TW285753B - - Google Patents

Info

Publication number
TW285753B
TW285753B TW084111893A TW84111893A TW285753B TW 285753 B TW285753 B TW 285753B TW 084111893 A TW084111893 A TW 084111893A TW 84111893 A TW84111893 A TW 84111893A TW 285753 B TW285753 B TW 285753B
Authority
TW
Taiwan
Application number
TW084111893A
Other languages
Chinese (zh)
Original Assignee
Air Prod & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Prod & Chem filed Critical Air Prod & Chem
Application granted granted Critical
Publication of TW285753B publication Critical patent/TW285753B/zh

Links

Classifications

    • H10P14/20—
    • H10P14/69215—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/401—Oxides containing silicon
    • C23C16/402—Silicon dioxide
    • H10P14/6681—
    • H10P14/6334—
    • H10P14/6336—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
TW084111893A 1995-01-04 1995-11-09 TW285753B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US36857195A 1995-01-04 1995-01-04

Publications (1)

Publication Number Publication Date
TW285753B true TW285753B (OSRAM) 1996-09-11

Family

ID=23451807

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084111893A TW285753B (OSRAM) 1995-01-04 1995-11-09

Country Status (6)

Country Link
US (1) US5744196A (OSRAM)
EP (1) EP0721019A3 (OSRAM)
JP (1) JP2769307B2 (OSRAM)
KR (1) KR960030314A (OSRAM)
IL (1) IL116620A0 (OSRAM)
TW (1) TW285753B (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105568249A (zh) * 2014-11-03 2016-05-11 气体产品与化学公司 硅基薄膜和形成该薄膜的方法

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US5879775A (en) * 1996-12-12 1999-03-09 Eastman Kodak Compnay Protective inorganic and DLC coatings for plastic media such as plastic cards
EP0848083A3 (en) * 1996-12-12 2001-03-07 Eastman Kodak Company Protective inorganic and dlc coatings and method for making same at or close to room temperature
US6054379A (en) 1998-02-11 2000-04-25 Applied Materials, Inc. Method of depositing a low k dielectric with organo silane
US6303523B2 (en) 1998-02-11 2001-10-16 Applied Materials, Inc. Plasma processes for depositing low dielectric constant films
US6660656B2 (en) 1998-02-11 2003-12-09 Applied Materials Inc. Plasma processes for depositing low dielectric constant films
US6340435B1 (en) 1998-02-11 2002-01-22 Applied Materials, Inc. Integrated low K dielectrics and etch stops
US6287990B1 (en) 1998-02-11 2001-09-11 Applied Materials, Inc. CVD plasma assisted low dielectric constant films
US6593247B1 (en) 1998-02-11 2003-07-15 Applied Materials, Inc. Method of depositing low k films using an oxidizing plasma
US6413583B1 (en) 1998-02-11 2002-07-02 Applied Materials, Inc. Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound
US6627532B1 (en) 1998-02-11 2003-09-30 Applied Materials, Inc. Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition
US6667553B2 (en) 1998-05-29 2003-12-23 Dow Corning Corporation H:SiOC coated substrates
US6159871A (en) 1998-05-29 2000-12-12 Dow Corning Corporation Method for producing hydrogenated silicon oxycarbide films having low dielectric constant
US6147009A (en) 1998-06-29 2000-11-14 International Business Machines Corporation Hydrogenated oxidized silicon carbon material
US6800571B2 (en) 1998-09-29 2004-10-05 Applied Materials Inc. CVD plasma assisted low dielectric constant films
US6303047B1 (en) * 1999-03-22 2001-10-16 Lsi Logic Corporation Low dielectric constant multiple carbon-containing silicon oxide dielectric material for use in integrated circuit structures, and method of making same
DE69932409T2 (de) * 1999-05-04 2007-01-04 Applied Materials, Inc., Santa Clara Thermisches CVD Verfahren zur Erzeugung eines mit Kohlenstoff dotierten Siliziumoxidfilms mit niedriger dielektrischer Konstante
EP1050601A1 (en) * 1999-05-04 2000-11-08 Applied Materials, Inc. Thermal CVD process for depositing a low dielectric constant carbon-doped silicon oxide film
US6153261A (en) * 1999-05-28 2000-11-28 Applied Materials, Inc. Dielectric film deposition employing a bistertiarybutylaminesilane precursor
EP1077479A1 (en) 1999-08-17 2001-02-21 Applied Materials, Inc. Post-deposition treatment to enchance properties of Si-O-C low K film
ATE418158T1 (de) 1999-08-17 2009-01-15 Applied Materials Inc Oberflächenbehandlung von kohlenstoffdotierten sio2-filmen zur erhöhung der stabilität während der o2-veraschung
US6602806B1 (en) 1999-08-17 2003-08-05 Applied Materials, Inc. Thermal CVD process for depositing a low dielectric constant carbon-doped silicon oxide film
JP3668075B2 (ja) * 1999-10-12 2005-07-06 光夫 板倉 遺伝物質シーケンス決定用懸濁系、その懸濁系を用いた遺伝物質シーケンス決定方法およびその懸濁系を用いたＳＮＰｓ高速スコアリング方法
US6399489B1 (en) 1999-11-01 2002-06-04 Applied Materials, Inc. Barrier layer deposition using HDP-CVD
US6947802B2 (en) * 2000-04-10 2005-09-20 Hypertherm, Inc. Centralized control architecture for a laser materials processing system
US6632478B2 (en) 2001-02-22 2003-10-14 Applied Materials, Inc. Process for forming a low dielectric constant carbon-containing film
US6709721B2 (en) 2001-03-28 2004-03-23 Applied Materials Inc. Purge heater design and process development for the improvement of low k film properties
US6762125B1 (en) * 2001-05-14 2004-07-13 Micron Technology, Inc. Modified facet etch to prevent blown gate oxide and increase etch chamber life
US6926926B2 (en) 2001-09-10 2005-08-09 Applied Materials, Inc. Silicon carbide deposited by high density plasma chemical-vapor deposition with bias
TW200424343A (en) * 2002-09-05 2004-11-16 Asml Us Inc Low temperature deposition of silicon based thin films by single-wafer hot-wall rapid thermal chemical vapor deposition
US7531679B2 (en) * 2002-11-14 2009-05-12 Advanced Technology Materials, Inc. Composition and method for low temperature deposition of silicon-containing films such as films including silicon nitride, silicon dioxide and/or silicon-oxynitride
US7446217B2 (en) * 2002-11-14 2008-11-04 Advanced Technology Materials, Inc. Composition and method for low temperature deposition of silicon-containing films
US7601860B2 (en) 2003-10-10 2009-10-13 Advanced Technology Materials, Inc. Composition and method for low temperature chemical vapor deposition of silicon-containing films including silicon carbonitride and silicon oxycarbonitride films
US7579496B2 (en) * 2003-10-10 2009-08-25 Advanced Technology Materials, Inc. Monosilane or disilane derivatives and method for low temperature deposition of silicon-containing films using the same
US20050181633A1 (en) * 2004-02-17 2005-08-18 Hochberg Arthur K. Precursors for depositing silicon-containing films and processes thereof
US20060105581A1 (en) * 2004-11-18 2006-05-18 Bielefeld Jeffery D Glycol doping agents in carbon doped oxide films
FR2887252A1 (fr) * 2005-06-21 2006-12-22 Air Liquide Procede de formation d'un film dielectrique et nouveaux precurseurs pour la mise en oeuvre de ce procede
US7999355B2 (en) * 2008-07-11 2011-08-16 Air Products And Chemicals, Inc. Aminosilanes for shallow trench isolation films
JP2010067810A (ja) * 2008-09-11 2010-03-25 Shin-Etsu Chemical Co Ltd Ｓｉ含有膜の成膜方法、絶縁膜、並びに半導体デバイス
US8703624B2 (en) * 2009-03-13 2014-04-22 Air Products And Chemicals, Inc. Dielectric films comprising silicon and methods for making same
KR20160093093A (ko) 2011-06-03 2016-08-05 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 탄소-도핑된 규소-함유 막을 증착시키기 위한 조성물 및 방법
US9443736B2 (en) 2012-05-25 2016-09-13 Entegris, Inc. Silylene compositions and methods of use thereof
US9243324B2 (en) 2012-07-30 2016-01-26 Air Products And Chemicals, Inc. Methods of forming non-oxygen containing silicon-based films
DE102017120423A1 (de) * 2017-09-05 2019-03-07 Methode Electronics Malta Ltd. Transparentes Polymer mit glasartigen Eigenschaften

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US4900591A (en) * 1988-01-20 1990-02-13 The United States Of America As Represented By The Secretary Of The Air Force Method for the deposition of high quality silicon dioxide at low temperature
US4923716A (en) * 1988-09-26 1990-05-08 Hughes Aircraft Company Chemical vapor desposition of silicon carbide
US4981724A (en) * 1988-10-27 1991-01-01 Hochberg Arthur K Deposition of silicon oxide films using alkylsilane liquid sources
US5190890A (en) * 1990-06-04 1993-03-02 Advanced Technology Materials, Inc. Wafer base for silicon carbide semiconductor devices, incorporating alloy substrates, and method of making the same
US5204141A (en) * 1991-09-18 1993-04-20 Air Products And Chemicals, Inc. Deposition of silicon dioxide films at temperatures as low as 100 degree c. by lpcvd using organodisilane sources
DE4313130C1 (de) * 1993-04-22 1994-05-26 Goldschmidt Ag Th Verfahren zur Herstellung von Silanen bzw. Organosiliciumhydriden durch Reduktion der entsprechenden Siliciumhalogenide bzw. Organosiliciumhalogenide
US5492736A (en) * 1994-11-28 1996-02-20 Air Products And Chemicals, Inc. Fluorine doped silicon oxide process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105568249A (zh) * 2014-11-03 2016-05-11 气体产品与化学公司 硅基薄膜和形成该薄膜的方法

Also Published As

Publication number Publication date
IL116620A0 (en) 1996-03-31
EP0721019A2 (en) 1996-07-10
KR960030314A (ko) 1996-08-17
JP2769307B2 (ja) 1998-06-25
JPH08274088A (ja) 1996-10-18
EP0721019A3 (en) 1997-07-02
US5744196A (en) 1998-04-28

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