TW281795B - - Google Patents

Info

Publication number
TW281795B
TW281795B TW084104918A TW84104918A TW281795B TW 281795 B TW281795 B TW 281795B TW 084104918 A TW084104918 A TW 084104918A TW 84104918 A TW84104918 A TW 84104918A TW 281795 B TW281795 B TW 281795B
Authority
TW
Taiwan
Application number
TW084104918A
Other languages
Chinese (zh)
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Application granted granted Critical
Publication of TW281795B publication Critical patent/TW281795B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H10P72/74—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07178—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00—Seal for a joint or juncture
    • Y10S277/91—O-ring seal

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
TW084104918A 1994-11-30 1995-05-18 TW281795B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29705994 1994-11-30

Publications (1)

Publication Number Publication Date
TW281795B true TW281795B (enExample) 1996-07-21

Family

ID=17841688

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084104918A TW281795B (enExample) 1994-11-30 1995-05-18

Country Status (3)

Country Link
US (1) US6423102B1 (enExample)
KR (1) KR0184688B1 (enExample)
TW (1) TW281795B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8948322B2 (en) 2009-01-07 2015-02-03 Skyworks Solutions, Inc. Circuits, systems, and methods for managing automatic gain control in quadrature signal paths of a receiver

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6063646A (en) * 1998-10-06 2000-05-16 Japan Rec Co., Ltd. Method for production of semiconductor package
US6674173B1 (en) * 2003-01-02 2004-01-06 Aptos Corporation Stacked paired die package and method of making the same
DE10394148T5 (de) * 2003-02-24 2006-02-09 Infineon Technologies Ag Verbessertes Verfahren und verbesserte Vorrichtung zum Positionieren von integrierten Schaltungen auf Plättchenkontaktflächen
JP4014579B2 (ja) * 2004-04-01 2007-11-28 沖電気工業株式会社 ワイヤボンディング装置及びワイヤボンディング方法
US7298034B2 (en) * 2004-06-28 2007-11-20 Semiconductor Components Industries, L.L.C. Multi-chip semiconductor connector assemblies
JP4541807B2 (ja) * 2004-09-03 2010-09-08 Ｏｋｉセミコンダクタ株式会社 半導体素子保持装置および半導体素子の搬送方法
US7217995B2 (en) * 2004-11-12 2007-05-15 Macronix International Co., Ltd. Apparatus for stacking electrical components using insulated and interconnecting via
US20100151321A1 (en) * 2005-11-09 2010-06-17 Teruaki Yamamoto Negative electrode for coin-shaped lithium secondary battery, method for producing the same, and coin-shaped lithium secondary battery
US20120087774A1 (en) * 2006-01-27 2012-04-12 Camtek Ltd Diced Wafer Adaptor and a Method for Transferring a Diced Wafer
US8016183B2 (en) * 2009-11-05 2011-09-13 Freescale Semiconductor, Inc. Adjustable clamp system and method for wire bonding die assembly
US20130170936A1 (en) * 2012-01-03 2013-07-04 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Self-Aligning Pick and Place Collet for Tape and Reel Machine
US9980702B2 (en) * 2012-12-31 2018-05-29 Volcano Corporation Wirebonding fixture and casting mold
CN111070133B (zh) * 2020-01-08 2021-05-18 华为技术有限公司 压合夹具
CN114770410B (zh) * 2022-05-24 2023-04-25 中国科学院地质与地球物理研究所 一种磁通门磁力仪亥姆霍兹线圈安装工装
CN115157140B (zh) * 2022-07-05 2023-12-05 业成科技（成都）有限公司 贴合治具

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
US2730370A (en) * 1954-08-13 1956-01-10 George F Brewster Work holding chuck
US4357006A (en) * 1980-11-28 1982-11-02 International Business Machines Corporation Distortion free 3 point vacuum fixture
JPS58110048A (ja) 1981-12-24 1983-06-30 Toshiba Corp 樹脂封止用金型
JPS58142537A (ja) 1982-02-19 1983-08-24 Nec Corp 半導体素子取出し装置
US4470856A (en) * 1983-02-07 1984-09-11 Hughes Aircraft Company Self-compensating hydrostatic flattening of semiconductor substrates
US4795518A (en) 1984-02-17 1989-01-03 Burr-Brown Corporation Method using a multiple device vacuum chuck for an automatic microelectronic bonding apparatus
JPS6191936A (ja) 1984-10-12 1986-05-10 Toshiba Ceramics Co Ltd バツクサイドダメ−ジ加工治具
JPS62219531A (ja) 1986-03-19 1987-09-26 Mitsubishi Electric Corp 半導体集積回路装置
US4763188A (en) 1986-08-08 1988-08-09 Thomas Johnson Packaging system for multiple semiconductor devices
IT1214254B (it) 1987-09-23 1990-01-10 Sgs Microelettonica S P A Dispositivo a semiconduttore in contenitore plastico o ceramico con "chips" fissati su entrambi i lati dell'isola centrale del "frame".
JPH01218032A (ja) 1988-02-26 1989-08-31 Nec Corp ワイヤーボンディング方法
US4949783A (en) * 1988-05-18 1990-08-21 Veeco Instruments, Inc. Substrate transport and cooling apparatus and method for same
JPH02130922A (ja) * 1988-11-11 1990-05-18 Toshiba Corp 半導体基板エッチング装置
US5200362A (en) 1989-09-06 1993-04-06 Motorola, Inc. Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
US5147815A (en) 1990-05-14 1992-09-15 Motorola, Inc. Method for fabricating a multichip semiconductor device having two interdigitated leadframes
JPH0426244A (ja) 1990-05-22 1992-01-29 Mitsubishi Electric Corp 電子媒体情報に対する検印方式
US5173766A (en) 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
JPH05121462A (ja) 1991-10-24 1993-05-18 Mitsui High Tec Inc 半導体装置の製造方法
JP2734269B2 (ja) * 1991-12-26 1998-03-30 日本電気株式会社 半導体製造装置
US5366933A (en) 1993-10-13 1994-11-22 Intel Corporation Method for constructing a dual sided, wire bonded integrated circuit chip package
US5527740A (en) 1994-06-28 1996-06-18 Intel Corporation Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
JP2666788B2 (ja) * 1995-10-19 1997-10-22 日本電気株式会社 チップサイズ半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8948322B2 (en) 2009-01-07 2015-02-03 Skyworks Solutions, Inc. Circuits, systems, and methods for managing automatic gain control in quadrature signal paths of a receiver
US9313079B2 (en) 2009-01-07 2016-04-12 Skyworks Solutions, Inc. Circuits, systems, and methods for managing automatic gain control in quadrature signal paths of a receiver

Also Published As

Publication number Publication date
KR0184688B1 (ko) 1999-04-15
US6423102B1 (en) 2002-07-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees