B (zh) * 2008-07-18 2015-01-01 Nidec Read Corp And a substrate inspection apparatus having a cleaning mechanism for the front end portion of the probe
TWI572863B (zh) * 2014-12-23 2017-03-01 Imt有限公司 包含雷射清理功能的晶圓測試機
TWI770344B (zh) * 2018-07-27 2022-07-11 日商鎧俠股份有限公司 試驗裝置

Also Published As

Publication number Publication date
KR950021325A (ko) 1995-07-26
JP3094052B2 (ja) 2000-10-03
JPH07161784A (ja) 1995-06-23
KR0146273B1 (ko) 1998-11-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees