TW282565B - - Google Patents
Download PDFInfo
- Publication number
- TW282565B TW282565B TW84105353A TW84105353A TW282565B TW 282565 B TW282565 B TW 282565B TW 84105353 A TW84105353 A TW 84105353A TW 84105353 A TW84105353 A TW 84105353A TW 282565 B TW282565 B TW 282565B
- Authority
- TW
- Taiwan
- Prior art keywords
- gas
- discharge
- liquid
- substrate
- surface treatment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Liquid Crystal (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17311594 | 1994-07-04 | ||
JP9747095A JP3508789B2 (ja) | 1994-07-04 | 1995-03-31 | 基板の表面処理方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW282565B true TW282565B (ja) | 1996-08-01 |
Family
ID=26438635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW84105353A TW282565B (ja) | 1994-07-04 | 1995-05-26 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3508789B2 (ja) |
TW (1) | TW282565B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220013367A1 (en) * | 2017-07-26 | 2022-01-13 | Toshiba Memory Corporation | Plasma treatment apparatus, semiconductor manufacturing apparatus, and manufacturing method of semiconductor device |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7455892B2 (en) | 2000-10-04 | 2008-11-25 | Dow Corning Ireland Limited | Method and apparatus for forming a coating |
JP4077704B2 (ja) * | 2001-09-27 | 2008-04-23 | 積水化学工業株式会社 | プラズマ処理装置 |
TW200308187A (en) * | 2002-04-10 | 2003-12-16 | Dow Corning Ireland Ltd | An atmospheric pressure plasma assembly |
TW200409669A (en) | 2002-04-10 | 2004-06-16 | Dow Corning Ireland Ltd | Protective coating composition |
JP4556422B2 (ja) * | 2003-12-02 | 2010-10-06 | パナソニック株式会社 | 電子部品およびその製造方法 |
JP4611003B2 (ja) * | 2004-11-25 | 2011-01-12 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
GB0509648D0 (en) | 2005-05-12 | 2005-06-15 | Dow Corning Ireland Ltd | Plasma system to deposit adhesion primer layers |
JP4736702B2 (ja) * | 2005-10-14 | 2011-07-27 | セイコーエプソン株式会社 | 液晶装置の製造装置、液晶装置の製造方法、液晶装置、及び電子機器 |
CN109212799B (zh) * | 2018-10-26 | 2021-10-29 | Tcl华星光电技术有限公司 | 液晶面板的外围电路结构以及液晶显示母板 |
JP7193357B2 (ja) * | 2019-01-21 | 2022-12-20 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
-
1995
- 1995-03-31 JP JP9747095A patent/JP3508789B2/ja not_active Expired - Fee Related
- 1995-05-26 TW TW84105353A patent/TW282565B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220013367A1 (en) * | 2017-07-26 | 2022-01-13 | Toshiba Memory Corporation | Plasma treatment apparatus, semiconductor manufacturing apparatus, and manufacturing method of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP3508789B2 (ja) | 2004-03-22 |
JPH0878529A (ja) | 1996-03-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100514598B1 (ko) | 포토레지스트막 제거방법 및 제거장치 | |
TW282565B (ja) | ||
JP3598602B2 (ja) | プラズマエッチング方法、液晶表示パネルの製造方法、及びプラズマエッチング装置 | |
US5081068A (en) | Method of treating surface of substrate with ice particles and hydrogen peroxide | |
KR100453415B1 (ko) | 세정액및세정방법 | |
WO2000030164A1 (fr) | Procede d'elimination d'un film de photoresine | |
JP2003103361A (ja) | 表面改質装置および表面改質方法 | |
JP2007201070A (ja) | 基板上の残留有機物の除去方法とその装置 | |
CN111107949A (zh) | 表面处理方法和装置 | |
JP2003027210A (ja) | 表面処理方法及び表示装置の製造方法 | |
JPH04146616A (ja) | 有機物被膜の除去方法 | |
JP3540180B2 (ja) | 半導体装置の製造方法及び製造装置 | |
JP2003332288A (ja) | 水供給方法および水供給装置 | |
JP2002368389A (ja) | プリント配線板の処理方法及びプリント配線板の処理装置 | |
KR100453015B1 (ko) | 표면처리방법및그장치,기판의표면처리방법및기판의제조방법 | |
JP2001308070A (ja) | ドライエッチング装置およびそれを用いた半導体基板の処理方法 | |
JP2005216908A (ja) | 対象物処理装置および対象物処理方法 | |
JP2004002992A (ja) | 表面処理方法及びその装置 | |
JP2004004695A (ja) | 液晶パネルの配向膜形成方法 | |
TW383420B (en) | Manufacturing method and manufacturing apparatus for semiconductor device | |
JP2005013854A (ja) | 剥離洗浄方法および剥離洗浄装置 | |
JP3544326B2 (ja) | 基板処理方法 | |
JP2001035835A (ja) | プラズマ処理方法及びプラズマ処理装置 | |
JPH08134666A (ja) | ドライエッチング方法 | |
JP2004356487A (ja) | 有機物層の除去方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |