TW283262B - - Google Patents
Info
- Publication number
- TW283262B TW283262B TW084101933A TW84101933A TW283262B TW 283262 B TW283262 B TW 283262B TW 084101933 A TW084101933 A TW 084101933A TW 84101933 A TW84101933 A TW 84101933A TW 283262 B TW283262 B TW 283262B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32055—Deposition of semiconductive layers, e.g. poly - or amorphous silicon layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
- H10D30/0227—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0147—Manufacturing their gate sidewall spacers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6011240A JPH07221291A (ja) | 1994-02-02 | 1994-02-02 | 半導体装置及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW283262B true TW283262B (enrdf_load_stackoverflow) | 1996-08-11 |
Family
ID=11772420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084101933A TW283262B (enrdf_load_stackoverflow) | 1994-02-02 | 1995-02-28 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH07221291A (enrdf_load_stackoverflow) |
KR (1) | KR950034841A (enrdf_load_stackoverflow) |
TW (1) | TW283262B (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3854290B2 (ja) | 2004-06-17 | 2006-12-06 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP5280056B2 (ja) * | 2008-01-10 | 2013-09-04 | シャープ株式会社 | Mos電界効果トランジスタ |
JP5582030B2 (ja) * | 2010-12-28 | 2014-09-03 | 富士通セミコンダクター株式会社 | Mosトランジスタおよびその製造方法 |
JP6318786B2 (ja) | 2014-04-04 | 2018-05-09 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
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1994
- 1994-02-02 JP JP6011240A patent/JPH07221291A/ja active Pending
-
1995
- 1995-01-28 KR KR1019950001980A patent/KR950034841A/ko not_active Withdrawn
- 1995-02-28 TW TW084101933A patent/TW283262B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR950034841A (ko) | 1995-12-28 |
JPH07221291A (ja) | 1995-08-18 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |