TW281854B - - Google Patents

Info

Publication number
TW281854B
TW281854B TW082104651A TW82104651A TW281854B TW 281854 B TW281854 B TW 281854B TW 082104651 A TW082104651 A TW 082104651A TW 82104651 A TW82104651 A TW 82104651A TW 281854 B TW281854 B TW 281854B
Authority
TW
Taiwan
Application number
TW082104651A
Original Assignee
Tokyo Electron Co Ltd
Tokyo Electron Tohoku Kk
Toshiba Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd, Tokyo Electron Tohoku Kk, Toshiba Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW281854B publication Critical patent/TW281854B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/10—Heating of the reaction chamber or the substrate
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/12—Heating of the reaction chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
TW082104651A 1992-06-11 1993-06-11 TW281854B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17742792A JP3164248B2 (ja) 1992-06-11 1992-06-11 熱処理装置

Publications (1)

Publication Number Publication Date
TW281854B true TW281854B (zh) 1996-07-21

Family

ID=16030749

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082104651A TW281854B (zh) 1992-06-11 1993-06-11

Country Status (4)

Country Link
US (1) US5370371A (zh)
JP (1) JP3164248B2 (zh)
KR (1) KR100298964B1 (zh)
TW (1) TW281854B (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3073627B2 (ja) * 1993-06-14 2000-08-07 東京エレクトロン株式会社 熱処理装置
US5578132A (en) * 1993-07-07 1996-11-26 Tokyo Electron Kabushiki Kaisha Apparatus for heat treating semiconductors at normal pressure and low pressure
JP3473715B2 (ja) * 1994-09-30 2003-12-08 信越半導体株式会社 石英ガラス製ウェーハボート
US5928427A (en) * 1994-12-16 1999-07-27 Hwang; Chul-Ju Apparatus for low pressure chemical vapor deposition
US6002109A (en) 1995-07-10 1999-12-14 Mattson Technology, Inc. System and method for thermal processing of a semiconductor substrate
KR100205541B1 (ko) * 1995-12-18 1999-07-01 윤종용 화학기상증착장비의 가스 유입구 구조
KR100224659B1 (ko) * 1996-05-17 1999-10-15 윤종용 종형 기상 성장 장치용 캡
US5746591A (en) * 1996-08-15 1998-05-05 Vanguard International Semiconductor Corporation Semiconductor furnace for reducing particulates in a quartz tube and boat
JP3270730B2 (ja) 1997-03-21 2002-04-02 株式会社日立国際電気 基板処理装置及び基板処理方法
JP3467565B2 (ja) * 1998-11-16 2003-11-17 坂口電熱株式会社 熱放射リフレクターを有する加熱炉
JP3579278B2 (ja) * 1999-01-26 2004-10-20 東京エレクトロン株式会社 縦型熱処理装置及びシール装置
NL1011578C2 (nl) * 1999-03-17 1999-12-10 Asm Int Drager voor een waferrek alsmede ovensamenstel.
KR100352765B1 (ko) 1999-12-01 2002-09-16 삼성전자 주식회사 반도체 제조용 가열장치
JP2002343789A (ja) * 2001-05-16 2002-11-29 Mitsubishi Electric Corp 補助保温治具、その製造方法、板状断熱材付きウエハボート、縦型熱処理装置、縦型熱処理装置の改造方法および半導体装置の製造方法
US6902395B2 (en) * 2002-03-15 2005-06-07 Asm International, N.V. Multilevel pedestal for furnace
JP3798721B2 (ja) * 2002-03-29 2006-07-19 東芝セラミックス株式会社 半導体熱処理用反射板およびこの半導体熱処理用反射板の製造方法
US20040014438A1 (en) * 2002-06-20 2004-01-22 Abraham Hasarchi System and method for excluding narrow band noise from a communication channel
JP5188326B2 (ja) * 2008-08-28 2013-04-24 株式会社日立国際電気 半導体装置の製造方法、基板処理方法、及び基板処理装置
JP5088331B2 (ja) * 2009-01-26 2012-12-05 東京エレクトロン株式会社 熱処理装置用の構成部品及び熱処理装置
JP5405667B2 (ja) * 2010-07-22 2014-02-05 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
JP2012195565A (ja) * 2011-02-28 2012-10-11 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法及び半導体装置の製造方法
US9605345B2 (en) * 2013-08-23 2017-03-28 Taiwan Semiconductor Manufacturing Co., Ltd. Vertical furnace for improving wafer uniformity
KR20220103156A (ko) * 2020-03-19 2022-07-21 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 단열재 어셈블리 및 반도체 장치의 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5846251B2 (ja) * 1980-07-29 1983-10-15 日立化成工業株式会社 発泡性ビニル系重合体粒子の製造法
DE3441887C1 (de) * 1984-11-16 1985-10-17 Heraeus Quarzschmelze Gmbh, 6450 Hanau Ofen fuer die Waermebehandlung von Halbleiter-Substraten
FR2621930B1 (fr) * 1987-10-15 1990-02-02 Solems Sa Procede et appareil pour la production par plasma de couches minces a usage electronique et/ou optoelectronique
US5048800A (en) * 1988-12-27 1991-09-17 Kabushiki Kaisha Toshiba Vertical heat treatment apparatus
US5127365A (en) * 1990-02-27 1992-07-07 Kabushiki Kaisha Toshiba Vertical heat-treatment apparatus for semiconductor parts

Also Published As

Publication number Publication date
JP3164248B2 (ja) 2001-05-08
US5370371A (en) 1994-12-06
JPH05343342A (ja) 1993-12-24
KR940006220A (ko) 1994-03-23
KR100298964B1 (ko) 2001-11-30

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