TW288039B - - Google Patents

Info

Publication number
TW288039B
TW288039B TW83103614A TW83103614A TW288039B TW 288039 B TW288039 B TW 288039B TW 83103614 A TW83103614 A TW 83103614A TW 83103614 A TW83103614 A TW 83103614A TW 288039 B TW288039 B TW 288039B
Authority
TW
Taiwan
Application number
TW83103614A
Other languages
Chinese (zh)
Original Assignee
Occidental Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Occidental Chem Co filed Critical Occidental Chem Co
Application granted granted Critical
Publication of TW288039B publication Critical patent/TW288039B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
    • C08J3/091—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids characterised by the chemical constitution of the organic liquid
    • C08J3/096—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D207/00—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D207/02—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D207/04—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having no double bonds between ring members or between ring members and non-ring members
    • C07D207/10—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having no double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
    • C07D207/12—Oxygen or sulfur atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/10—Block- or graft-copolymers containing polysiloxane sequences
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
TW83103614A 1993-06-21 1994-04-21 TW288039B (ref)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/078,339 US5317049A (en) 1993-06-21 1993-06-21 Polyimidesiloxane solution and method of coating substrates

Publications (1)

Publication Number Publication Date
TW288039B true TW288039B (ref) 1996-10-11

Family

ID=22143410

Family Applications (1)

Application Number Title Priority Date Filing Date
TW83103614A TW288039B (ref) 1993-06-21 1994-04-21

Country Status (6)

Country Link
US (1) US5317049A (ref)
EP (1) EP0630934A3 (ref)
JP (1) JP3491968B2 (ref)
KR (1) KR950000805A (ref)
CA (1) CA2120272A1 (ref)
TW (1) TW288039B (ref)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554684A (en) * 1993-10-12 1996-09-10 Occidental Chemical Corporation Forming polyimide coating by screen printing
US5849607A (en) * 1993-11-27 1998-12-15 Samsung Electronics Co., Ltd. Process for attaching a lead frame to a semiconductor chip
US6451955B1 (en) * 2000-09-28 2002-09-17 Sumitomo Bakelite Company Limited Method of making a polyimide in a low-boiling solvent
JP4602151B2 (ja) * 2004-04-22 2010-12-22 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びこれを用いた樹脂皮膜
US8168726B2 (en) * 2006-06-22 2012-05-01 Sabic Innovative Plastics Ip B.V. Process for making polysiloxane/polymide copolymer blends
US8491997B2 (en) * 2006-06-22 2013-07-23 Sabic Innovative Plastics Ip B.V. Conductive wire comprising a polysiloxane/polyimide copolymer blend
TWI596008B (zh) 2012-12-21 2017-08-21 道康寧公司 層狀聚合物結構及方法
TWI522421B (zh) * 2014-03-18 2016-02-21 Daxin Materials Corp Liquid crystal alignment composition

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57168943A (en) * 1981-04-13 1982-10-18 Hitachi Ltd Coating liquid for thin film formation
JPS59202259A (ja) * 1983-04-30 1984-11-16 Hitachi Chem Co Ltd 芳香族ポリエ−テルアミドイミド重合体ワニス
JPS60118741A (ja) * 1983-11-14 1985-06-26 ロジヤース・コーポレイシヨン 高温ポリイミド加工助剤
US4624978A (en) * 1983-11-14 1986-11-25 Rogers Corporation High temperature polyimide processing aid
GB2157303A (en) * 1984-03-05 1985-10-23 Rogers Corp Co-solvent accelerator and method for conversion of polyamide-acid, solution to polylmide
US4639485A (en) * 1985-07-31 1987-01-27 Rogers Corporation Co-solvent accelerator for conversion of polyamide-acid solution to polyimide
CA1299801C (en) * 1987-03-31 1992-04-28 Chung J. Lee Soluble polyimidesiloxanes and methods for their preparation and use
EP0363737A3 (en) * 1988-10-11 1990-09-26 Ethyl Corporation Compositions for production of electronic coatings
US5068131A (en) * 1988-10-11 1991-11-26 Ethyl Corporation Method for production of electronic coatings
US4996254A (en) * 1988-10-11 1991-02-26 Ethyl Corporation Production of electronic coatings by spin coating a partially fluorinated polyamic acid composition
US4956451A (en) * 1988-10-11 1990-09-11 Ethyl Corporation Compositions for production of electronic coatings
US5206337A (en) * 1990-05-10 1993-04-27 Sumitomo Bakelite Company Limited Solvent-soluble polyimidesiloxane oligomer and process for producing the same
JP2526845B2 (ja) * 1991-10-25 1996-08-21 日産化学工業株式会社 ポリイミドワニス組成物及びその使用法

Also Published As

Publication number Publication date
JPH0718181A (ja) 1995-01-20
EP0630934A3 (en) 1995-09-27
EP0630934A2 (en) 1994-12-28
US5317049A (en) 1994-05-31
CA2120272A1 (en) 1994-12-22
KR950000805A (ko) 1995-01-03
JP3491968B2 (ja) 2004-02-03

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