TW282565B - - Google Patents

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Publication number
TW282565B
TW282565B TW84105353A TW84105353A TW282565B TW 282565 B TW282565 B TW 282565B TW 84105353 A TW84105353 A TW 84105353A TW 84105353 A TW84105353 A TW 84105353A TW 282565 B TW282565 B TW 282565B
Authority
TW
Taiwan
Prior art keywords
gas
discharge
liquid
substrate
surface treatment
Prior art date
Application number
TW84105353A
Other languages
English (en)
Chinese (zh)
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of TW282565B publication Critical patent/TW282565B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Liquid Crystal (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Plasma Technology (AREA)
TW84105353A 1994-07-04 1995-05-26 TW282565B (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP17311594 1994-07-04
JP9747095A JP3508789B2 (ja) 1994-07-04 1995-03-31 基板の表面処理方法

Publications (1)

Publication Number Publication Date
TW282565B true TW282565B (ja) 1996-08-01

Family

ID=26438635

Family Applications (1)

Application Number Title Priority Date Filing Date
TW84105353A TW282565B (ja) 1994-07-04 1995-05-26

Country Status (2)

Country Link
JP (1) JP3508789B2 (ja)
TW (1) TW282565B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220013367A1 (en) * 2017-07-26 2022-01-13 Toshiba Memory Corporation Plasma treatment apparatus, semiconductor manufacturing apparatus, and manufacturing method of semiconductor device

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7455892B2 (en) 2000-10-04 2008-11-25 Dow Corning Ireland Limited Method and apparatus for forming a coating
JP4077704B2 (ja) * 2001-09-27 2008-04-23 積水化学工業株式会社 プラズマ処理装置
TW200308187A (en) * 2002-04-10 2003-12-16 Dow Corning Ireland Ltd An atmospheric pressure plasma assembly
TW200409669A (en) 2002-04-10 2004-06-16 Dow Corning Ireland Ltd Protective coating composition
JP4556422B2 (ja) * 2003-12-02 2010-10-06 パナソニック株式会社 電子部品およびその製造方法
JP4611003B2 (ja) * 2004-11-25 2011-01-12 株式会社 日立ディスプレイズ 液晶表示装置
GB0509648D0 (en) 2005-05-12 2005-06-15 Dow Corning Ireland Ltd Plasma system to deposit adhesion primer layers
JP4736702B2 (ja) * 2005-10-14 2011-07-27 セイコーエプソン株式会社 液晶装置の製造装置、液晶装置の製造方法、液晶装置、及び電子機器
CN109212799B (zh) * 2018-10-26 2021-10-29 Tcl华星光电技术有限公司 液晶面板的外围电路结构以及液晶显示母板
JP7193357B2 (ja) * 2019-01-21 2022-12-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220013367A1 (en) * 2017-07-26 2022-01-13 Toshiba Memory Corporation Plasma treatment apparatus, semiconductor manufacturing apparatus, and manufacturing method of semiconductor device

Also Published As

Publication number Publication date
JP3508789B2 (ja) 2004-03-22
JPH0878529A (ja) 1996-03-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees