TW284904B - Etch back improving method by using concave-convex etching contour - Google Patents

Etch back improving method by using concave-convex etching contour

Info

Publication number
TW284904B
TW284904B TW85100964A TW85100964A TW284904B TW 284904 B TW284904 B TW 284904B TW 85100964 A TW85100964 A TW 85100964A TW 85100964 A TW85100964 A TW 85100964A TW 284904 B TW284904 B TW 284904B
Authority
TW
Taiwan
Prior art keywords
etching
concave
etch back
improving method
wafer
Prior art date
Application number
TW85100964A
Other languages
Chinese (zh)
Inventor
Yuan-Chang Hwang
Jenn-Hwa Yu
Original Assignee
Taiwan Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg filed Critical Taiwan Semiconductor Mfg
Priority to TW85100964A priority Critical patent/TW284904B/en
Application granted granted Critical
Publication of TW284904B publication Critical patent/TW284904B/en

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  • Drying Of Semiconductors (AREA)
  • Weting (AREA)

Abstract

An etch back improving method by using concave-convex etching contour, include: A pre-etching process, which slightly etching back on oxide layer of wafer, to form concave in central of wafer; An etching proces on oxide layer; Calibrate the uniformity of standard etching step by the pre-etching step to keep the etching amount of wafer in certain range.
TW85100964A 1996-01-26 1996-01-26 Etch back improving method by using concave-convex etching contour TW284904B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW85100964A TW284904B (en) 1996-01-26 1996-01-26 Etch back improving method by using concave-convex etching contour

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW85100964A TW284904B (en) 1996-01-26 1996-01-26 Etch back improving method by using concave-convex etching contour

Publications (1)

Publication Number Publication Date
TW284904B true TW284904B (en) 1996-09-01

Family

ID=51397884

Family Applications (1)

Application Number Title Priority Date Filing Date
TW85100964A TW284904B (en) 1996-01-26 1996-01-26 Etch back improving method by using concave-convex etching contour

Country Status (1)

Country Link
TW (1) TW284904B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI679697B (en) * 2014-10-17 2019-12-11 日商東京威力科創股份有限公司 Substrate processing apparatus, linked processing system and substrate processing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI679697B (en) * 2014-10-17 2019-12-11 日商東京威力科創股份有限公司 Substrate processing apparatus, linked processing system and substrate processing method
US11784057B2 (en) 2014-10-17 2023-10-10 Tokyo Electron Limited Substrate processing apparatus, linked processing system, and substrate processing method

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