TW280006B - Method of decreasing antenna charge effect caused by etching polysilicon gate - Google Patents

Method of decreasing antenna charge effect caused by etching polysilicon gate

Info

Publication number
TW280006B
TW280006B TW85100145A TW85100145A TW280006B TW 280006 B TW280006 B TW 280006B TW 85100145 A TW85100145 A TW 85100145A TW 85100145 A TW85100145 A TW 85100145A TW 280006 B TW280006 B TW 280006B
Authority
TW
Taiwan
Prior art keywords
gate
mixed gas
high density
effect
density plasma
Prior art date
Application number
TW85100145A
Other languages
English (en)
Inventor
Huang-Jong Jeng
Jong-Guey Kang
Original Assignee
Nat Science Council
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Science Council filed Critical Nat Science Council
Priority to TW85100145A priority Critical patent/TW280006B/zh
Application granted granted Critical
Publication of TW280006B publication Critical patent/TW280006B/zh

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Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Drying Of Semiconductors (AREA)
TW85100145A 1996-01-08 1996-01-08 Method of decreasing antenna charge effect caused by etching polysilicon gate TW280006B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW85100145A TW280006B (en) 1996-01-08 1996-01-08 Method of decreasing antenna charge effect caused by etching polysilicon gate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW85100145A TW280006B (en) 1996-01-08 1996-01-08 Method of decreasing antenna charge effect caused by etching polysilicon gate

Publications (1)

Publication Number Publication Date
TW280006B true TW280006B (en) 1996-07-01

Family

ID=51397560

Family Applications (1)

Application Number Title Priority Date Filing Date
TW85100145A TW280006B (en) 1996-01-08 1996-01-08 Method of decreasing antenna charge effect caused by etching polysilicon gate

Country Status (1)

Country Link
TW (1) TW280006B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6767838B1 (en) * 1998-02-13 2004-07-27 Hitachi, Ltd. Method and apparatus for treating surface of semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6767838B1 (en) * 1998-02-13 2004-07-27 Hitachi, Ltd. Method and apparatus for treating surface of semiconductor

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