TW284904B - Etch back improving method by using concave-convex etching contour - Google Patents
Etch back improving method by using concave-convex etching contourInfo
- Publication number
- TW284904B TW284904B TW85100964A TW85100964A TW284904B TW 284904 B TW284904 B TW 284904B TW 85100964 A TW85100964 A TW 85100964A TW 85100964 A TW85100964 A TW 85100964A TW 284904 B TW284904 B TW 284904B
- Authority
- TW
- Taiwan
- Prior art keywords
- etching
- concave
- etch back
- improving method
- wafer
- Prior art date
Links
Landscapes
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Abstract
An etch back improving method by using concave-convex etching contour, include: A pre-etching process, which slightly etching back on oxide layer of wafer, to form concave in central of wafer; An etching proces on oxide layer; Calibrate the uniformity of standard etching step by the pre-etching step to keep the etching amount of wafer in certain range.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW85100964A TW284904B (en) | 1996-01-26 | 1996-01-26 | Etch back improving method by using concave-convex etching contour |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW85100964A TW284904B (en) | 1996-01-26 | 1996-01-26 | Etch back improving method by using concave-convex etching contour |
Publications (1)
Publication Number | Publication Date |
---|---|
TW284904B true TW284904B (en) | 1996-09-01 |
Family
ID=51397884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW85100964A TW284904B (en) | 1996-01-26 | 1996-01-26 | Etch back improving method by using concave-convex etching contour |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW284904B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI679697B (en) * | 2014-10-17 | 2019-12-11 | 日商東京威力科創股份有限公司 | Substrate processing apparatus, linked processing system and substrate processing method |
-
1996
- 1996-01-26 TW TW85100964A patent/TW284904B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI679697B (en) * | 2014-10-17 | 2019-12-11 | 日商東京威力科創股份有限公司 | Substrate processing apparatus, linked processing system and substrate processing method |
US11784057B2 (en) | 2014-10-17 | 2023-10-10 | Tokyo Electron Limited | Substrate processing apparatus, linked processing system, and substrate processing method |
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Legal Events
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MK4A | Expiration of patent term of an invention patent |