TW274625B - - Google Patents

Info

Publication number
TW274625B
TW274625B TW084109462A TW84109462A TW274625B TW 274625 B TW274625 B TW 274625B TW 084109462 A TW084109462 A TW 084109462A TW 84109462 A TW84109462 A TW 84109462A TW 274625 B TW274625 B TW 274625B
Authority
TW
Taiwan
Application number
TW084109462A
Other languages
Chinese (zh)
Original Assignee
Hitachi Seisakusyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Seisakusyo Kk filed Critical Hitachi Seisakusyo Kk
Application granted granted Critical
Publication of TW274625B publication Critical patent/TW274625B/zh

Links

Classifications

    • H10P95/062—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW084109462A 1994-09-30 1995-09-11 TW274625B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23644594 1994-09-30

Publications (1)

Publication Number Publication Date
TW274625B true TW274625B (OSRAM) 1996-04-21

Family

ID=17000861

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084109462A TW274625B (OSRAM) 1994-09-30 1995-09-11

Country Status (3)

Country Link
US (4) US5772780A (OSRAM)
KR (1) KR100358588B1 (OSRAM)
TW (1) TW274625B (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109312213A (zh) * 2016-06-06 2019-02-05 富士胶片株式会社 研磨液、化学机械研磨方法

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WO2014171766A1 (ko) * 2013-04-17 2014-10-23 제일모직 주식회사 유기막 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마방법
TWI767788B (zh) 2016-06-24 2022-06-11 美商克若密斯股份有限公司 工程基板結構
JP2024505893A (ja) 2021-01-26 2024-02-08 シーエムシー マテリアルズ リミティド ライアビリティ カンパニー ホウ素ドープポリシリコンを研磨するための組成物及び方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109312213A (zh) * 2016-06-06 2019-02-05 富士胶片株式会社 研磨液、化学机械研磨方法

Also Published As

Publication number Publication date
US20020068452A1 (en) 2002-06-06
KR100358588B1 (ko) 2003-02-14
US6043155A (en) 2000-03-28
US7026245B2 (en) 2006-04-11
US5772780A (en) 1998-06-30
US20030203634A1 (en) 2003-10-30

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