TW283262B - - Google Patents

Info

Publication number
TW283262B
TW283262B TW084101933A TW84101933A TW283262B TW 283262 B TW283262 B TW 283262B TW 084101933 A TW084101933 A TW 084101933A TW 84101933 A TW84101933 A TW 84101933A TW 283262 B TW283262 B TW 283262B
Authority
TW
Taiwan
Application number
TW084101933A
Other languages
Chinese (zh)
Original Assignee
Seikosya Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosya Kk filed Critical Seikosya Kk
Application granted granted Critical
Publication of TW283262B publication Critical patent/TW283262B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/32055Deposition of semiconductive layers, e.g. poly - or amorphous silicon layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0223Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
    • H10D30/0227Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0147Manufacturing their gate sidewall spacers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
TW084101933A 1994-02-02 1995-02-28 TW283262B (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6011240A JPH07221291A (ja) 1994-02-02 1994-02-02 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
TW283262B true TW283262B (enrdf_load_stackoverflow) 1996-08-11

Family

ID=11772420

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084101933A TW283262B (enrdf_load_stackoverflow) 1994-02-02 1995-02-28

Country Status (3)

Country Link
JP (1) JPH07221291A (enrdf_load_stackoverflow)
KR (1) KR950034841A (enrdf_load_stackoverflow)
TW (1) TW283262B (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3854290B2 (ja) 2004-06-17 2006-12-06 株式会社東芝 半導体装置およびその製造方法
JP5280056B2 (ja) * 2008-01-10 2013-09-04 シャープ株式会社 Mos電界効果トランジスタ
JP5582030B2 (ja) * 2010-12-28 2014-09-03 富士通セミコンダクター株式会社 Mosトランジスタおよびその製造方法
JP6318786B2 (ja) 2014-04-04 2018-05-09 セイコーエプソン株式会社 半導体装置及びその製造方法

Also Published As

Publication number Publication date
KR950034841A (ko) 1995-12-28
JPH07221291A (ja) 1995-08-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees